From: xweikong@hotmail.com (kongxinwei)
To: linux-arm-kernel@lists.infradead.org
Subject: [PATCH 1/3] thermal: hisilicon: add new hisilicon thermal sensor driver
Date: Mon, 23 Mar 2015 16:30:59 +0800 [thread overview]
Message-ID: <BLU436-SMTP68AF510203FB039DA92B6CC10D0@phx.gbl> (raw)
In-Reply-To: <20150323044612.GB20840@leoy-linaro>
On 03/23/2015 12:46 PM, Leo Yan wrote:
> On Fri, Mar 20, 2015 at 03:55:27PM +0000, Mark Rutland wrote:
>>>> That may be the case in the code as it stands today, but per the binding
>>>> the trip points are the temperatures at which an action is to be taken.
>>>>
>>>> The thermal-zone has poilling-delay and polling-delay-passive, but
>>>> there's no reason you couldn't also use the interrupt to handle the
>>>> "hot" trip-point, adn the reset at the "critical" trip-point. All that's
>>>> missing is the plumbing in order to do so.
>>>>
>>>> So please co-ordinate with the thermal framework to do that.
>>> Let's dig further more for this point, so that we can get more specific
>>> gudiance and have a good preparation for next version's patch set.
>>>
>>> After i reviewed the thermal framework code, currently have one smooth
>>> way to co-ordinate the trip points w/t thermal framework: use the function
>>> *thermal_zone_device_register()* to register sensor, and can use the
>>> callback function .get_trip_temp to tell thermal framework for the
>>> trip points' temperature.
>>>
>>> For hisi thermal case, now the driver is using the function
>>> *thermal_zone_of_sensor_register* to register sensor, but use this way
>>> i have not found there have standard APIs which can be used by sensor
>>> driver to get the trip points info from thermal framework.
>>>
>>> I may miss something for thermal framework, so if have existed APIs to
>>> get the trip points, could pls point out?
>> I am only familiar with the binding, not the Linux implementation -- The
>> latter can change to accomodate your hardware without requiring binding
>> changes. Please co-ordinate with the thermal maintainers.
> Found the functions of_thermal_get_trip_points(tz) and of_thermal_get_ntrips(tz)
> will help for this.
>
>>>>>>> + if (of_property_read_bool(np, "hisilicon,tsensor-bind-irq")) {
>>>>>>> +
>>>>>>> + if (data->irq_bind_sensor != -1)
>>>>>>> + dev_warn(&pdev->dev, "irq has bound to index %d\n",
>>>>>>> + data->irq_bind_sensor);
>>>>>>> +
>>>>>>> + /* bind irq to this sensor */
>>>>>>> + data->irq_bind_sensor = index;
>>>>>>> + }
>>>>>> I don't see why this should be specified in the DT. Why do you believe
>>>>>> it should?
>>>>> The thermal sensor module has four sensors, but have only one
>>>>> interrupt signal; This interrupt can only be used by one sensor;
>>>>> So want to use dts to bind the interrupt with one selected sensor.
>>>> That's not all that great, though I'm not exactly sure how the kernel
>>>> would select the best sensor to measure with. It would be good if you
>>>> could talk to the thermal maintainers w.r.t. this.
>>> This will be decided by the silicon, right? Every soc has different
>>> combination with cpu/gpu/vpu, so which part is hottest, this maybe
>>> highly dependent on individual SoC.
>>>
>>> S/W just need provide the flexibility so that later can choose
>>> the interrupt to bind with the sensor within the hottest part.
>> Then the property you care about is which sensor is closest to what is
>> likely to be the hottest component. Given that, the kernel can decide
>> how to use the interrupt.
> Will modify the driver to dynamically bind the interrupt to hottest
> sensor; Appreciate for good suggestion.
>
> Thanks,
> Leo Yan
Hi mark:
Thank you for your comments,please wait the next version to slove your
presenting problem.
Thanks.
Xinwei
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next prev parent reply other threads:[~2015-03-23 8:30 UTC|newest]
Thread overview: 18+ messages / expand[flat|nested] mbox.gz Atom feed top
2015-03-19 7:57 [PATCH 0/3] 96boards: add thermal senor support to hikey board kongxinwei
2015-03-19 7:57 ` [PATCH 1/3] thermal: hisilicon: add new hisilicon thermal sensor driver kongxinwei
2015-03-19 14:17 ` Mark Rutland
2015-03-20 6:06 ` Leo Yan
2015-03-20 11:24 ` Mark Rutland
2015-03-20 14:53 ` Leo Yan
2015-03-20 15:55 ` Mark Rutland
2015-03-23 4:46 ` Leo Yan
2015-03-23 8:30 ` kongxinwei [this message]
2015-03-20 15:27 ` Xinwei Kong
2015-03-20 7:37 ` kongxinwei
2015-03-19 7:57 ` [PATCH 2/3] dts: hi6220: enable thermal sensor for hisilicon SoC kongxinwei
2015-03-19 7:57 ` [PATCH 3/3] dt-bindings: Document the hi6220 thermal sensor bindings kongxinwei
2015-03-19 14:08 ` Mark Rutland
2015-03-19 13:59 ` [PATCH 0/3] 96boards: add thermal senor support to hikey board Mark Rutland
2015-03-20 3:10 ` kongxinwei
2015-03-20 6:13 ` Leo Yan
2015-03-20 7:41 ` kongxinwei
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