From: leo.yan@linaro.org (Leo Yan)
To: linux-arm-kernel@lists.infradead.org
Subject: [PATCH 1/3] thermal: hisilicon: add new hisilicon thermal sensor driver
Date: Mon, 23 Mar 2015 12:46:12 +0800 [thread overview]
Message-ID: <20150323044612.GB20840@leoy-linaro> (raw)
In-Reply-To: <20150320155527.GJ14766@leverpostej>
On Fri, Mar 20, 2015 at 03:55:27PM +0000, Mark Rutland wrote:
> > > That may be the case in the code as it stands today, but per the binding
> > > the trip points are the temperatures at which an action is to be taken.
> > >
> > > The thermal-zone has poilling-delay and polling-delay-passive, but
> > > there's no reason you couldn't also use the interrupt to handle the
> > > "hot" trip-point, adn the reset at the "critical" trip-point. All that's
> > > missing is the plumbing in order to do so.
> > >
> > > So please co-ordinate with the thermal framework to do that.
> >
> > Let's dig further more for this point, so that we can get more specific
> > gudiance and have a good preparation for next version's patch set.
> >
> > After i reviewed the thermal framework code, currently have one smooth
> > way to co-ordinate the trip points w/t thermal framework: use the function
> > *thermal_zone_device_register()* to register sensor, and can use the
> > callback function .get_trip_temp to tell thermal framework for the
> > trip points' temperature.
> >
> > For hisi thermal case, now the driver is using the function
> > *thermal_zone_of_sensor_register* to register sensor, but use this way
> > i have not found there have standard APIs which can be used by sensor
> > driver to get the trip points info from thermal framework.
> >
> > I may miss something for thermal framework, so if have existed APIs to
> > get the trip points, could pls point out?
>
> I am only familiar with the binding, not the Linux implementation -- The
> latter can change to accomodate your hardware without requiring binding
> changes. Please co-ordinate with the thermal maintainers.
Found the functions of_thermal_get_trip_points(tz) and of_thermal_get_ntrips(tz)
will help for this.
> > > > > > + if (of_property_read_bool(np, "hisilicon,tsensor-bind-irq")) {
> > > > > > +
> > > > > > + if (data->irq_bind_sensor != -1)
> > > > > > + dev_warn(&pdev->dev, "irq has bound to index %d\n",
> > > > > > + data->irq_bind_sensor);
> > > > > > +
> > > > > > + /* bind irq to this sensor */
> > > > > > + data->irq_bind_sensor = index;
> > > > > > + }
> > > > >
> > > > > I don't see why this should be specified in the DT. Why do you believe
> > > > > it should?
> > > >
> > > > The thermal sensor module has four sensors, but have only one
> > > > interrupt signal; This interrupt can only be used by one sensor;
> > > > So want to use dts to bind the interrupt with one selected sensor.
> > >
> > > That's not all that great, though I'm not exactly sure how the kernel
> > > would select the best sensor to measure with. It would be good if you
> > > could talk to the thermal maintainers w.r.t. this.
> >
> > This will be decided by the silicon, right? Every soc has different
> > combination with cpu/gpu/vpu, so which part is hottest, this maybe
> > highly dependent on individual SoC.
> >
> > S/W just need provide the flexibility so that later can choose
> > the interrupt to bind with the sensor within the hottest part.
>
> Then the property you care about is which sensor is closest to what is
> likely to be the hottest component. Given that, the kernel can decide
> how to use the interrupt.
Will modify the driver to dynamically bind the interrupt to hottest
sensor; Appreciate for good suggestion.
Thanks,
Leo Yan
next prev parent reply other threads:[~2015-03-23 4:46 UTC|newest]
Thread overview: 18+ messages / expand[flat|nested] mbox.gz Atom feed top
2015-03-19 7:57 [PATCH 0/3] 96boards: add thermal senor support to hikey board kongxinwei
2015-03-19 7:57 ` [PATCH 1/3] thermal: hisilicon: add new hisilicon thermal sensor driver kongxinwei
2015-03-19 14:17 ` Mark Rutland
2015-03-20 6:06 ` Leo Yan
2015-03-20 11:24 ` Mark Rutland
2015-03-20 14:53 ` Leo Yan
2015-03-20 15:55 ` Mark Rutland
2015-03-23 4:46 ` Leo Yan [this message]
2015-03-23 8:30 ` kongxinwei
2015-03-20 15:27 ` Xinwei Kong
2015-03-20 7:37 ` kongxinwei
2015-03-19 7:57 ` [PATCH 2/3] dts: hi6220: enable thermal sensor for hisilicon SoC kongxinwei
2015-03-19 7:57 ` [PATCH 3/3] dt-bindings: Document the hi6220 thermal sensor bindings kongxinwei
2015-03-19 14:08 ` Mark Rutland
2015-03-19 13:59 ` [PATCH 0/3] 96boards: add thermal senor support to hikey board Mark Rutland
2015-03-20 3:10 ` kongxinwei
2015-03-20 6:13 ` Leo Yan
2015-03-20 7:41 ` kongxinwei
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