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From: Frank Lee <tiny.windzz@gmail.com>
To: Vasily Khoruzhick <anarsoul@gmail.com>
Cc: rui.zhang@intel.com, Eduardo Valentin <edubezval@gmail.com>,
	Daniel Lezcano <daniel.lezcano@linaro.org>,
	Rob Herring <robh+dt@kernel.org>,
	Mark Rutland <mark.rutland@arm.com>,
	Maxime Ripard <maxime.ripard@bootlin.com>,
	Chen-Yu Tsai <wens@csie.org>,
	"David S. Miller" <davem@davemloft.net>,
	Mauro Carvalho Chehab <mchehab+samsung@kernel.org>,
	Greg Kroah-Hartman <gregkh@linuxfoundation.org>,
	Linus Walleij <linus.walleij@linaro.org>,
	Nicolas Ferre <nicolas.ferre@microchip.com>,
	paulmck@linux.ibm.com, devicetree <devicetree@vger.kernel.org>,
	linux-kernel <linux-kernel@vger.kernel.org>,
	arm-linux <linux-arm-kernel@lists.infradead.org>,
	Linux PM <linux-pm@vger.kernel.org>
Subject: Re: [PATCH v3 1/3] thermal: sun8i: add thermal driver for h6
Date: Tue, 11 Jun 2019 08:31:25 +0800	[thread overview]
Message-ID: <CAEExFWtjNridLsMXOnBe2mJOPhUOYJ6G3wGF3gx=0oQoQROOGg@mail.gmail.com> (raw)
In-Reply-To: <CA+E=qVdh1E8Y7dZO0JSS4DJE2bo=98MuSKRt7nmeFg-td7Ua9Q@mail.gmail.com>

On Tue, Jun 11, 2019 at 7:29 AM Vasily Khoruzhick <anarsoul@gmail.com> wrote:
>
> On Sat, May 25, 2019 at 11:17 AM Yangtao Li <tiny.windzz@gmail.com> wrote:
> >
> > This patch adds the support for allwinner thermal sensor, within
> > allwinner SoC. It will register sensors for thermal framework
> > and use device tree to bind cooling device.
>
> Hi Yangtao,
>
> Any plans on v4 of this series?
>

I am waiting for comment from Maxime.

I’ll support both h3 and h6 in v4.

Yangtao

WARNING: multiple messages have this Message-ID (diff)
From: Frank Lee <tiny.windzz@gmail.com>
To: Vasily Khoruzhick <anarsoul@gmail.com>
Cc: Mark Rutland <mark.rutland@arm.com>,
	devicetree <devicetree@vger.kernel.org>,
	Linux PM <linux-pm@vger.kernel.org>,
	Maxime Ripard <maxime.ripard@bootlin.com>,
	Greg Kroah-Hartman <gregkh@linuxfoundation.org>,
	Linus Walleij <linus.walleij@linaro.org>,
	Daniel Lezcano <daniel.lezcano@linaro.org>,
	linux-kernel <linux-kernel@vger.kernel.org>,
	Eduardo Valentin <edubezval@gmail.com>,
	Chen-Yu Tsai <wens@csie.org>, Rob Herring <robh+dt@kernel.org>,
	Mauro Carvalho Chehab <mchehab+samsung@kernel.org>,
	rui.zhang@intel.com, paulmck@linux.ibm.com,
	"David S. Miller" <davem@davemloft.net>,
	arm-linux <linux-arm-kernel@lists.infradead.org>
Subject: Re: [PATCH v3 1/3] thermal: sun8i: add thermal driver for h6
Date: Tue, 11 Jun 2019 08:31:25 +0800	[thread overview]
Message-ID: <CAEExFWtjNridLsMXOnBe2mJOPhUOYJ6G3wGF3gx=0oQoQROOGg@mail.gmail.com> (raw)
In-Reply-To: <CA+E=qVdh1E8Y7dZO0JSS4DJE2bo=98MuSKRt7nmeFg-td7Ua9Q@mail.gmail.com>

On Tue, Jun 11, 2019 at 7:29 AM Vasily Khoruzhick <anarsoul@gmail.com> wrote:
>
> On Sat, May 25, 2019 at 11:17 AM Yangtao Li <tiny.windzz@gmail.com> wrote:
> >
> > This patch adds the support for allwinner thermal sensor, within
> > allwinner SoC. It will register sensors for thermal framework
> > and use device tree to bind cooling device.
>
> Hi Yangtao,
>
> Any plans on v4 of this series?
>

I am waiting for comment from Maxime.

I’ll support both h3 and h6 in v4.

Yangtao

_______________________________________________
linux-arm-kernel mailing list
linux-arm-kernel@lists.infradead.org
http://lists.infradead.org/mailman/listinfo/linux-arm-kernel

  reply	other threads:[~2019-06-11  0:31 UTC|newest]

Thread overview: 46+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2019-05-25 18:13 [PATCH v3 0/3] add thermal driver for h6 Yangtao Li
2019-05-25 18:13 ` Yangtao Li
2019-05-25 18:13 ` [PATCH v3 1/3] thermal: sun8i: " Yangtao Li
2019-05-25 18:13   ` Yangtao Li
2019-05-27 12:27   ` Maxime Ripard
2019-05-27 12:27     ` Maxime Ripard
2019-06-07 13:34     ` Frank Lee
2019-06-07 13:34       ` Frank Lee
2019-06-12 15:43       ` Maxime Ripard
2019-06-12 15:43         ` Maxime Ripard
2019-06-13 15:35         ` Frank Lee
2019-06-13 15:35           ` Frank Lee
2019-06-13 15:35           ` Frank Lee
2019-06-14  8:02           ` Maxime Ripard
2019-06-14  8:02             ` Maxime Ripard
2019-05-27 14:25   ` Ondřej Jirman
2019-05-27 14:25     ` Ondřej Jirman
2019-06-07 13:50     ` Frank Lee
2019-06-07 13:50       ` Frank Lee
2019-06-07 13:52       ` Frank Lee
2019-06-07 13:52         ` Frank Lee
2019-06-07 17:18       ` Ondřej Jirman
2019-06-07 17:18         ` Ondřej Jirman
2019-06-07 17:25         ` Ondřej Jirman
2019-06-07 17:25           ` Ondřej Jirman
2019-06-10 23:29   ` Vasily Khoruzhick
2019-06-10 23:29     ` Vasily Khoruzhick
2019-06-11  0:31     ` Frank Lee [this message]
2019-06-11  0:31       ` Frank Lee
2019-06-11  0:34       ` Vasily Khoruzhick
2019-06-11  0:34         ` Vasily Khoruzhick
2019-06-12 16:49         ` Frank Lee
2019-06-12 16:49           ` Frank Lee
2019-06-14 23:07           ` Vasily Khoruzhick
2019-06-14 23:07             ` Vasily Khoruzhick
2019-06-16 15:27             ` Frank Lee
2019-06-16 15:27               ` Frank Lee
2019-06-16 15:27               ` Frank Lee
2019-06-18 19:04             ` Frank Lee
2019-06-18 19:04               ` Frank Lee
2019-05-25 18:13 ` [PATCH v3 2/3] dt-bindings: thermal: add binding document for h6 thermal controller Yangtao Li
2019-05-25 18:13   ` Yangtao Li
2019-05-27 12:16   ` Maxime Ripard
2019-05-27 12:16     ` Maxime Ripard
2019-05-25 18:13 ` [PATCH v3 3/3] thermal: fix indentation in makefile Yangtao Li
2019-05-25 18:13   ` Yangtao Li

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