From: Len Brown <lenb@kernel.org>
To: x86@kernel.org
Cc: linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
Len Brown <len.brown@intel.com>
Subject: [PATCH 11/22] thermal/x86_pkg_temp_thermal: Support multi-die/package
Date: Mon, 6 May 2019 17:26:06 -0400 [thread overview]
Message-ID: <e6a6fcd9ad6a1cb8da31d467277dd519eecdbd31.1557177585.git.len.brown@intel.com> (raw)
In-Reply-To: <6f53f0e494d743c79e18f6e3a98085711e6ddd0c.1557177585.git.len.brown@intel.com>
From: Zhang Rui <rui.zhang@intel.com>
Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.
Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can
expose multiple zones per package, instead of just one.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
---
drivers/thermal/intel/x86_pkg_temp_thermal.c | 8 ++++----
1 file changed, 4 insertions(+), 4 deletions(-)
diff --git a/drivers/thermal/intel/x86_pkg_temp_thermal.c b/drivers/thermal/intel/x86_pkg_temp_thermal.c
index 1ef937d799e4..405b3858900a 100644
--- a/drivers/thermal/intel/x86_pkg_temp_thermal.c
+++ b/drivers/thermal/intel/x86_pkg_temp_thermal.c
@@ -122,7 +122,7 @@ static int pkg_temp_debugfs_init(void)
*/
static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
{
- int pkgid = topology_logical_package_id(cpu);
+ int pkgid = topology_logical_die_id(cpu);
if (pkgid >= 0 && pkgid < max_packages)
return packages[pkgid];
@@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)
static int pkg_temp_thermal_device_add(unsigned int cpu)
{
- int pkgid = topology_logical_package_id(cpu);
+ int pkgid = topology_logical_die_id(cpu);
u32 tj_max, eax, ebx, ecx, edx;
struct pkg_device *pkgdev;
int thres_count, err;
@@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
* worker will see the package anymore.
*/
if (lastcpu) {
- packages[topology_logical_package_id(cpu)] = NULL;
+ packages[topology_logical_die_id(cpu)] = NULL;
/* After this point nothing touches the MSR anymore. */
wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
@@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void)
if (!x86_match_cpu(pkg_temp_thermal_ids))
return -ENODEV;
- max_packages = topology_max_packages();
+ max_packages = topology_max_packages() * topology_max_die_per_package();
packages = kcalloc(max_packages, sizeof(struct pkg_device *),
GFP_KERNEL);
if (!packages)
--
2.18.0-rc0
next prev parent reply other threads:[~2019-05-06 21:27 UTC|newest]
Thread overview: 33+ messages / expand[flat|nested] mbox.gz Atom feed top
2019-05-06 21:25 [PATCH 0/22] v5 multi-die/package topology support Len Brown
2019-05-06 21:25 ` [PATCH 01/22] x86 topology: Fix doc typo Len Brown
2019-05-06 21:25 ` [PATCH 02/22] topology: Simplify cputopology.txt formatting and wording Len Brown
2019-05-06 21:25 ` [PATCH 03/22] x86 smpboot: Rename match_die() to match_pkg() Len Brown
2019-05-06 21:25 ` [PATCH 04/22] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-05-06 21:26 ` [PATCH 05/22] x86 topology: Create topology_max_die_per_package() Len Brown
2019-05-06 21:26 ` [PATCH 06/22] cpu topology: Export die_id Len Brown
2019-05-06 21:26 ` [PATCH 07/22] x86 topology: Define topology_die_id() Len Brown
2019-05-06 21:26 ` [PATCH 08/22] x86 topology: Define topology_logical_die_id() Len Brown
2019-05-06 21:26 ` [PATCH 09/22] powercap/intel_rapl: Simplify rapl_find_package() Len Brown
2019-05-06 21:26 ` [PATCH 10/22] powercap/intel_rapl: Support multi-die/package Len Brown
2019-05-07 12:14 ` Peter Zijlstra
2019-05-08 19:45 ` Len Brown
2019-05-06 21:26 ` Len Brown [this message]
2019-05-06 21:26 ` [PATCH 12/22] powercap/intel_rapl: update rapl domain name and debug messages Len Brown
2019-05-06 21:26 ` [PATCH 13/22] hwmon/coretemp: Support multi-die/package Len Brown
2019-05-06 21:26 ` [PATCH 14/22] topology: Create package_cpus sysfs attribute Len Brown
2019-05-06 21:26 ` [PATCH 15/22] topology: Create core_cpus and die_cpus sysfs attributes Len Brown
2019-05-06 21:26 ` [PATCH 16/22] perf/x86/intel/uncore: Support multi-die/package Len Brown
2019-05-07 12:21 ` Peter Zijlstra
2019-05-08 19:51 ` Len Brown
2019-05-07 12:22 ` Peter Zijlstra
2019-05-08 19:51 ` Len Brown
2019-05-06 21:26 ` [PATCH 17/22] perf/x86/intel/rapl: " Len Brown
2019-05-06 21:26 ` [PATCH 18/22] perf/x86/intel/cstate: " Len Brown
2019-05-06 21:26 ` [PATCH 19/22] thermal/x86_pkg_temp_thermal: rename internal variables to zones from packages Len Brown
2019-05-06 21:26 ` [PATCH 20/22] hwmon/coretemp: " Len Brown
2019-05-06 21:26 ` [PATCH 21/22] perf/x86/intel/uncore: renames in response to multi-die/pkg support Len Brown
2019-05-09 15:02 ` Liang, Kan
2019-05-13 17:30 ` Len Brown
2019-05-06 21:26 ` [PATCH 22/22] perf/x86/intel/rapl: rename internal variables " Len Brown
2019-05-09 15:04 ` Liang, Kan
2019-05-13 17:29 ` Len Brown
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