linux-kernel.vger.kernel.org archive mirror
 help / color / mirror / Atom feed
From: Eduardo Valentin <edubezval@gmail.com>
To: Rui Zhang <rui.zhang@intel.com>,
	ezequiel.garcia@free-electrons.com, amit.kachhap@linaro.org,
	viresh.kumar@linaro.org, amit.daniel@samsung.com,
	hongbo.zhang@linaro.com, andrew@lunn.ch, durgadoss.r@intel.com,
	peter@piie.net, shawn.guo@linaro.org, aaron.lu@intel.com,
	caesar.wang@rock-chips.com, b.zolnierkie@samsung.com,
	l.majewski@samsung.com, vincenzo.frascino@st.com,
	mperttunen@nvidia.com, mikko.perttunen@kapsi.fi,
	srinivas.pandruvada@linux.intel.com,
	jacob.jun.pan@linux.intel.com, bcousson@baylibre.com
Cc: LKML <linux-kernel@vger.kernel.org>,
	Linux PM <linux-pm@vger.kernel.org>,
	Eduardo Valentin <edubezval@gmail.com>
Subject: [PATCH RFC 02/12] Documentation: thermal docbook: add glossary
Date: Mon,  9 Feb 2015 17:34:03 -0400	[thread overview]
Message-ID: <1423517653-11359-3-git-send-email-edubezval@gmail.com> (raw)
In-Reply-To: <1423517653-11359-1-git-send-email-edubezval@gmail.com>

This change introduces a section in the Introduction Chapter to
list concepts used by the Thermal Framework.

Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
---
 Documentation/DocBook/thermal.tmpl | 129 ++++++++++++++++++++++++++++++++++++-
 1 file changed, 128 insertions(+), 1 deletion(-)

diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl
index f8fb8a2..66efed3 100644
--- a/Documentation/DocBook/thermal.tmpl
+++ b/Documentation/DocBook/thermal.tmpl
@@ -84,5 +84,132 @@
 		devices.
 		</para>
 
-  </chapter>
+		<sect1 id="glossary">
+			<title>Glossary</title>
+			<para>The Linux Kernel Thermal Framework  uses a
+			specific terminology to represent the entities involved
+			in thermal constrained environments. This section
+			summaries the terminology as dictionary. These terms are
+			in use within the present document and in the source
+			code of the Linux Kernel Thermal Framework.
+			</para>
+			<glossary>
+				<glossentry>
+					<glossterm>Thermal Zone</glossterm>
+					<glossdef>
+						<para>Thermal zones represent
+						what is the current status of a
+						thermal constrained zone in the
+						hardware. The zone usually is a
+						device or component. The status
+						of a thermal zone is mainly with
+						respect to temperature.
+						Currently, the Linux Kernel
+						Thermal Framework represents
+						temperature in miliCelsius. The
+						current abstraction covers for
+						non negative temperatures and
+						constraints.
+						</para>
+					</glossdef>
+				</glossentry>
+				<glossentry>
+					<glossterm>Thermal Sensors</glossterm>
+					<glossdef>
+						<para>Thermal sensors provide
+						temperature sensing capabilities
+						on thermal zones. Typical
+						devices are I2C ADC converters
+						and bandgaps. These are nodes
+						providing temperature data to
+						thermal zones. Thermal sensor
+						devices may control one or more
+						internal sensors.
+						</para>
+					</glossdef>
+				</glossentry>
+				<glossentry>
+					<glossterm>Trips Points</glossterm>
+					<glossdef>
+						<para>The trip node describes a
+						point in the temperature domain
+						in which the system takes an
+						action. This item describes just
+						the point, not the action. Trip
+						points are represented as
+						temperature in miliCelsius. The
+						current abstraction covers for
+						non negative temperatures.
+						</para>
+					</glossdef>
+				</glossentry>
+				<glossentry>
+					<glossterm>Thermal Governor</glossterm>
+					<glossdef>
+						<para>Thermal Governors
+						represent a policy to manage the
+						thermal zone device temperature.
+						The governor targets to keep
+						temperature in an acceptable
+						range which correlates to the
+						power budget, while maximizing
+						the performance. Governors can
+						be implemented in Kernel Space
+						or in User Space.
+						</para>
+					</glossdef>
+				</glossentry>
+				<glossentry>
+					<glossterm>Thermal Cooling Device</glossterm>
+					<glossdef>
+						<para>Cooling devices provide
+						control on power dissipation.
+						There are essentially two ways
+						to provide control on power
+						dissipation. First is by means
+						of regulating device
+						performance, which is known as
+						passive cooling. A typical
+						passive cooling is a CPU that
+						has dynamic voltage and
+						frequency scaling (DVFS), and
+						uses lower frequencies as
+						cooling states. Second is by
+						means of activating devices in
+						order to remove the dissipated
+						heat, which is known as active
+						cooling, e.g. regulating fan
+						speeds. In both cases, cooling
+						devices shall have a way to
+						determine the state of cooling
+						in which the device is.
+				</para>
+					</glossdef>
+				</glossentry>
+				<glossentry>
+					<glossterm>Cooling State</glossterm>
+					<glossdef>
+						<para>Any cooling device has a
+						range of cooling states (i.e.
+						different levels of heat
+						dissipation). For example a
+						fan's cooling states correspond
+						to the different fan speeds
+						possible. Cooling states are
+						referred to by single unsigned
+						integers, where larger numbers
+						mean greater heat dissipation.
+						The precise set of cooling
+						states associated with a device
+						(as referred to be the
+						cooling-min-state and
+						cooling-max-state properties)
+						should be defined in a
+						particular device's binding.
+						</para>
+					</glossdef>
+				</glossentry>
+			</glossary>
+		</sect1>
+	</chapter>
 </book>
-- 
2.1.3


  parent reply	other threads:[~2015-02-10  0:37 UTC|newest]

Thread overview: 24+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2015-02-09 21:34 [PATCH RFC 00/12] The Linux Kernel Thermal Framework Docbook Eduardo Valentin
2015-02-09 21:34 ` [PATCH RFC 01/12] Documentation: Introduce Linux Kernel Thermal Framework DocBook Eduardo Valentin
2015-02-10 22:50   ` Randy Dunlap
2015-02-16 15:17     ` Eduardo Valentin
2015-02-18 11:13   ` Javi Merino
2015-02-09 21:34 ` Eduardo Valentin [this message]
2015-02-10 22:50   ` [PATCH RFC 02/12] Documentation: thermal docbook: add glossary Randy Dunlap
2015-02-16 15:19     ` Eduardo Valentin
2015-02-16 13:01   ` Mikko Perttunen
2015-02-17  3:22     ` Eduardo Valentin
2015-02-18 11:52   ` Javi Merino
2015-02-18 16:58     ` Srinivas Pandruvada
2015-02-17  3:27       ` Eduardo Valentin
2015-02-09 21:34 ` [PATCH RFC 03/12] thermal: cpu_cooling: remove duplicate documentation entries Eduardo Valentin
2015-02-09 21:34 ` [PATCH RFC 04/12] thermal: of-thermal: remove kernel doc warn Eduardo Valentin
2015-02-09 21:34 ` [PATCH RFC 05/12] thermal: thermal.h: minor kernel doc fix Eduardo Valentin
2015-02-09 21:34 ` [PATCH RFC 06/12] thermal: thermal_core: correct kernel doc wording on thermal_zone_get_temp Eduardo Valentin
2015-02-09 21:34 ` [PATCH RFC 07/12] Documentation: thermal docbook: introduce API reference chapter Eduardo Valentin
2015-02-09 21:34 ` [PATCH RFC 08/12] thermal: fair share: fix kernel doc entry Eduardo Valentin
2015-02-09 21:34 ` [PATCH RFC 09/12] thermal: user space: " Eduardo Valentin
2015-02-09 21:34 ` [PATCH RFC 10/12] thermal: bang bang: " Eduardo Valentin
2015-02-09 21:34 ` [PATCH RFC 11/12] thermal: step wise: " Eduardo Valentin
2015-02-09 21:34 ` [PATCH RFC 12/12] Documentation: thermal docbook: introduce governor chapter Eduardo Valentin
2015-02-18 16:21   ` Javi Merino

Reply instructions:

You may reply publicly to this message via plain-text email
using any one of the following methods:

* Save the following mbox file, import it into your mail client,
  and reply-to-all from there: mbox

  Avoid top-posting and favor interleaved quoting:
  https://en.wikipedia.org/wiki/Posting_style#Interleaved_style

* Reply using the --to, --cc, and --in-reply-to
  switches of git-send-email(1):

  git send-email \
    --in-reply-to=1423517653-11359-3-git-send-email-edubezval@gmail.com \
    --to=edubezval@gmail.com \
    --cc=aaron.lu@intel.com \
    --cc=amit.daniel@samsung.com \
    --cc=amit.kachhap@linaro.org \
    --cc=andrew@lunn.ch \
    --cc=b.zolnierkie@samsung.com \
    --cc=bcousson@baylibre.com \
    --cc=caesar.wang@rock-chips.com \
    --cc=durgadoss.r@intel.com \
    --cc=ezequiel.garcia@free-electrons.com \
    --cc=hongbo.zhang@linaro.com \
    --cc=jacob.jun.pan@linux.intel.com \
    --cc=l.majewski@samsung.com \
    --cc=linux-kernel@vger.kernel.org \
    --cc=linux-pm@vger.kernel.org \
    --cc=mikko.perttunen@kapsi.fi \
    --cc=mperttunen@nvidia.com \
    --cc=peter@piie.net \
    --cc=rui.zhang@intel.com \
    --cc=shawn.guo@linaro.org \
    --cc=srinivas.pandruvada@linux.intel.com \
    --cc=vincenzo.frascino@st.com \
    --cc=viresh.kumar@linaro.org \
    /path/to/YOUR_REPLY

  https://kernel.org/pub/software/scm/git/docs/git-send-email.html

* If your mail client supports setting the In-Reply-To header
  via mailto: links, try the mailto: link
Be sure your reply has a Subject: header at the top and a blank line before the message body.
This is a public inbox, see mirroring instructions
for how to clone and mirror all data and code used for this inbox;
as well as URLs for NNTP newsgroup(s).