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* [PATCH v3 0/6] thermal: qcom: tsens: Fix MDM9607, add MSM8909
@ 2023-03-15 10:39 Stephan Gerhold
  2023-03-15 10:39 ` [PATCH v3 1/6] thermal: qcom: tsens: Drop unused legacy structs Stephan Gerhold
                   ` (5 more replies)
  0 siblings, 6 replies; 15+ messages in thread
From: Stephan Gerhold @ 2023-03-15 10:39 UTC (permalink / raw)
  To: Daniel Lezcano, Rafael J. Wysocki
  Cc: Amit Kucheria, Thara Gopinath, Zhang Rui, Rob Herring,
	Krzysztof Kozlowski, Bjorn Andersson, Andy Gross, Konrad Dybcio,
	Dmitry Baryshkov, linux-arm-msm, linux-pm, devicetree,
	Stephan Gerhold, Stephan Gerhold

Make the MDM9607 thermal sensor support consistent with Qualcomm's
vendor kernel (msm-3.18) by applying the correct default slope values
and adding "correction factors" to the factory calibration values in the
fuses. Use the same functionality to add the very similar MSM8909 SoC to
the tsens driver.

---
Changes in v3: Drop now unused definition reported by kernel test robot
Changes in v2:
  - Rewrite on top of per-sensor nvmem cell changes that landed in 6.3
  - Add patches to fix existing support for MDM9607

Stephan Gerhold (6):
  thermal: qcom: tsens: Drop unused legacy structs
  thermal: qcom: tsens-v0_1: Fix mdm9607 slope values
  thermal: qcom: tsens-v0_1: Add mdm9607 correction offsets
  dt-bindings: thermal: qcom-tsens: Drop redundant compatibles
  dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible
  thermal: qcom: tsens-v0_1: Add MSM8909 data

 .../bindings/thermal/qcom-tsens.yaml          | 23 +----
 drivers/thermal/qcom/tsens-v0_1.c             | 95 +++++++++++--------
 drivers/thermal/qcom/tsens-v1.c               | 22 -----
 drivers/thermal/qcom/tsens.c                  | 19 +++-
 drivers/thermal/qcom/tsens.h                  |  6 +-
 5 files changed, 80 insertions(+), 85 deletions(-)

-- 
2.30.2


^ permalink raw reply	[flat|nested] 15+ messages in thread

end of thread, other threads:[~2023-03-18 16:12 UTC | newest]

Thread overview: 15+ messages (download: mbox.gz / follow: Atom feed)
-- links below jump to the message on this page --
2023-03-15 10:39 [PATCH v3 0/6] thermal: qcom: tsens: Fix MDM9607, add MSM8909 Stephan Gerhold
2023-03-15 10:39 ` [PATCH v3 1/6] thermal: qcom: tsens: Drop unused legacy structs Stephan Gerhold
2023-03-17  0:34   ` Konrad Dybcio
2023-03-15 10:39 ` [PATCH v3 2/6] thermal: qcom: tsens-v0_1: Fix mdm9607 slope values Stephan Gerhold
2023-03-17  0:39   ` Konrad Dybcio
2023-03-17 15:07     ` Stephan Gerhold
2023-03-17 17:37       ` Konrad Dybcio
2023-03-18 16:00         ` Stephan Gerhold
2023-03-15 10:39 ` [PATCH v3 3/6] thermal: qcom: tsens-v0_1: Add mdm9607 correction offsets Stephan Gerhold
2023-03-18 14:02   ` Konrad Dybcio
2023-03-18 16:06     ` Stephan Gerhold
2023-03-15 10:39 ` [PATCH v3 4/6] dt-bindings: thermal: qcom-tsens: Drop redundant compatibles Stephan Gerhold
2023-03-15 10:39 ` [PATCH v3 5/6] dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible Stephan Gerhold
2023-03-15 10:39 ` [PATCH v3 6/6] thermal: qcom: tsens-v0_1: Add MSM8909 data Stephan Gerhold
2023-03-18 14:01   ` Konrad Dybcio

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