[PATCH] thermal: Bind cooling devices with the correct arguments

[PATCH] thermal: Bind cooling devices with the correct arguments

[Punit Agrawal]

When binding cooling devices to thermal zones created from the device
tree the minimum and maximum cooling states are in the wrong order
leading to failure to bind.

Fix the order of cooling states in the call to
thermal_zone_bind_cooling_device to fix this.

Cc:Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
---
Hi Eduardo,

I am hoping this can be picked up for 3.16 as a bug fix.

Thanks,
Punit

 drivers/thermal/of-thermal.c |    4 ++--
 1 file changed, 2 insertions(+), 2 deletions(-)

diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
index 04b1be7..97d312f 100644
--- a/drivers/thermal/of-thermal.c
+++ b/drivers/thermal/of-thermal.c
@@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
 
 			ret = thermal_zone_bind_cooling_device(thermal,
 						tbp->trip_id, cdev,
-						tbp->min,
-						tbp->max);
+						tbp->max,
+						tbp->min);
 			if (ret)
 				return ret;
 		}
-- 
1.7.10.4

Re: [PATCH] thermal: Bind cooling devices with the correct arguments

[Punit Agrawal]

Ping?

Punit Agrawal <punit.agrawal@arm.com> writes:

> When binding cooling devices to thermal zones created from the device
> tree the minimum and maximum cooling states are in the wrong order
> leading to failure to bind.
>
> Fix the order of cooling states in the call to
> thermal_zone_bind_cooling_device to fix this.
>
> Cc:Zhang Rui <rui.zhang@intel.com>
> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
> ---
> Hi Eduardo,
>
> I am hoping this can be picked up for 3.16 as a bug fix.
>
> Thanks,
> Punit
>
>  drivers/thermal/of-thermal.c |    4 ++--
>  1 file changed, 2 insertions(+), 2 deletions(-)
>
> diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
> index 04b1be7..97d312f 100644
> --- a/drivers/thermal/of-thermal.c
> +++ b/drivers/thermal/of-thermal.c
> @@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
>  
>  			ret = thermal_zone_bind_cooling_device(thermal,
>  						tbp->trip_id, cdev,
> -						tbp->min,
> -						tbp->max);
> +						tbp->max,
> +						tbp->min);
>  			if (ret)
>  				return ret;
>  		}

Re: [PATCH] thermal: Bind cooling devices with the correct arguments

[Stephen Boyd]

On 06/17/14 03:20, Punit Agrawal wrote:
> Ping?
>
> Punit Agrawal <punit.agrawal@arm.com> writes:
>
>> When binding cooling devices to thermal zones created from the device
>> tree the minimum and maximum cooling states are in the wrong order
>> leading to failure to bind.
>>
>> Fix the order of cooling states in the call to
>> thermal_zone_bind_cooling_device to fix this.
>>
>> Cc:Zhang Rui <rui.zhang@intel.com>
>> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>

Ah I ran into the same problem while testing out some thermal DT stuff.

Reviewed-by: Stephen Boyd <sboyd@codeaurora.org>

-- 
Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum,
hosted by The Linux Foundation

Re: [PATCH] thermal: Bind cooling devices with the correct arguments

[Punit Agrawal]

Stephen Boyd <sboyd@codeaurora.org> writes:

> On 06/17/14 03:20, Punit Agrawal wrote:
>> Ping?
>>
>> Punit Agrawal <punit.agrawal@arm.com> writes:
>>
>>> When binding cooling devices to thermal zones created from the device
>>> tree the minimum and maximum cooling states are in the wrong order
>>> leading to failure to bind.
>>>
>>> Fix the order of cooling states in the call to
>>> thermal_zone_bind_cooling_device to fix this.
>>>
>>> Cc:Zhang Rui <rui.zhang@intel.com>
>>> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
>
> Ah I ran into the same problem while testing out some thermal DT stuff.
>
> Reviewed-by: Stephen Boyd <sboyd@codeaurora.org>

Thanks Stephen!

Rui, can you pick this patch?

Re: [PATCH] thermal: Bind cooling devices with the correct arguments

[edubezval]

Punit,

On Tue, Jun 3, 2014 at 5:59 AM, Punit Agrawal <punit.agrawal@arm.com> wrote:
> When binding cooling devices to thermal zones created from the device
> tree the minimum and maximum cooling states are in the wrong order
> leading to failure to bind.
>
> Fix the order of cooling states in the call to
> thermal_zone_bind_cooling_device to fix this.
>
> Cc:Zhang Rui <rui.zhang@intel.com>

Acked-by: Eduardo Valentin <edubezval@gmail.com>

Rui, to avoid further delays, can you please pick this one directly?

> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
> ---
> Hi Eduardo,
>
> I am hoping this can be picked up for 3.16 as a bug fix.
>
> Thanks,
> Punit
>
>  drivers/thermal/of-thermal.c |    4 ++--
>  1 file changed, 2 insertions(+), 2 deletions(-)
>
> diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
> index 04b1be7..97d312f 100644
> --- a/drivers/thermal/of-thermal.c
> +++ b/drivers/thermal/of-thermal.c
> @@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
>
>                         ret = thermal_zone_bind_cooling_device(thermal,
>                                                 tbp->trip_id, cdev,
> -                                               tbp->min,
> -                                               tbp->max);
> +                                               tbp->max,
> +                                               tbp->min);
>                         if (ret)
>                                 return ret;
>                 }
> --
> 1.7.10.4
>



-- 
Eduardo Bezerra Valentin