From: Daniel Lezcano <daniel.lezcano@linaro.org>
To: Zhou Wang <wangzhou1@hisilicon.com>
Cc: Amit Kucheria <amit.kucheria@verdurent.com>,
"shenyang (M)" <shenyang39@huawei.com>,
Zhang Rui <rui.zhang@intel.com>,
Linux PM list <linux-pm@vger.kernel.org>,
linuxarm@huawei.com
Subject: Re: [PATCH V3 2/2] thermal: Add HiSilicon Kunpeng thermal driver
Date: Fri, 15 May 2020 20:29:42 +0200 [thread overview]
Message-ID: <20200515182942.GB760381@linaro.org> (raw)
In-Reply-To: <5EBD42BA.7070008@hisilicon.com>
On Thu, May 14, 2020 at 09:08:10PM +0800, Zhou Wang wrote:
> On 2020/5/13 20:45, Amit Kucheria wrote:
> > On Mon, May 11, 2020 at 1:44 PM Daniel Lezcano
> > <daniel.lezcano@linaro.org> wrote:
[ ... ]
> > They're simply using the thermal framework to show some temperatures
> > in sysfs. It seems they have no use for any of the other features of
> > the thermal framework, all that is handled in ACPI firmware.
>
> This driver is ACPI based.
>
> >
> > I do wonder if such drivers would be better off registering a hwmon
> > driver instead.
>
> If this driver is registering as a hwmon driver, it will block possible
> usages of other thermal features in the future.
>
> So as a new driver, we would like to register to thermal subsystem :)
When I did the first comments, I missed the point of the ACPI aspect but the
main concern remains, especially in regard with the "features in the future".
Please, do not aggregate the sensors in the driver. Make them separate to give
the real view of the system.
The aggregation aspect is still under discussion (virtual sensor or virtual
thermal zone).
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next prev parent reply other threads:[~2020-05-15 18:29 UTC|newest]
Thread overview: 15+ messages / expand[flat|nested] mbox.gz Atom feed top
2020-04-21 7:44 [PATCH V3 0/2] thermal:Add HiSilicon Kunpeng thermal driver and Maintainers Yang Shen
2020-04-21 7:44 ` [PATCH V3 1/2] MAINTAINERS: Add maintainers for kunpeng thermal Yang Shen
2020-04-21 7:44 ` [PATCH V3 2/2] thermal: Add HiSilicon Kunpeng thermal driver Yang Shen
2020-04-27 12:13 ` Daniel Lezcano
2020-04-28 11:58 ` shenyang (M)
2020-04-28 14:02 ` Daniel Lezcano
2020-05-09 7:35 ` Zhou Wang
2020-05-10 5:04 ` Daniel Lezcano
2020-05-11 1:26 ` Zhou Wang
2020-05-11 8:14 ` Daniel Lezcano
2020-05-13 8:12 ` Zhou Wang
2020-05-13 12:45 ` Amit Kucheria
2020-05-14 13:08 ` Zhou Wang
2020-05-15 18:29 ` Daniel Lezcano [this message]
2020-04-27 8:36 ` [PATCH V3 0/2] thermal:Add HiSilicon Kunpeng thermal driver and Maintainers shenyang (M)
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