* [PATCH -next] thermal: thermal_of: Correct struct name __thermal_bind_params
@ 2021-05-18 13:14 Yang Yingliang
0 siblings, 0 replies; only message in thread
From: Yang Yingliang @ 2021-05-18 13:14 UTC (permalink / raw)
To: linux-kernel, linux-pm; +Cc: amitk, daniel.lezcano
Fix the following make W=1 kernel build warning:
drivers/thermal/thermal_of.c:50: warning: expecting prototype for struct __thermal_bind_param. Prototype was for struct __thermal_bind_params instead
Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
---
drivers/thermal/thermal_of.c | 2 +-
1 file changed, 1 insertion(+), 1 deletion(-)
diff --git a/drivers/thermal/thermal_of.c b/drivers/thermal/thermal_of.c
index 5b76f9a1280d..e86389fa1431 100644
--- a/drivers/thermal/thermal_of.c
+++ b/drivers/thermal/thermal_of.c
@@ -35,7 +35,7 @@ struct __thermal_cooling_bind_param {
};
/**
- * struct __thermal_bind_param - a match between trip and cooling device
+ * struct __thermal_bind_params - a match between trip and cooling device
* @tcbp: a pointer to an array of cooling devices
* @count: number of elements in array
* @trip_id: the trip point index
--
2.25.1
^ permalink raw reply related [flat|nested] only message in thread
only message in thread, other threads:[~2021-05-18 13:12 UTC | newest]
Thread overview: (only message) (download: mbox.gz / follow: Atom feed)
-- links below jump to the message on this page --
2021-05-18 13:14 [PATCH -next] thermal: thermal_of: Correct struct name __thermal_bind_params Yang Yingliang
This is a public inbox, see mirroring instructions
for how to clone and mirror all data and code used for this inbox;
as well as URLs for NNTP newsgroup(s).