From: Len Brown <lenb@kernel.org>
To: x86@kernel.org
Cc: linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
Len Brown <len.brown@intel.com>,
linux-pm@vger.kernel.org, linux-hwmon@vger.kernel.org
Subject: [PATCH 13/22] hwmon/coretemp: Support multi-die/package
Date: Mon, 6 May 2019 17:26:08 -0400 [thread overview]
Message-ID: <75731eb53db844af1559aa92f257cb9ca8c2a70a.1557177585.git.len.brown@intel.com> (raw)
In-Reply-To: <6f53f0e494d743c79e18f6e3a98085711e6ddd0c.1557177585.git.len.brown@intel.com>
From: Zhang Rui <rui.zhang@intel.com>
Package temperature sensors are actually implemented in hardware per-die.
Update coretemp to be "die-aware", so it can expose mulitple sensors
per package, instead of just one. No change to single-die/package
systems.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Cc: linux-pm@vger.kernel.org
Cc: linux-hwmon@vger.kernel.org
---
drivers/hwmon/coretemp.c | 8 ++++----
1 file changed, 4 insertions(+), 4 deletions(-)
diff --git a/drivers/hwmon/coretemp.c b/drivers/hwmon/coretemp.c
index 5d34f7271e67..c64ce32d3214 100644
--- a/drivers/hwmon/coretemp.c
+++ b/drivers/hwmon/coretemp.c
@@ -435,7 +435,7 @@ static int chk_ucode_version(unsigned int cpu)
static struct platform_device *coretemp_get_pdev(unsigned int cpu)
{
- int pkgid = topology_logical_package_id(cpu);
+ int pkgid = topology_logical_die_id(cpu);
if (pkgid >= 0 && pkgid < max_packages)
return pkg_devices[pkgid];
@@ -579,7 +579,7 @@ static struct platform_driver coretemp_driver = {
static struct platform_device *coretemp_device_add(unsigned int cpu)
{
- int err, pkgid = topology_logical_package_id(cpu);
+ int err, pkgid = topology_logical_die_id(cpu);
struct platform_device *pdev;
if (pkgid < 0)
@@ -703,7 +703,7 @@ static int coretemp_cpu_offline(unsigned int cpu)
* the rest.
*/
if (cpumask_empty(&pd->cpumask)) {
- pkg_devices[topology_logical_package_id(cpu)] = NULL;
+ pkg_devices[topology_logical_die_id(cpu)] = NULL;
platform_device_unregister(pdev);
return 0;
}
@@ -741,7 +741,7 @@ static int __init coretemp_init(void)
if (!x86_match_cpu(coretemp_ids))
return -ENODEV;
- max_packages = topology_max_packages();
+ max_packages = topology_max_packages() * topology_max_die_per_package();
pkg_devices = kcalloc(max_packages, sizeof(struct platform_device *),
GFP_KERNEL);
if (!pkg_devices)
--
2.18.0-rc0
next prev parent reply other threads:[~2019-05-06 21:27 UTC|newest]
Thread overview: 33+ messages / expand[flat|nested] mbox.gz Atom feed top
2019-05-06 21:25 [PATCH 0/22] v5 multi-die/package topology support Len Brown
2019-05-06 21:25 ` [PATCH 01/22] x86 topology: Fix doc typo Len Brown
2019-05-06 21:25 ` [PATCH 02/22] topology: Simplify cputopology.txt formatting and wording Len Brown
2019-05-06 21:25 ` [PATCH 03/22] x86 smpboot: Rename match_die() to match_pkg() Len Brown
2019-05-06 21:25 ` [PATCH 04/22] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-05-06 21:26 ` [PATCH 05/22] x86 topology: Create topology_max_die_per_package() Len Brown
2019-05-06 21:26 ` [PATCH 06/22] cpu topology: Export die_id Len Brown
2019-05-06 21:26 ` [PATCH 07/22] x86 topology: Define topology_die_id() Len Brown
2019-05-06 21:26 ` [PATCH 08/22] x86 topology: Define topology_logical_die_id() Len Brown
2019-05-06 21:26 ` [PATCH 09/22] powercap/intel_rapl: Simplify rapl_find_package() Len Brown
2019-05-06 21:26 ` [PATCH 10/22] powercap/intel_rapl: Support multi-die/package Len Brown
2019-05-07 12:14 ` Peter Zijlstra
2019-05-08 19:45 ` Len Brown
2019-05-06 21:26 ` [PATCH 11/22] thermal/x86_pkg_temp_thermal: " Len Brown
2019-05-06 21:26 ` [PATCH 12/22] powercap/intel_rapl: update rapl domain name and debug messages Len Brown
2019-05-06 21:26 ` Len Brown [this message]
2019-05-06 21:26 ` [PATCH 14/22] topology: Create package_cpus sysfs attribute Len Brown
2019-05-06 21:26 ` [PATCH 15/22] topology: Create core_cpus and die_cpus sysfs attributes Len Brown
2019-05-06 21:26 ` [PATCH 16/22] perf/x86/intel/uncore: Support multi-die/package Len Brown
2019-05-07 12:21 ` Peter Zijlstra
2019-05-08 19:51 ` Len Brown
2019-05-07 12:22 ` Peter Zijlstra
2019-05-08 19:51 ` Len Brown
2019-05-06 21:26 ` [PATCH 17/22] perf/x86/intel/rapl: " Len Brown
2019-05-06 21:26 ` [PATCH 18/22] perf/x86/intel/cstate: " Len Brown
2019-05-06 21:26 ` [PATCH 19/22] thermal/x86_pkg_temp_thermal: rename internal variables to zones from packages Len Brown
2019-05-06 21:26 ` [PATCH 20/22] hwmon/coretemp: " Len Brown
2019-05-06 21:26 ` [PATCH 21/22] perf/x86/intel/uncore: renames in response to multi-die/pkg support Len Brown
2019-05-09 15:02 ` Liang, Kan
2019-05-13 17:30 ` Len Brown
2019-05-06 21:26 ` [PATCH 22/22] perf/x86/intel/rapl: rename internal variables " Len Brown
2019-05-09 15:04 ` Liang, Kan
2019-05-13 17:29 ` Len Brown
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