[PATCH v2 0/2] 96boards: add thermal senor support to hikey board

[PATCH v2 0/2] 96boards: add thermal senor support to hikey board

[Xinwei Kong]

From: kongxinwei <kong.kongxinwei@hisilicon.com>

Thank you all for giving this v1 patches stages some comments. Here is v2
patches and address all the issues raised as part of v1 review.

The Linaro connect introduce 96boards series in Hong Kong,The HiKey board
is the first board to be certified 96Boards Consumer Edition compatible.
This board is based on the HiSilicon SoC. you can get more information
from https://www.96boards.org.

The hisilicon SoC contains thermal module, this thermal module has 4 sensors,

	- sensor 0: local sensor;
	- sensor 1: remote sensor for ACPU cluster 1;
	- sensor 2: remote sensor for ACPU cluster 2;
	- sensor 3: remote sensor for GPU;

It can obtain this device temperature by operating this hardware. The new
sensor driver satisfies thermal framework and to realize the ACPU ,GPU and
so on to cool function.

Changes v0->v1;
* Delete this hi6220 dtsi.
* Fix documentation and error checks.
* Modify this driver which makes use of kernel to decide how to dynamically
  bind the interrupt to hottest sensor.
* Delete "sensor-thres-temp" property and read thermal_zone trips points
  replace of it.
* Delete "sensor-reset-temp" property and define the fixed value replace
  of it.

Changes v1->v2;
* change patch's situation between binding document and driver file
* clean up some regiser for enabling thermal sensor
* use mutex lock to replace the spin lock

kongxinwei (2):
  dt-bindings: Document the hi6220 thermal sensor bindings
  thermal: hisilicon: add new hisilicon thermal sensor driver

 .../bindings/thermal/hisilicon-thermal.txt         |  45 ++
 drivers/thermal/Kconfig                            |   8 +
 drivers/thermal/Makefile                           |   1 +
 drivers/thermal/hisi_thermal.c                     | 475 +++++++++++++++++++++
 4 files changed, 529 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
 create mode 100644 drivers/thermal/hisi_thermal.c

-- 
1.9.1

[PATCH v2 0/2] 96boards: add thermal senor support to hikey board

[Xinwei Kong]

From: kongxinwei <kong.kongxinwei@hisilicon.com>

Thank you all for giving this v1 patches stages some comments. Here is v2
patches and address all the issues raised as part of v1 review.

The Linaro connect introduce 96boards series in Hong Kong,The HiKey board
is the first board to be certified 96Boards Consumer Edition compatible.
This board is based on the HiSilicon SoC. you can get more information
from https://www.96boards.org.

The hisilicon SoC contains thermal module, this thermal module has 4 sensors,

	- sensor 0: local sensor;
	- sensor 1: remote sensor for ACPU cluster 1;
	- sensor 2: remote sensor for ACPU cluster 2;
	- sensor 3: remote sensor for GPU;

It can obtain this device temperature by operating this hardware. The new
sensor driver satisfies thermal framework and to realize the ACPU ,GPU and
so on to cool function.

Changes v0->v1;
* Delete this hi6220 dtsi.
* Fix documentation and error checks.
* Modify this driver which makes use of kernel to decide how to dynamically
  bind the interrupt to hottest sensor.
* Delete "sensor-thres-temp" property and read thermal_zone trips points
  replace of it.
* Delete "sensor-reset-temp" property and define the fixed value replace
  of it.

Changes v1->v2;
* change patch's situation between binding document and driver file
* clean up some regiser for enabling thermal sensor
* use mutex lock to replace the spin lock

kongxinwei (2):
  dt-bindings: Document the hi6220 thermal sensor bindings
  thermal: hisilicon: add new hisilicon thermal sensor driver

 .../bindings/thermal/hisilicon-thermal.txt         |  45 ++
 drivers/thermal/Kconfig                            |   8 +
 drivers/thermal/Makefile                           |   1 +
 drivers/thermal/hisi_thermal.c                     | 475 +++++++++++++++++++++
 4 files changed, 529 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
 create mode 100644 drivers/thermal/hisi_thermal.c

-- 
1.9.1

[PATCH v2 0/2] 96boards: add thermal senor support to hikey board

[Xinwei Kong]

From: kongxinwei <kong.kongxinwei@hisilicon.com>

Thank you all for giving this v1 patches stages some comments. Here is v2
patches and address all the issues raised as part of v1 review.

The Linaro connect introduce 96boards series in Hong Kong,The HiKey board
is the first board to be certified 96Boards Consumer Edition compatible.
This board is based on the HiSilicon SoC. you can get more information
from https://www.96boards.org.

The hisilicon SoC contains thermal module, this thermal module has 4 sensors,

	- sensor 0: local sensor;
	- sensor 1: remote sensor for ACPU cluster 1;
	- sensor 2: remote sensor for ACPU cluster 2;
	- sensor 3: remote sensor for GPU;

It can obtain this device temperature by operating this hardware. The new
sensor driver satisfies thermal framework and to realize the ACPU ,GPU and
so on to cool function.

Changes v0->v1;
* Delete this hi6220 dtsi.
* Fix documentation and error checks.
* Modify this driver which makes use of kernel to decide how to dynamically
  bind the interrupt to hottest sensor.
* Delete "sensor-thres-temp" property and read thermal_zone trips points
  replace of it.
* Delete "sensor-reset-temp" property and define the fixed value replace
  of it.

Changes v1->v2;
* change patch's situation between binding document and driver file
* clean up some regiser for enabling thermal sensor
* use mutex lock to replace the spin lock

kongxinwei (2):
  dt-bindings: Document the hi6220 thermal sensor bindings
  thermal: hisilicon: add new hisilicon thermal sensor driver

 .../bindings/thermal/hisilicon-thermal.txt         |  45 ++
 drivers/thermal/Kconfig                            |   8 +
 drivers/thermal/Makefile                           |   1 +
 drivers/thermal/hisi_thermal.c                     | 475 +++++++++++++++++++++
 4 files changed, 529 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
 create mode 100644 drivers/thermal/hisi_thermal.c

-- 
1.9.1

[PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Xinwei Kong]

From: kongxinwei <kong.kongxinwei@hisilicon.com>

This adds documentation of device tree bindings for the
thermal sensor controller of hi6220 SoC.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
---
 .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
 1 file changed, 45 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt

diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
new file mode 100644
index 0000000..ceb6e2e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
@@ -0,0 +1,45 @@
+* Hisilicon Thermal
+
+This driver is for hi6220 SoC which contain 4 thermal sensor.
+
+	1. sensor 0: local sensor;
+	2. sensor 1: remote sensor for ACPU cluster 1;
+	3. sensor 2: remote sensor for ACPU cluster 2;
+	4. sensor 3: remote sensor for GPU.
+
+Every sensor use one child node to represent it, so thermal sensor include
+parent node and four child node. The parent node describe common feature and
+child node describe private feature for thermal sensor;
+
+** Required properties :
+
+- compatible: "hisilicon,tsensor".
+- reg: physical base address of thermal sensor and length of memory mapped
+  region.
+- interrupt: The interrupt number to the cpu. Defines the interrupt used
+  by SOCTHERM.
+- clock-names: Input clock name, should be 'thermal_clk'.
+- clocks: phandles for clock specified in "clock-names" property.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+
+** Required properties for child nodes :
+
+- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
+  thermal sensor. For example: <0> stands for local sensor; <1> stands for
+  acpu1 sensor;
+
+Example :
+
+	tsensor: tsensor@0,f7030700 {
+		compatible = "hisilicon,tsensor";
+		reg = <0x0 0xf7030700 0x0 0x1000>;
+		interrupts = <0 7 0x4>;
+		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
+		clock-names = "thermal_clk";
+		#thermal-sensor-cells = <1>;
+
+		local_sensor {
+			hisilicon,tsensor-id = <0>;
+		}
+		.......
+	}
-- 
1.9.1

[PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Xinwei Kong]

From: kongxinwei <kong.kongxinwei@hisilicon.com>

This adds documentation of device tree bindings for the
thermal sensor controller of hi6220 SoC.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
---
 .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
 1 file changed, 45 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt

diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
new file mode 100644
index 0000000..ceb6e2e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
@@ -0,0 +1,45 @@
+* Hisilicon Thermal
+
+This driver is for hi6220 SoC which contain 4 thermal sensor.
+
+	1. sensor 0: local sensor;
+	2. sensor 1: remote sensor for ACPU cluster 1;
+	3. sensor 2: remote sensor for ACPU cluster 2;
+	4. sensor 3: remote sensor for GPU.
+
+Every sensor use one child node to represent it, so thermal sensor include
+parent node and four child node. The parent node describe common feature and
+child node describe private feature for thermal sensor;
+
+** Required properties :
+
+- compatible: "hisilicon,tsensor".
+- reg: physical base address of thermal sensor and length of memory mapped
+  region.
+- interrupt: The interrupt number to the cpu. Defines the interrupt used
+  by SOCTHERM.
+- clock-names: Input clock name, should be 'thermal_clk'.
+- clocks: phandles for clock specified in "clock-names" property.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+
+** Required properties for child nodes :
+
+- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
+  thermal sensor. For example: <0> stands for local sensor; <1> stands for
+  acpu1 sensor;
+
+Example :
+
+	tsensor: tsensor at 0,f7030700 {
+		compatible = "hisilicon,tsensor";
+		reg = <0x0 0xf7030700 0x0 0x1000>;
+		interrupts = <0 7 0x4>;
+		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
+		clock-names = "thermal_clk";
+		#thermal-sensor-cells = <1>;
+
+		local_sensor {
+			hisilicon,tsensor-id = <0>;
+		}
+		.......
+	}
-- 
1.9.1

[PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Xinwei Kong]

From: kongxinwei <kong.kongxinwei@hisilicon.com>

This adds documentation of device tree bindings for the
thermal sensor controller of hi6220 SoC.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
---
 .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
 1 file changed, 45 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt

diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
new file mode 100644
index 0000000..ceb6e2e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
@@ -0,0 +1,45 @@
+* Hisilicon Thermal
+
+This driver is for hi6220 SoC which contain 4 thermal sensor.
+
+	1. sensor 0: local sensor;
+	2. sensor 1: remote sensor for ACPU cluster 1;
+	3. sensor 2: remote sensor for ACPU cluster 2;
+	4. sensor 3: remote sensor for GPU.
+
+Every sensor use one child node to represent it, so thermal sensor include
+parent node and four child node. The parent node describe common feature and
+child node describe private feature for thermal sensor;
+
+** Required properties :
+
+- compatible: "hisilicon,tsensor".
+- reg: physical base address of thermal sensor and length of memory mapped
+  region.
+- interrupt: The interrupt number to the cpu. Defines the interrupt used
+  by SOCTHERM.
+- clock-names: Input clock name, should be 'thermal_clk'.
+- clocks: phandles for clock specified in "clock-names" property.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+
+** Required properties for child nodes :
+
+- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
+  thermal sensor. For example: <0> stands for local sensor; <1> stands for
+  acpu1 sensor;
+
+Example :
+
+	tsensor: tsensor@0,f7030700 {
+		compatible = "hisilicon,tsensor";
+		reg = <0x0 0xf7030700 0x0 0x1000>;
+		interrupts = <0 7 0x4>;
+		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
+		clock-names = "thermal_clk";
+		#thermal-sensor-cells = <1>;
+
+		local_sensor {
+			hisilicon,tsensor-id = <0>;
+		}
+		.......
+	}
-- 
1.9.1

Re: [PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Matt Porter]

On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote:
> From: kongxinwei <kong.kongxinwei@hisilicon.com>
> 
> This adds documentation of device tree bindings for the
> thermal sensor controller of hi6220 SoC.
> 
> Signed-off-by: Leo Yan <leo.yan@linaro.org>
> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
> ---
>  .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
>  1 file changed, 45 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> 
> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> new file mode 100644
> index 0000000..ceb6e2e
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> @@ -0,0 +1,45 @@
> +* Hisilicon Thermal
> +
> +This driver is for hi6220 SoC which contain 4 thermal sensor.
> +
> +	1. sensor 0: local sensor;
> +	2. sensor 1: remote sensor for ACPU cluster 1;
> +	3. sensor 2: remote sensor for ACPU cluster 2;
> +	4. sensor 3: remote sensor for GPU.
> +
> +Every sensor use one child node to represent it, so thermal sensor include
> +parent node and four child node. The parent node describe common feature and
> +child node describe private feature for thermal sensor;
> +
> +** Required properties :
> +
> +- compatible: "hisilicon,tsensor".
> +- reg: physical base address of thermal sensor and length of memory mapped
> +  region.
> +- interrupt: The interrupt number to the cpu. Defines the interrupt used
> +  by SOCTHERM.
> +- clock-names: Input clock name, should be 'thermal_clk'.
> +- clocks: phandles for clock specified in "clock-names" property.
> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> +
> +** Required properties for child nodes :
> +
> +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
> +  thermal sensor. For example: <0> stands for local sensor; <1> stands for
> +  acpu1 sensor;

Please show an example illustrating why this property is needed. The
example below doesn't show any per sensor properties aside from the
sensor id. Other bindings with a similar sub-sensor hardware design like
tegra-soctherm and rockchip-thermal don't have a need for a vendor
specific property like this. Their drivers simply iterate over an id
index during thermal sensor registration.

-Matt

> +
> +Example :
> +
> +	tsensor: tsensor@0,f7030700 {
> +		compatible = "hisilicon,tsensor";
> +		reg = <0x0 0xf7030700 0x0 0x1000>;
> +		interrupts = <0 7 0x4>;
> +		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
> +		clock-names = "thermal_clk";
> +		#thermal-sensor-cells = <1>;
> +
> +		local_sensor {
> +			hisilicon,tsensor-id = <0>;
> +		}
> +		.......
> +	}
> -- 
> 1.9.1
> 
> 
> 
> _______________________________________________
> linux-arm-kernel mailing list
> linux-arm-kernel@lists.infradead.org
> http://lists.infradead.org/mailman/listinfo/linux-arm-kernel

[PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Matt Porter]

On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote:
> From: kongxinwei <kong.kongxinwei@hisilicon.com>
> 
> This adds documentation of device tree bindings for the
> thermal sensor controller of hi6220 SoC.
> 
> Signed-off-by: Leo Yan <leo.yan@linaro.org>
> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
> ---
>  .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
>  1 file changed, 45 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> 
> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> new file mode 100644
> index 0000000..ceb6e2e
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> @@ -0,0 +1,45 @@
> +* Hisilicon Thermal
> +
> +This driver is for hi6220 SoC which contain 4 thermal sensor.
> +
> +	1. sensor 0: local sensor;
> +	2. sensor 1: remote sensor for ACPU cluster 1;
> +	3. sensor 2: remote sensor for ACPU cluster 2;
> +	4. sensor 3: remote sensor for GPU.
> +
> +Every sensor use one child node to represent it, so thermal sensor include
> +parent node and four child node. The parent node describe common feature and
> +child node describe private feature for thermal sensor;
> +
> +** Required properties :
> +
> +- compatible: "hisilicon,tsensor".
> +- reg: physical base address of thermal sensor and length of memory mapped
> +  region.
> +- interrupt: The interrupt number to the cpu. Defines the interrupt used
> +  by SOCTHERM.
> +- clock-names: Input clock name, should be 'thermal_clk'.
> +- clocks: phandles for clock specified in "clock-names" property.
> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> +
> +** Required properties for child nodes :
> +
> +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
> +  thermal sensor. For example: <0> stands for local sensor; <1> stands for
> +  acpu1 sensor;

Please show an example illustrating why this property is needed. The
example below doesn't show any per sensor properties aside from the
sensor id. Other bindings with a similar sub-sensor hardware design like
tegra-soctherm and rockchip-thermal don't have a need for a vendor
specific property like this. Their drivers simply iterate over an id
index during thermal sensor registration.

-Matt

> +
> +Example :
> +
> +	tsensor: tsensor at 0,f7030700 {
> +		compatible = "hisilicon,tsensor";
> +		reg = <0x0 0xf7030700 0x0 0x1000>;
> +		interrupts = <0 7 0x4>;
> +		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
> +		clock-names = "thermal_clk";
> +		#thermal-sensor-cells = <1>;
> +
> +		local_sensor {
> +			hisilicon,tsensor-id = <0>;
> +		}
> +		.......
> +	}
> -- 
> 1.9.1
> 
> 
> 
> _______________________________________________
> linux-arm-kernel mailing list
> linux-arm-kernel at lists.infradead.org
> http://lists.infradead.org/mailman/listinfo/linux-arm-kernel

Re: [PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Matt Porter]

On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote:
> From: kongxinwei <kong.kongxinwei-C8/M+/jPZTeaMJb+Lgu22Q@public.gmane.org>
> 
> This adds documentation of device tree bindings for the
> thermal sensor controller of hi6220 SoC.
> 
> Signed-off-by: Leo Yan <leo.yan-QSEj5FYQhm4dnm+yROfE0A@public.gmane.org>
> Signed-off-by: kongxinwei <kong.kongxinwei-C8/M+/jPZTeaMJb+Lgu22Q@public.gmane.org>
> ---
>  .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
>  1 file changed, 45 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> 
> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> new file mode 100644
> index 0000000..ceb6e2e
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> @@ -0,0 +1,45 @@
> +* Hisilicon Thermal
> +
> +This driver is for hi6220 SoC which contain 4 thermal sensor.
> +
> +	1. sensor 0: local sensor;
> +	2. sensor 1: remote sensor for ACPU cluster 1;
> +	3. sensor 2: remote sensor for ACPU cluster 2;
> +	4. sensor 3: remote sensor for GPU.
> +
> +Every sensor use one child node to represent it, so thermal sensor include
> +parent node and four child node. The parent node describe common feature and
> +child node describe private feature for thermal sensor;
> +
> +** Required properties :
> +
> +- compatible: "hisilicon,tsensor".
> +- reg: physical base address of thermal sensor and length of memory mapped
> +  region.
> +- interrupt: The interrupt number to the cpu. Defines the interrupt used
> +  by SOCTHERM.
> +- clock-names: Input clock name, should be 'thermal_clk'.
> +- clocks: phandles for clock specified in "clock-names" property.
> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> +
> +** Required properties for child nodes :
> +
> +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
> +  thermal sensor. For example: <0> stands for local sensor; <1> stands for
> +  acpu1 sensor;

Please show an example illustrating why this property is needed. The
example below doesn't show any per sensor properties aside from the
sensor id. Other bindings with a similar sub-sensor hardware design like
tegra-soctherm and rockchip-thermal don't have a need for a vendor
specific property like this. Their drivers simply iterate over an id
index during thermal sensor registration.

-Matt

> +
> +Example :
> +
> +	tsensor: tsensor@0,f7030700 {
> +		compatible = "hisilicon,tsensor";
> +		reg = <0x0 0xf7030700 0x0 0x1000>;
> +		interrupts = <0 7 0x4>;
> +		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
> +		clock-names = "thermal_clk";
> +		#thermal-sensor-cells = <1>;
> +
> +		local_sensor {
> +			hisilicon,tsensor-id = <0>;
> +		}
> +		.......
> +	}
> -- 
> 1.9.1
> 
> 
> 
> _______________________________________________
> linux-arm-kernel mailing list
> linux-arm-kernel-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org
> http://lists.infradead.org/mailman/listinfo/linux-arm-kernel
--
To unsubscribe from this list: send the line "unsubscribe devicetree" in
the body of a message to majordomo-u79uwXL29TY76Z2rM5mHXA@public.gmane.org
More majordomo info at  http://vger.kernel.org/majordomo-info.html

Re: [PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Xinwei Kong]

On 2015/4/6 22:03, Matt Porter wrote:
> On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote:
>> From: kongxinwei <kong.kongxinwei@hisilicon.com>
>>
>> This adds documentation of device tree bindings for the
>> thermal sensor controller of hi6220 SoC.
>>
>> Signed-off-by: Leo Yan <leo.yan@linaro.org>
>> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
>> ---
>>  .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
>>  1 file changed, 45 insertions(+)
>>  create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>>
>> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>> new file mode 100644
>> index 0000000..ceb6e2e
>> --- /dev/null
>> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>> @@ -0,0 +1,45 @@
>> +* Hisilicon Thermal
>> +
>> +This driver is for hi6220 SoC which contain 4 thermal sensor.
>> +
>> +	1. sensor 0: local sensor;
>> +	2. sensor 1: remote sensor for ACPU cluster 1;
>> +	3. sensor 2: remote sensor for ACPU cluster 2;
>> +	4. sensor 3: remote sensor for GPU.
>> +
>> +Every sensor use one child node to represent it, so thermal sensor include
>> +parent node and four child node. The parent node describe common feature and
>> +child node describe private feature for thermal sensor;
>> +
>> +** Required properties :
>> +
>> +- compatible: "hisilicon,tsensor".
>> +- reg: physical base address of thermal sensor and length of memory mapped
>> +  region.
>> +- interrupt: The interrupt number to the cpu. Defines the interrupt used
>> +  by SOCTHERM.
>> +- clock-names: Input clock name, should be 'thermal_clk'.
>> +- clocks: phandles for clock specified in "clock-names" property.
>> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
>> +
>> +** Required properties for child nodes :
>> +
>> +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
>> +  thermal sensor. For example: <0> stands for local sensor; <1> stands for
>> +  acpu1 sensor;
> 
> Please show an example illustrating why this property is needed. The
> example below doesn't show any per sensor properties aside from the
> sensor id. Other bindings with a similar sub-sensor hardware design like
> tegra-soctherm and rockchip-thermal don't have a need for a vendor
> specific property like this. Their drivers simply iterate over an id
> index during thermal sensor registration.
> 
> -Matt
> 
Thermal Ip of hisilicon SoC can get four module temperature--local sensor, ACPU0
sensor, ACPU1 sensor and gpu sensor. In order to use these sensors, this driver
will make use of sensor id to distinguish sensor in using process.

These four sensors only get one sensor temperature at the same times. Because
these sensor commonly use the same register by setting diff value to enable one
sensor. howerver, sensor id is key flag for these diff sensor modules.

If deleting sensor id, this driver will define some value which set diff sensor
regitser and it difficult to understand sensor register operation.

Thanks
Xinwei

>> +
>> +Example :
>> +
>> +	tsensor: tsensor@0,f7030700 {
>> +		compatible = "hisilicon,tsensor";
>> +		reg = <0x0 0xf7030700 0x0 0x1000>;
>> +		interrupts = <0 7 0x4>;
>> +		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
>> +		clock-names = "thermal_clk";
>> +		#thermal-sensor-cells = <1>;
>> +
>> +		local_sensor {
>> +			hisilicon,tsensor-id = <0>;
>> +		}
>> +		.......
>> +	}
>> -- 
>> 1.9.1
>>
>>
>>
>> _______________________________________________
>> linux-arm-kernel mailing list
>> linux-arm-kernel@lists.infradead.org
>> http://lists.infradead.org/mailman/listinfo/linux-arm-kernel
> 
> .
> 

[PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Xinwei Kong]

On 2015/4/6 22:03, Matt Porter wrote:
> On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote:
>> From: kongxinwei <kong.kongxinwei@hisilicon.com>
>>
>> This adds documentation of device tree bindings for the
>> thermal sensor controller of hi6220 SoC.
>>
>> Signed-off-by: Leo Yan <leo.yan@linaro.org>
>> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
>> ---
>>  .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
>>  1 file changed, 45 insertions(+)
>>  create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>>
>> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>> new file mode 100644
>> index 0000000..ceb6e2e
>> --- /dev/null
>> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>> @@ -0,0 +1,45 @@
>> +* Hisilicon Thermal
>> +
>> +This driver is for hi6220 SoC which contain 4 thermal sensor.
>> +
>> +	1. sensor 0: local sensor;
>> +	2. sensor 1: remote sensor for ACPU cluster 1;
>> +	3. sensor 2: remote sensor for ACPU cluster 2;
>> +	4. sensor 3: remote sensor for GPU.
>> +
>> +Every sensor use one child node to represent it, so thermal sensor include
>> +parent node and four child node. The parent node describe common feature and
>> +child node describe private feature for thermal sensor;
>> +
>> +** Required properties :
>> +
>> +- compatible: "hisilicon,tsensor".
>> +- reg: physical base address of thermal sensor and length of memory mapped
>> +  region.
>> +- interrupt: The interrupt number to the cpu. Defines the interrupt used
>> +  by SOCTHERM.
>> +- clock-names: Input clock name, should be 'thermal_clk'.
>> +- clocks: phandles for clock specified in "clock-names" property.
>> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
>> +
>> +** Required properties for child nodes :
>> +
>> +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
>> +  thermal sensor. For example: <0> stands for local sensor; <1> stands for
>> +  acpu1 sensor;
> 
> Please show an example illustrating why this property is needed. The
> example below doesn't show any per sensor properties aside from the
> sensor id. Other bindings with a similar sub-sensor hardware design like
> tegra-soctherm and rockchip-thermal don't have a need for a vendor
> specific property like this. Their drivers simply iterate over an id
> index during thermal sensor registration.
> 
> -Matt
> 
Thermal Ip of hisilicon SoC can get four module temperature--local sensor, ACPU0
sensor, ACPU1 sensor and gpu sensor. In order to use these sensors, this driver
will make use of sensor id to distinguish sensor in using process.

These four sensors only get one sensor temperature at the same times. Because
these sensor commonly use the same register by setting diff value to enable one
sensor. howerver, sensor id is key flag for these diff sensor modules.

If deleting sensor id, this driver will define some value which set diff sensor
regitser and it difficult to understand sensor register operation.

Thanks
Xinwei

>> +
>> +Example :
>> +
>> +	tsensor: tsensor at 0,f7030700 {
>> +		compatible = "hisilicon,tsensor";
>> +		reg = <0x0 0xf7030700 0x0 0x1000>;
>> +		interrupts = <0 7 0x4>;
>> +		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
>> +		clock-names = "thermal_clk";
>> +		#thermal-sensor-cells = <1>;
>> +
>> +		local_sensor {
>> +			hisilicon,tsensor-id = <0>;
>> +		}
>> +		.......
>> +	}
>> -- 
>> 1.9.1
>>
>>
>>
>> _______________________________________________
>> linux-arm-kernel mailing list
>> linux-arm-kernel at lists.infradead.org
>> http://lists.infradead.org/mailman/listinfo/linux-arm-kernel
> 
> .
> 

Re: [PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Xinwei Kong]

On 2015/4/6 22:03, Matt Porter wrote:
> On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote:
>> From: kongxinwei <kong.kongxinwei@hisilicon.com>
>>
>> This adds documentation of device tree bindings for the
>> thermal sensor controller of hi6220 SoC.
>>
>> Signed-off-by: Leo Yan <leo.yan@linaro.org>
>> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
>> ---
>>  .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
>>  1 file changed, 45 insertions(+)
>>  create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>>
>> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>> new file mode 100644
>> index 0000000..ceb6e2e
>> --- /dev/null
>> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>> @@ -0,0 +1,45 @@
>> +* Hisilicon Thermal
>> +
>> +This driver is for hi6220 SoC which contain 4 thermal sensor.
>> +
>> +	1. sensor 0: local sensor;
>> +	2. sensor 1: remote sensor for ACPU cluster 1;
>> +	3. sensor 2: remote sensor for ACPU cluster 2;
>> +	4. sensor 3: remote sensor for GPU.
>> +
>> +Every sensor use one child node to represent it, so thermal sensor include
>> +parent node and four child node. The parent node describe common feature and
>> +child node describe private feature for thermal sensor;
>> +
>> +** Required properties :
>> +
>> +- compatible: "hisilicon,tsensor".
>> +- reg: physical base address of thermal sensor and length of memory mapped
>> +  region.
>> +- interrupt: The interrupt number to the cpu. Defines the interrupt used
>> +  by SOCTHERM.
>> +- clock-names: Input clock name, should be 'thermal_clk'.
>> +- clocks: phandles for clock specified in "clock-names" property.
>> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
>> +
>> +** Required properties for child nodes :
>> +
>> +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
>> +  thermal sensor. For example: <0> stands for local sensor; <1> stands for
>> +  acpu1 sensor;
> 
> Please show an example illustrating why this property is needed. The
> example below doesn't show any per sensor properties aside from the
> sensor id. Other bindings with a similar sub-sensor hardware design like
> tegra-soctherm and rockchip-thermal don't have a need for a vendor
> specific property like this. Their drivers simply iterate over an id
> index during thermal sensor registration.
> 
> -Matt
> 
Thermal Ip of hisilicon SoC can get four module temperature--local sensor, ACPU0
sensor, ACPU1 sensor and gpu sensor. In order to use these sensors, this driver
will make use of sensor id to distinguish sensor in using process.

These four sensors only get one sensor temperature at the same times. Because
these sensor commonly use the same register by setting diff value to enable one
sensor. howerver, sensor id is key flag for these diff sensor modules.

If deleting sensor id, this driver will define some value which set diff sensor
regitser and it difficult to understand sensor register operation.

Thanks
Xinwei

>> +
>> +Example :
>> +
>> +	tsensor: tsensor@0,f7030700 {
>> +		compatible = "hisilicon,tsensor";
>> +		reg = <0x0 0xf7030700 0x0 0x1000>;
>> +		interrupts = <0 7 0x4>;
>> +		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
>> +		clock-names = "thermal_clk";
>> +		#thermal-sensor-cells = <1>;
>> +
>> +		local_sensor {
>> +			hisilicon,tsensor-id = <0>;
>> +		}
>> +		.......
>> +	}
>> -- 
>> 1.9.1
>>
>>
>>
>> _______________________________________________
>> linux-arm-kernel mailing list
>> linux-arm-kernel@lists.infradead.org
>> http://lists.infradead.org/mailman/listinfo/linux-arm-kernel
> 
> .
> 

Re: [PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Eduardo Valentin]

[-- Attachment #1: Type: text/plain, Size: 4385 bytes --]

On Tue, Apr 07, 2015 at 11:46:22AM +0800, Xinwei Kong wrote:
> 
> 
> On 2015/4/6 22:03, Matt Porter wrote:
> > On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote:
> >> From: kongxinwei <kong.kongxinwei@hisilicon.com>
> >>
> >> This adds documentation of device tree bindings for the
> >> thermal sensor controller of hi6220 SoC.
> >>
> >> Signed-off-by: Leo Yan <leo.yan@linaro.org>
> >> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
> >> ---
> >>  .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
> >>  1 file changed, 45 insertions(+)
> >>  create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> >>
> >> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> >> new file mode 100644
> >> index 0000000..ceb6e2e
> >> --- /dev/null
> >> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> >> @@ -0,0 +1,45 @@
> >> +* Hisilicon Thermal
> >> +
> >> +This driver is for hi6220 SoC which contain 4 thermal sensor.
> >> +
> >> +	1. sensor 0: local sensor;
> >> +	2. sensor 1: remote sensor for ACPU cluster 1;
> >> +	3. sensor 2: remote sensor for ACPU cluster 2;
> >> +	4. sensor 3: remote sensor for GPU.
> >> +
> >> +Every sensor use one child node to represent it, so thermal sensor include
> >> +parent node and four child node. The parent node describe common feature and
> >> +child node describe private feature for thermal sensor;
> >> +
> >> +** Required properties :
> >> +
> >> +- compatible: "hisilicon,tsensor".
> >> +- reg: physical base address of thermal sensor and length of memory mapped
> >> +  region.
> >> +- interrupt: The interrupt number to the cpu. Defines the interrupt used
> >> +  by SOCTHERM.
> >> +- clock-names: Input clock name, should be 'thermal_clk'.
> >> +- clocks: phandles for clock specified in "clock-names" property.
> >> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> >> +
> >> +** Required properties for child nodes :
> >> +
> >> +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
> >> +  thermal sensor. For example: <0> stands for local sensor; <1> stands for
> >> +  acpu1 sensor;
> > 
> > Please show an example illustrating why this property is needed. The
> > example below doesn't show any per sensor properties aside from the
> > sensor id. Other bindings with a similar sub-sensor hardware design like
> > tegra-soctherm and rockchip-thermal don't have a need for a vendor
> > specific property like this. Their drivers simply iterate over an id
> > index during thermal sensor registration.
> > 
> > -Matt
> > 
> Thermal Ip of hisilicon SoC can get four module temperature--local sensor, ACPU0
> sensor, ACPU1 sensor and gpu sensor. In order to use these sensors, this driver
> will make use of sensor id to distinguish sensor in using process.
> 
> These four sensors only get one sensor temperature at the same times. Because
> these sensor commonly use the same register by setting diff value to enable one
> sensor. howerver, sensor id is key flag for these diff sensor modules.
> 
> If deleting sensor id, this driver will define some value which set diff sensor
> regitser and it difficult to understand sensor register operation.

The above still do not explain why you need a specific property.

Could you please check
Documentation/devicetree/bindings/thermal/thermal.txt file?

There are several examples there on how to define DT nodes for the exact
case you describe above.

> 
> Thanks
> Xinwei
> 
> >> +
> >> +Example :
> >> +
> >> +	tsensor: tsensor@0,f7030700 {
> >> +		compatible = "hisilicon,tsensor";
> >> +		reg = <0x0 0xf7030700 0x0 0x1000>;
> >> +		interrupts = <0 7 0x4>;
> >> +		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
> >> +		clock-names = "thermal_clk";
> >> +		#thermal-sensor-cells = <1>;
> >> +
> >> +		local_sensor {
> >> +			hisilicon,tsensor-id = <0>;
> >> +		}
> >> +		.......
> >> +	}
> >> -- 
> >> 1.9.1
> >>
> >>
> >>
> >> _______________________________________________
> >> linux-arm-kernel mailing list
> >> linux-arm-kernel@lists.infradead.org
> >> http://lists.infradead.org/mailman/listinfo/linux-arm-kernel
> > 
> > .
> > 
> 

[-- Attachment #2: Digital signature --]
[-- Type: application/pgp-signature, Size: 490 bytes --]

[PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Eduardo Valentin]

On Tue, Apr 07, 2015 at 11:46:22AM +0800, Xinwei Kong wrote:
> 
> 
> On 2015/4/6 22:03, Matt Porter wrote:
> > On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote:
> >> From: kongxinwei <kong.kongxinwei@hisilicon.com>
> >>
> >> This adds documentation of device tree bindings for the
> >> thermal sensor controller of hi6220 SoC.
> >>
> >> Signed-off-by: Leo Yan <leo.yan@linaro.org>
> >> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
> >> ---
> >>  .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
> >>  1 file changed, 45 insertions(+)
> >>  create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> >>
> >> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> >> new file mode 100644
> >> index 0000000..ceb6e2e
> >> --- /dev/null
> >> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
> >> @@ -0,0 +1,45 @@
> >> +* Hisilicon Thermal
> >> +
> >> +This driver is for hi6220 SoC which contain 4 thermal sensor.
> >> +
> >> +	1. sensor 0: local sensor;
> >> +	2. sensor 1: remote sensor for ACPU cluster 1;
> >> +	3. sensor 2: remote sensor for ACPU cluster 2;
> >> +	4. sensor 3: remote sensor for GPU.
> >> +
> >> +Every sensor use one child node to represent it, so thermal sensor include
> >> +parent node and four child node. The parent node describe common feature and
> >> +child node describe private feature for thermal sensor;
> >> +
> >> +** Required properties :
> >> +
> >> +- compatible: "hisilicon,tsensor".
> >> +- reg: physical base address of thermal sensor and length of memory mapped
> >> +  region.
> >> +- interrupt: The interrupt number to the cpu. Defines the interrupt used
> >> +  by SOCTHERM.
> >> +- clock-names: Input clock name, should be 'thermal_clk'.
> >> +- clocks: phandles for clock specified in "clock-names" property.
> >> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> >> +
> >> +** Required properties for child nodes :
> >> +
> >> +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
> >> +  thermal sensor. For example: <0> stands for local sensor; <1> stands for
> >> +  acpu1 sensor;
> > 
> > Please show an example illustrating why this property is needed. The
> > example below doesn't show any per sensor properties aside from the
> > sensor id. Other bindings with a similar sub-sensor hardware design like
> > tegra-soctherm and rockchip-thermal don't have a need for a vendor
> > specific property like this. Their drivers simply iterate over an id
> > index during thermal sensor registration.
> > 
> > -Matt
> > 
> Thermal Ip of hisilicon SoC can get four module temperature--local sensor, ACPU0
> sensor, ACPU1 sensor and gpu sensor. In order to use these sensors, this driver
> will make use of sensor id to distinguish sensor in using process.
> 
> These four sensors only get one sensor temperature at the same times. Because
> these sensor commonly use the same register by setting diff value to enable one
> sensor. howerver, sensor id is key flag for these diff sensor modules.
> 
> If deleting sensor id, this driver will define some value which set diff sensor
> regitser and it difficult to understand sensor register operation.

The above still do not explain why you need a specific property.

Could you please check
Documentation/devicetree/bindings/thermal/thermal.txt file?

There are several examples there on how to define DT nodes for the exact
case you describe above.

> 
> Thanks
> Xinwei
> 
> >> +
> >> +Example :
> >> +
> >> +	tsensor: tsensor at 0,f7030700 {
> >> +		compatible = "hisilicon,tsensor";
> >> +		reg = <0x0 0xf7030700 0x0 0x1000>;
> >> +		interrupts = <0 7 0x4>;
> >> +		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
> >> +		clock-names = "thermal_clk";
> >> +		#thermal-sensor-cells = <1>;
> >> +
> >> +		local_sensor {
> >> +			hisilicon,tsensor-id = <0>;
> >> +		}
> >> +		.......
> >> +	}
> >> -- 
> >> 1.9.1
> >>
> >>
> >>
> >> _______________________________________________
> >> linux-arm-kernel mailing list
> >> linux-arm-kernel at lists.infradead.org
> >> http://lists.infradead.org/mailman/listinfo/linux-arm-kernel
> > 
> > .
> > 
> 
-------------- next part --------------
A non-text attachment was scrubbed...
Name: signature.asc
Type: application/pgp-signature
Size: 490 bytes
Desc: Digital signature
URL: <http://lists.infradead.org/pipermail/linux-arm-kernel/attachments/20150406/96d545f0/attachment.sig>

Re: [PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Xinwei Kong]

On 2015/4/7 12:27, Eduardo Valentin wrote:
> On Tue, Apr 07, 2015 at 11:46:22AM +0800, Xinwei Kong wrote:
>>
>>
>> On 2015/4/6 22:03, Matt Porter wrote:
>>> On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote:
>>>> From: kongxinwei <kong.kongxinwei@hisilicon.com>
>>>>
>>>> This adds documentation of device tree bindings for the
>>>> thermal sensor controller of hi6220 SoC.
>>>>
>>>> Signed-off-by: Leo Yan <leo.yan@linaro.org>
>>>> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
>>>> ---
>>>>  .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
>>>>  1 file changed, 45 insertions(+)
>>>>  create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>>>>
>>>> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>>>> new file mode 100644
>>>> index 0000000..ceb6e2e
>>>> --- /dev/null
>>>> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>>>> @@ -0,0 +1,45 @@
>>>> +* Hisilicon Thermal
>>>> +
>>>> +This driver is for hi6220 SoC which contain 4 thermal sensor.
>>>> +
>>>> +	1. sensor 0: local sensor;
>>>> +	2. sensor 1: remote sensor for ACPU cluster 1;
>>>> +	3. sensor 2: remote sensor for ACPU cluster 2;
>>>> +	4. sensor 3: remote sensor for GPU.
>>>> +
>>>> +Every sensor use one child node to represent it, so thermal sensor include
>>>> +parent node and four child node. The parent node describe common feature and
>>>> +child node describe private feature for thermal sensor;
>>>> +
>>>> +** Required properties :
>>>> +
>>>> +- compatible: "hisilicon,tsensor".
>>>> +- reg: physical base address of thermal sensor and length of memory mapped
>>>> +  region.
>>>> +- interrupt: The interrupt number to the cpu. Defines the interrupt used
>>>> +  by SOCTHERM.
>>>> +- clock-names: Input clock name, should be 'thermal_clk'.
>>>> +- clocks: phandles for clock specified in "clock-names" property.
>>>> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
>>>> +
>>>> +** Required properties for child nodes :
>>>> +
>>>> +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
>>>> +  thermal sensor. For example: <0> stands for local sensor; <1> stands for
>>>> +  acpu1 sensor;
>>>
>>> Please show an example illustrating why this property is needed. The
>>> example below doesn't show any per sensor properties aside from the
>>> sensor id. Other bindings with a similar sub-sensor hardware design like
>>> tegra-soctherm and rockchip-thermal don't have a need for a vendor
>>> specific property like this. Their drivers simply iterate over an id
>>> index during thermal sensor registration.
>>>
>>> -Matt
>>>
>> Thermal Ip of hisilicon SoC can get four module temperature--local sensor, ACPU0
>> sensor, ACPU1 sensor and gpu sensor. In order to use these sensors, this driver
>> will make use of sensor id to distinguish sensor in using process.
>>
>> These four sensors only get one sensor temperature at the same times. Because
>> these sensor commonly use the same register by setting diff value to enable one
>> sensor. howerver, sensor id is key flag for these diff sensor modules.
>>
>> If deleting sensor id, this driver will define some value which set diff sensor
>> regitser and it difficult to understand sensor register operation.
> 
> The above still do not explain why you need a specific property.
> 
> Could you please check
> Documentation/devicetree/bindings/thermal/thermal.txt file?
> 
> There are several examples there on how to define DT nodes for the exact
> case you describe above.
> 
Good comments, thank you for Matt and Valentin and I will try to satisfy thermal.txt
file to realize this driver. Please wait for the next version patches.

Thanks
Xinwei
>>
>> Thanks
>> Xinwei
>>
>>>> +
>>>> +Example :
>>>> +
>>>> +	tsensor: tsensor@0,f7030700 {
>>>> +		compatible = "hisilicon,tsensor";
>>>> +		reg = <0x0 0xf7030700 0x0 0x1000>;
>>>> +		interrupts = <0 7 0x4>;
>>>> +		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
>>>> +		clock-names = "thermal_clk";
>>>> +		#thermal-sensor-cells = <1>;
>>>> +
>>>> +		local_sensor {
>>>> +			hisilicon,tsensor-id = <0>;
>>>> +		}
>>>> +		.......
>>>> +	}
>>>> -- 
>>>> 1.9.1
>>>>
>>>>
>>>>
>>>> _______________________________________________
>>>> linux-arm-kernel mailing list
>>>> linux-arm-kernel@lists.infradead.org
>>>> http://lists.infradead.org/mailman/listinfo/linux-arm-kernel
>>>
>>> .
>>>
>>

[PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Xinwei Kong]

On 2015/4/7 12:27, Eduardo Valentin wrote:
> On Tue, Apr 07, 2015 at 11:46:22AM +0800, Xinwei Kong wrote:
>>
>>
>> On 2015/4/6 22:03, Matt Porter wrote:
>>> On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote:
>>>> From: kongxinwei <kong.kongxinwei@hisilicon.com>
>>>>
>>>> This adds documentation of device tree bindings for the
>>>> thermal sensor controller of hi6220 SoC.
>>>>
>>>> Signed-off-by: Leo Yan <leo.yan@linaro.org>
>>>> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
>>>> ---
>>>>  .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
>>>>  1 file changed, 45 insertions(+)
>>>>  create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>>>>
>>>> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>>>> new file mode 100644
>>>> index 0000000..ceb6e2e
>>>> --- /dev/null
>>>> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>>>> @@ -0,0 +1,45 @@
>>>> +* Hisilicon Thermal
>>>> +
>>>> +This driver is for hi6220 SoC which contain 4 thermal sensor.
>>>> +
>>>> +	1. sensor 0: local sensor;
>>>> +	2. sensor 1: remote sensor for ACPU cluster 1;
>>>> +	3. sensor 2: remote sensor for ACPU cluster 2;
>>>> +	4. sensor 3: remote sensor for GPU.
>>>> +
>>>> +Every sensor use one child node to represent it, so thermal sensor include
>>>> +parent node and four child node. The parent node describe common feature and
>>>> +child node describe private feature for thermal sensor;
>>>> +
>>>> +** Required properties :
>>>> +
>>>> +- compatible: "hisilicon,tsensor".
>>>> +- reg: physical base address of thermal sensor and length of memory mapped
>>>> +  region.
>>>> +- interrupt: The interrupt number to the cpu. Defines the interrupt used
>>>> +  by SOCTHERM.
>>>> +- clock-names: Input clock name, should be 'thermal_clk'.
>>>> +- clocks: phandles for clock specified in "clock-names" property.
>>>> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
>>>> +
>>>> +** Required properties for child nodes :
>>>> +
>>>> +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
>>>> +  thermal sensor. For example: <0> stands for local sensor; <1> stands for
>>>> +  acpu1 sensor;
>>>
>>> Please show an example illustrating why this property is needed. The
>>> example below doesn't show any per sensor properties aside from the
>>> sensor id. Other bindings with a similar sub-sensor hardware design like
>>> tegra-soctherm and rockchip-thermal don't have a need for a vendor
>>> specific property like this. Their drivers simply iterate over an id
>>> index during thermal sensor registration.
>>>
>>> -Matt
>>>
>> Thermal Ip of hisilicon SoC can get four module temperature--local sensor, ACPU0
>> sensor, ACPU1 sensor and gpu sensor. In order to use these sensors, this driver
>> will make use of sensor id to distinguish sensor in using process.
>>
>> These four sensors only get one sensor temperature at the same times. Because
>> these sensor commonly use the same register by setting diff value to enable one
>> sensor. howerver, sensor id is key flag for these diff sensor modules.
>>
>> If deleting sensor id, this driver will define some value which set diff sensor
>> regitser and it difficult to understand sensor register operation.
> 
> The above still do not explain why you need a specific property.
> 
> Could you please check
> Documentation/devicetree/bindings/thermal/thermal.txt file?
> 
> There are several examples there on how to define DT nodes for the exact
> case you describe above.
> 
Good comments, thank you for Matt and Valentin and I will try to satisfy thermal.txt
file to realize this driver. Please wait for the next version patches.

Thanks
Xinwei
>>
>> Thanks
>> Xinwei
>>
>>>> +
>>>> +Example :
>>>> +
>>>> +	tsensor: tsensor at 0,f7030700 {
>>>> +		compatible = "hisilicon,tsensor";
>>>> +		reg = <0x0 0xf7030700 0x0 0x1000>;
>>>> +		interrupts = <0 7 0x4>;
>>>> +		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
>>>> +		clock-names = "thermal_clk";
>>>> +		#thermal-sensor-cells = <1>;
>>>> +
>>>> +		local_sensor {
>>>> +			hisilicon,tsensor-id = <0>;
>>>> +		}
>>>> +		.......
>>>> +	}
>>>> -- 
>>>> 1.9.1
>>>>
>>>>
>>>>
>>>> _______________________________________________
>>>> linux-arm-kernel mailing list
>>>> linux-arm-kernel at lists.infradead.org
>>>> http://lists.infradead.org/mailman/listinfo/linux-arm-kernel
>>>
>>> .
>>>
>>

Re: [PATCH v2 1/2] dt-bindings: Document the hi6220 thermal sensor bindings

[Xinwei Kong]

On 2015/4/7 12:27, Eduardo Valentin wrote:
> On Tue, Apr 07, 2015 at 11:46:22AM +0800, Xinwei Kong wrote:
>>
>>
>> On 2015/4/6 22:03, Matt Porter wrote:
>>> On Tue, Mar 31, 2015 at 02:59:21PM +0800, Xinwei Kong wrote:
>>>> From: kongxinwei <kong.kongxinwei-C8/M+/jPZTeaMJb+Lgu22Q@public.gmane.org>
>>>>
>>>> This adds documentation of device tree bindings for the
>>>> thermal sensor controller of hi6220 SoC.
>>>>
>>>> Signed-off-by: Leo Yan <leo.yan-QSEj5FYQhm4dnm+yROfE0A@public.gmane.org>
>>>> Signed-off-by: kongxinwei <kong.kongxinwei-C8/M+/jPZTeaMJb+Lgu22Q@public.gmane.org>
>>>> ---
>>>>  .../bindings/thermal/hisilicon-thermal.txt         | 45 ++++++++++++++++++++++
>>>>  1 file changed, 45 insertions(+)
>>>>  create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>>>>
>>>> diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>>>> new file mode 100644
>>>> index 0000000..ceb6e2e
>>>> --- /dev/null
>>>> +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>>>> @@ -0,0 +1,45 @@
>>>> +* Hisilicon Thermal
>>>> +
>>>> +This driver is for hi6220 SoC which contain 4 thermal sensor.
>>>> +
>>>> +	1. sensor 0: local sensor;
>>>> +	2. sensor 1: remote sensor for ACPU cluster 1;
>>>> +	3. sensor 2: remote sensor for ACPU cluster 2;
>>>> +	4. sensor 3: remote sensor for GPU.
>>>> +
>>>> +Every sensor use one child node to represent it, so thermal sensor include
>>>> +parent node and four child node. The parent node describe common feature and
>>>> +child node describe private feature for thermal sensor;
>>>> +
>>>> +** Required properties :
>>>> +
>>>> +- compatible: "hisilicon,tsensor".
>>>> +- reg: physical base address of thermal sensor and length of memory mapped
>>>> +  region.
>>>> +- interrupt: The interrupt number to the cpu. Defines the interrupt used
>>>> +  by SOCTHERM.
>>>> +- clock-names: Input clock name, should be 'thermal_clk'.
>>>> +- clocks: phandles for clock specified in "clock-names" property.
>>>> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
>>>> +
>>>> +** Required properties for child nodes :
>>>> +
>>>> +- hisilicon,tsensor-id: the index of thermal sensor and use it to distinguish
>>>> +  thermal sensor. For example: <0> stands for local sensor; <1> stands for
>>>> +  acpu1 sensor;
>>>
>>> Please show an example illustrating why this property is needed. The
>>> example below doesn't show any per sensor properties aside from the
>>> sensor id. Other bindings with a similar sub-sensor hardware design like
>>> tegra-soctherm and rockchip-thermal don't have a need for a vendor
>>> specific property like this. Their drivers simply iterate over an id
>>> index during thermal sensor registration.
>>>
>>> -Matt
>>>
>> Thermal Ip of hisilicon SoC can get four module temperature--local sensor, ACPU0
>> sensor, ACPU1 sensor and gpu sensor. In order to use these sensors, this driver
>> will make use of sensor id to distinguish sensor in using process.
>>
>> These four sensors only get one sensor temperature at the same times. Because
>> these sensor commonly use the same register by setting diff value to enable one
>> sensor. howerver, sensor id is key flag for these diff sensor modules.
>>
>> If deleting sensor id, this driver will define some value which set diff sensor
>> regitser and it difficult to understand sensor register operation.
> 
> The above still do not explain why you need a specific property.
> 
> Could you please check
> Documentation/devicetree/bindings/thermal/thermal.txt file?
> 
> There are several examples there on how to define DT nodes for the exact
> case you describe above.
> 
Good comments, thank you for Matt and Valentin and I will try to satisfy thermal.txt
file to realize this driver. Please wait for the next version patches.

Thanks
Xinwei
>>
>> Thanks
>> Xinwei
>>
>>>> +
>>>> +Example :
>>>> +
>>>> +	tsensor: tsensor@0,f7030700 {
>>>> +		compatible = "hisilicon,tsensor";
>>>> +		reg = <0x0 0xf7030700 0x0 0x1000>;
>>>> +		interrupts = <0 7 0x4>;
>>>> +		clocks = <&clock_sys HI6220_TSENSOR_CLK>;
>>>> +		clock-names = "thermal_clk";
>>>> +		#thermal-sensor-cells = <1>;
>>>> +
>>>> +		local_sensor {
>>>> +			hisilicon,tsensor-id = <0>;
>>>> +		}
>>>> +		.......
>>>> +	}
>>>> -- 
>>>> 1.9.1
>>>>
>>>>
>>>>
>>>> _______________________________________________
>>>> linux-arm-kernel mailing list
>>>> linux-arm-kernel-IAPFreCvJWM7uuMidbF8XUB+6BGkLq7r@public.gmane.org
>>>> http://lists.infradead.org/mailman/listinfo/linux-arm-kernel
>>>
>>> .
>>>
>>

--
To unsubscribe from this list: send the line "unsubscribe devicetree" in
the body of a message to majordomo-u79uwXL29TY76Z2rM5mHXA@public.gmane.org
More majordomo info at  http://vger.kernel.org/majordomo-info.html

[PATCH v2 2/2] thermal: hisilicon: add new hisilicon thermal sensor driver

[Xinwei Kong]

From: kongxinwei <kong.kongxinwei@hisilicon.com>

This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
---
 drivers/thermal/Kconfig        |   8 +
 drivers/thermal/Makefile       |   1 +
 drivers/thermal/hisi_thermal.c | 475 +++++++++++++++++++++++++++++++++++++++++
 3 files changed, 484 insertions(+)
 create mode 100644 drivers/thermal/hisi_thermal.c

diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index af40db0..81aee01 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -136,6 +136,14 @@ config THERMAL_EMULATION
 	  because userland can easily disable the thermal policy by simply
 	  flooding this sysfs node with low temperature values.
 
+config HISI_THERMAL
+	tristate "Hisilicon thermal driver"
+	depends on ARCH_HISI && CPU_THERMAL && OF
+	help
+	  Enable this to plug hisilicon's thermal sensor driver into the Linux
+	  thermal framework. cpufreq is used as the cooling device to throttle
+	  CPUs when the passive trip is crossed.
+
 config IMX_THERMAL
 	tristate "Temperature sensor driver for Freescale i.MX SoCs"
 	depends on CPU_THERMAL
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index fa0dc48..08ae7ac 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -39,3 +39,4 @@ obj-$(CONFIG_TI_SOC_THERMAL)	+= ti-soc-thermal/
 obj-$(CONFIG_INT340X_THERMAL)  += int340x_thermal/
 obj-$(CONFIG_ST_THERMAL)	+= st/
 obj-$(CONFIG_TEGRA_SOCTHERM)	+= tegra_soctherm.o
+obj-$(CONFIG_HISI_THERMAL)     += hisi_thermal.o
diff --git a/drivers/thermal/hisi_thermal.c b/drivers/thermal/hisi_thermal.c
new file mode 100644
index 0000000..c03d5c3
--- /dev/null
+++ b/drivers/thermal/hisi_thermal.c
@@ -0,0 +1,475 @@
+/*
+ * Hisilicon thermal sensor driver
+ *
+ * Copyright (c) 2014-2015 Hisilicon Limited.
+ * Copyright (c) 2014-2015 Linaro Limited.
+ *
+ * Xinwei Kong <kong.kongxinwei@hisilicon.com>
+ * Leo Yan <leo.yan@linaro.org>
+ *
+ * This program is free software; you can redistribute it and/or modify
+ * it under the terms of the GNU General Public License version 2 as
+ * published by the Free Software Foundation.
+ *
+ * This program is distributed "as is" WITHOUT ANY WARRANTY of any
+ * kind, whether express or implied; without even the implied warranty
+ * of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
+ * GNU General Public License for more details.
+ */
+
+#include <linux/cpu_cooling.h>
+#include <linux/cpufreq.h>
+#include <linux/delay.h>
+#include <linux/device.h>
+#include <linux/init.h>
+#include <linux/interrupt.h>
+#include <linux/io.h>
+#include <linux/kernel.h>
+#include <linux/mfd/syscon.h>
+#include <linux/module.h>
+#include <linux/of.h>
+#include <linux/of_device.h>
+#include <linux/platform_device.h>
+#include <linux/regmap.h>
+#include <linux/slab.h>
+#include <linux/thermal.h>
+#include <linux/types.h>
+
+#include "thermal_core.h"
+
+#define TEMP0_LAG			(0x0)
+#define TEMP0_TH			(0x4)
+#define TEMP0_RST_TH			(0x8)
+#define TEMP0_CFG			(0xC)
+#define TEMP0_EN			(0x10)
+#define TEMP0_INT_EN			(0x14)
+#define TEMP0_INT_CLR			(0x18)
+#define TEMP0_RST_MSK			(0x1C)
+#define TEMP0_RAW_INT			(0x20)
+#define TEMP0_MSK_INT			(0x24)
+#define TEMP0_VALUE			(0x28)
+
+#define HISI_TEMP_BASE			(-60)
+#define HISI_TEMP_RESET		(100000)
+#define HISI_TEMP_PASSIVE		(85000)
+
+#define HISI_MAX_SENSORS		4
+
+struct hisi_thermal_sensor {
+	struct hisi_thermal_data *thermal;
+	struct thermal_zone_device *tzd;
+	const struct thermal_trip *trip;
+
+	uint32_t id;
+	uint32_t thres_temp, reset_temp;
+};
+
+struct hisi_thermal_data {
+	struct mutex thermal_lock;
+	struct platform_device *pdev;
+	struct clk *clk;
+
+	int irq, irq_bind_sensor;
+	bool irq_enabled;
+
+	unsigned int sensors_num;
+	long sensor_temp[HISI_MAX_SENSORS];
+	struct hisi_thermal_sensor sensors[HISI_MAX_SENSORS];
+
+	void __iomem *regs;
+};
+
+/* in millicelsius */
+static inline int _step_to_temp(int step)
+{
+	/*
+	 * Every step equals (1 * 200) / 255 celsius, and finally
+	 * need convert to millicelsius.
+	 */
+	return (HISI_TEMP_BASE + (step * 200 / 255)) * 1000;
+}
+
+static inline int _temp_to_step(int temp)
+{
+	return ((temp / 1000 - HISI_TEMP_BASE) * 255 / 200);
+}
+
+static long hisi_thermal_get_sensor_temp(struct hisi_thermal_data *data,
+					 struct hisi_thermal_sensor *sensor)
+{
+	int val;
+
+	mutex_lock(&data->thermal_lock);
+
+	/* disable interrupt */
+	writel(0x0, data->regs + TEMP0_INT_EN);
+	writel(0x1, data->regs + TEMP0_INT_CLR);
+
+	/* disable module firstly */
+	writel(0x0, data->regs + TEMP0_EN);
+
+	/* select sensor id */
+	writel((sensor->id << 12), data->regs + TEMP0_CFG);
+
+	/* enable module */
+	writel(0x1, data->regs + TEMP0_EN);
+
+	msleep(5);
+
+	val = readl(data->regs + TEMP0_VALUE);
+	val = _step_to_temp(val);
+
+	/* adjust for negative value */
+	val = (val < 0) ? 0 : val;
+
+	mutex_unlock(&data->thermal_lock);
+
+	return val;
+}
+
+static void hisi_thermal_bind_irq(struct hisi_thermal_data *data)
+{
+	struct hisi_thermal_sensor *sensor;
+
+	sensor = &data->sensors[data->irq_bind_sensor];
+
+	mutex_lock(&data->thermal_lock);
+
+	/* setting the hdak time */
+	writel(0x0, data->regs + TEMP0_CFG);
+
+	/* disable module firstly */
+	writel(0x0, data->regs + TEMP0_RST_MSK);
+	writel(0x0, data->regs + TEMP0_EN);
+
+	/* select sensor id */
+	writel((sensor->id << 12), data->regs + TEMP0_CFG);
+
+	/* enable for interrupt */
+	writel(_temp_to_step(sensor->thres_temp)
+			| 0x0FFFFFF00, data->regs + TEMP0_TH);
+
+	writel(_temp_to_step(HISI_TEMP_RESET), data->regs + TEMP0_RST_TH);
+
+	/* enable module */
+	writel(0x1, data->regs + TEMP0_RST_MSK);
+	writel(0x1, data->regs + TEMP0_EN);
+
+	writel(0x0, data->regs + TEMP0_INT_CLR);
+	writel(0x1, data->regs + TEMP0_INT_EN);
+	msleep(5);
+
+	mutex_unlock(&data->thermal_lock);
+
+}
+
+static void hisi_thermal_enable_sensor(struct hisi_thermal_data *data)
+{
+	hisi_thermal_bind_irq(data);
+}
+
+static void hisi_thermal_disable_sensor(struct hisi_thermal_data *data)
+{
+
+	mutex_lock(&data->thermal_lock);
+
+	/* disable sensor module */
+	writel(0x0, data->regs + TEMP0_INT_EN);
+	writel(0x0, data->regs + TEMP0_RST_MSK);
+	writel(0x0, data->regs + TEMP0_EN);
+
+	mutex_unlock(&data->thermal_lock);
+
+}
+
+static int hisi_thermal_get_temp(void *_sensor, long *temp)
+{
+	struct hisi_thermal_sensor *sensor = _sensor;
+	struct hisi_thermal_data *data = sensor->thermal;
+
+	int sensor_id = 0, i;
+	long max_temp = 0;
+
+	*temp = hisi_thermal_get_sensor_temp(data, sensor);
+
+	data->sensor_temp[sensor->id] = *temp;
+
+	for (i = 0; i < HISI_MAX_SENSORS; i++) {
+		if (data->sensor_temp[i] >= max_temp) {
+			max_temp = data->sensor_temp[i];
+			sensor_id = i;
+		}
+	}
+
+	data->irq_bind_sensor = sensor_id;
+
+	dev_dbg(&data->pdev->dev, "id=%d, irq=%d, temp=%ld, thres=%d\n",
+		sensor->id, data->irq_enabled, *temp, sensor->thres_temp);
+	/*
+	 * Bind irq to sensor for two cases:
+	 *   Reenable alarm IRQ if temperature below threshold;
+	 *   if irq has been enabled, always set it;
+	 */
+	if (!data->irq_enabled && max_temp < sensor->thres_temp) {
+		data->irq_enabled = true;
+		hisi_thermal_bind_irq(data);
+		enable_irq(data->irq);
+	} else if (data->irq_enabled)
+		hisi_thermal_bind_irq(data);
+
+	return 0;
+}
+
+static struct thermal_zone_of_device_ops hisi_of_thermal_ops = {
+	.get_temp = hisi_thermal_get_temp,
+};
+
+static irqreturn_t hisi_thermal_alarm_irq(int irq, void *dev)
+{
+	struct hisi_thermal_data *data = dev;
+
+	disable_irq_nosync(irq);
+	data->irq_enabled = false;
+
+	return IRQ_WAKE_THREAD;
+}
+
+static irqreturn_t hisi_thermal_alarm_irq_thread(int irq, void *dev)
+{
+	struct hisi_thermal_data *data = dev;
+	struct hisi_thermal_sensor *sensor;
+	int i;
+
+	sensor = &data->sensors[data->irq_bind_sensor];
+
+	dev_crit(&data->pdev->dev, "THERMAL ALARM: T > %d\n",
+		 sensor->thres_temp / 1000);
+
+	for (i = 0; i < data->sensors_num; i++)
+		thermal_zone_device_update(data->sensors[i].tzd);
+
+	return IRQ_HANDLED;
+}
+
+static int hisi_thermal_init_sensor(struct platform_device *pdev,
+					struct device_node *np,
+					struct hisi_thermal_data *data,
+					int index)
+{
+	struct hisi_thermal_sensor *sensor;
+	int ret, i;
+
+	sensor = &data->sensors[index];
+
+	ret = of_property_read_u32(np, "hisilicon,tsensor-id",
+					&sensor->id);
+	if (ret) {
+		dev_err(&pdev->dev, "failed to get id %d: %d\n", index, ret);
+		return ret;
+	}
+
+	sensor->thermal = data;
+	sensor->tzd = thermal_zone_of_sensor_register(&pdev->dev, sensor->id,
+				sensor, &hisi_of_thermal_ops);
+	if (IS_ERR(sensor->tzd)) {
+		ret = PTR_ERR(sensor->tzd);
+		dev_err(&pdev->dev, "failed to register sensor id %d: %d\n",
+			sensor->id, ret);
+		return ret;
+	}
+
+	sensor->trip = of_thermal_get_trip_points(sensor->tzd);
+
+	for (i = 0; i < of_thermal_get_ntrips(sensor->tzd); i++) {
+		if (sensor->trip[i].type == THERMAL_TRIP_PASSIVE) {
+			sensor->thres_temp = sensor->trip[i].temperature;
+			break;
+		}
+	}
+
+	return 0;
+}
+
+static int hisi_thermal_get_sensor_data(struct platform_device *pdev)
+{
+	struct hisi_thermal_data *data = platform_get_drvdata(pdev);
+	struct device_node *np = pdev->dev.of_node;
+	struct device_node *child_np;
+	int ret, i, index;
+
+	/* sensor initialization */
+	index = 0;
+	for_each_child_of_node(np, child_np) {
+
+		if (index >= HISI_MAX_SENSORS) {
+			dev_err(&pdev->dev, "unsupported sensor number\n");
+			ret = -EINVAL;
+			goto err_init_sensors;
+		}
+
+		ret = hisi_thermal_init_sensor(pdev, child_np, data, index);
+		if (ret)
+			goto err_init_sensors;
+
+		index++;
+	}
+
+	data->sensors_num = index;
+	return 0;
+
+err_init_sensors:
+	for (i = 0; i < index; i++)
+		thermal_zone_of_sensor_unregister(&pdev->dev,
+				data->sensors[i].tzd);
+	return ret;
+}
+
+static const struct of_device_id of_hisi_thermal_match[] = {
+	{ .compatible = "hisilicon,tsensor" },
+	{ /* end */ }
+};
+MODULE_DEVICE_TABLE(of, of_hisi_thermal_match);
+
+static void hisi_thermal_toggle_sensor(struct hisi_thermal_sensor *sensor,
+				       bool on)
+{
+	struct thermal_zone_device *tzd = sensor->tzd;
+
+	tzd->ops->set_mode(tzd,
+		on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
+}
+
+static int hisi_thermal_probe(struct platform_device *pdev)
+{
+	struct hisi_thermal_data *data;
+	struct resource *res;
+	int i;
+	int ret;
+
+	data = devm_kzalloc(&pdev->dev, sizeof(*data), GFP_KERNEL);
+	if (!data)
+		return -ENOMEM;
+
+	mutex_init(&data->thermal_lock);
+	data->pdev = pdev;
+
+	res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
+	data->regs = devm_ioremap_resource(&pdev->dev, res);
+	if (IS_ERR(data->regs)) {
+		dev_err(&pdev->dev, "failed to get io address\n");
+		return PTR_ERR(data->regs);
+	}
+
+	data->irq = platform_get_irq(pdev, 0);
+	if (data->irq < 0)
+		return data->irq;
+
+	ret = devm_request_threaded_irq(&pdev->dev, data->irq,
+			hisi_thermal_alarm_irq, hisi_thermal_alarm_irq_thread,
+			0, "hisi_thermal", data);
+	if (ret < 0) {
+		dev_err(&pdev->dev, "failed to request alarm irq: %d\n", ret);
+		return ret;
+	}
+
+	platform_set_drvdata(pdev, data);
+
+	data->clk = devm_clk_get(&pdev->dev, "thermal_clk");
+	if (IS_ERR(data->clk)) {
+		ret = PTR_ERR(data->clk);
+		if (ret != -EPROBE_DEFER)
+			dev_err(&pdev->dev,
+				"failed to get thermal clk: %d\n", ret);
+		return ret;
+	}
+
+	/* enable clock for thermal */
+	ret = clk_prepare_enable(data->clk);
+	if (ret) {
+		dev_err(&pdev->dev, "failed to enable thermal clk: %d\n", ret);
+		return ret;
+	}
+
+	ret = hisi_thermal_get_sensor_data(pdev);
+	if (ret) {
+		dev_err(&pdev->dev, "failed to get sensor data\n");
+		goto err_get_sensor_data;
+		return ret;
+	}
+
+	hisi_thermal_enable_sensor(data);
+	data->irq_enabled = true;
+
+	for (i = 0; i < data->sensors_num; i++)
+		hisi_thermal_toggle_sensor(&data->sensors[i], true);
+
+	return 0;
+
+err_get_sensor_data:
+	clk_disable_unprepare(data->clk);
+	return ret;
+}
+
+static int hisi_thermal_remove(struct platform_device *pdev)
+{
+	struct hisi_thermal_data *data = platform_get_drvdata(pdev);
+	int i;
+
+	for (i = 0; i < data->sensors_num; i++) {
+		struct hisi_thermal_sensor *sensor = &data->sensors[i];
+
+		hisi_thermal_toggle_sensor(sensor, false);
+		thermal_zone_of_sensor_unregister(&pdev->dev, sensor->tzd);
+	}
+
+	hisi_thermal_disable_sensor(data);
+	clk_disable_unprepare(data->clk);
+	return 0;
+}
+
+#ifdef CONFIG_PM_SLEEP
+static int hisi_thermal_suspend(struct device *dev)
+{
+	struct hisi_thermal_data *data = dev_get_drvdata(dev);
+
+	hisi_thermal_disable_sensor(data);
+	data->irq_enabled = false;
+
+	clk_disable_unprepare(data->clk);
+
+	return 0;
+}
+
+static int hisi_thermal_resume(struct device *dev)
+{
+	struct hisi_thermal_data *data = dev_get_drvdata(dev);
+
+	clk_prepare_enable(data->clk);
+
+	data->irq_enabled = true;
+	hisi_thermal_enable_sensor(data);
+
+	return 0;
+}
+#endif
+
+static SIMPLE_DEV_PM_OPS(hisi_thermal_pm_ops,
+			 hisi_thermal_suspend, hisi_thermal_resume);
+
+static struct platform_driver hisi_thermal_driver = {
+	.driver = {
+		.name	= "hisi_thermal",
+		.owner  = THIS_MODULE,
+		.pm	= &hisi_thermal_pm_ops,
+		.of_match_table = of_hisi_thermal_match,
+	},
+	.probe		= hisi_thermal_probe,
+	.remove		= hisi_thermal_remove,
+};
+
+module_platform_driver(hisi_thermal_driver);
+
+MODULE_AUTHOR("Xinwei Kong <kong.kongxinwei@hisilicon.com>");
+MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>");
+MODULE_DESCRIPTION("Hisilicon thermal driver");
+MODULE_LICENSE("GPL v2");
-- 
1.9.1

[PATCH v2 2/2] thermal: hisilicon: add new hisilicon thermal sensor driver

[Xinwei Kong]

From: kongxinwei <kong.kongxinwei@hisilicon.com>

This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
---
 drivers/thermal/Kconfig        |   8 +
 drivers/thermal/Makefile       |   1 +
 drivers/thermal/hisi_thermal.c | 475 +++++++++++++++++++++++++++++++++++++++++
 3 files changed, 484 insertions(+)
 create mode 100644 drivers/thermal/hisi_thermal.c

diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index af40db0..81aee01 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -136,6 +136,14 @@ config THERMAL_EMULATION
 	  because userland can easily disable the thermal policy by simply
 	  flooding this sysfs node with low temperature values.
 
+config HISI_THERMAL
+	tristate "Hisilicon thermal driver"
+	depends on ARCH_HISI && CPU_THERMAL && OF
+	help
+	  Enable this to plug hisilicon's thermal sensor driver into the Linux
+	  thermal framework. cpufreq is used as the cooling device to throttle
+	  CPUs when the passive trip is crossed.
+
 config IMX_THERMAL
 	tristate "Temperature sensor driver for Freescale i.MX SoCs"
 	depends on CPU_THERMAL
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index fa0dc48..08ae7ac 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -39,3 +39,4 @@ obj-$(CONFIG_TI_SOC_THERMAL)	+= ti-soc-thermal/
 obj-$(CONFIG_INT340X_THERMAL)  += int340x_thermal/
 obj-$(CONFIG_ST_THERMAL)	+= st/
 obj-$(CONFIG_TEGRA_SOCTHERM)	+= tegra_soctherm.o
+obj-$(CONFIG_HISI_THERMAL)     += hisi_thermal.o
diff --git a/drivers/thermal/hisi_thermal.c b/drivers/thermal/hisi_thermal.c
new file mode 100644
index 0000000..c03d5c3
--- /dev/null
+++ b/drivers/thermal/hisi_thermal.c
@@ -0,0 +1,475 @@
+/*
+ * Hisilicon thermal sensor driver
+ *
+ * Copyright (c) 2014-2015 Hisilicon Limited.
+ * Copyright (c) 2014-2015 Linaro Limited.
+ *
+ * Xinwei Kong <kong.kongxinwei@hisilicon.com>
+ * Leo Yan <leo.yan@linaro.org>
+ *
+ * This program is free software; you can redistribute it and/or modify
+ * it under the terms of the GNU General Public License version 2 as
+ * published by the Free Software Foundation.
+ *
+ * This program is distributed "as is" WITHOUT ANY WARRANTY of any
+ * kind, whether express or implied; without even the implied warranty
+ * of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
+ * GNU General Public License for more details.
+ */
+
+#include <linux/cpu_cooling.h>
+#include <linux/cpufreq.h>
+#include <linux/delay.h>
+#include <linux/device.h>
+#include <linux/init.h>
+#include <linux/interrupt.h>
+#include <linux/io.h>
+#include <linux/kernel.h>
+#include <linux/mfd/syscon.h>
+#include <linux/module.h>
+#include <linux/of.h>
+#include <linux/of_device.h>
+#include <linux/platform_device.h>
+#include <linux/regmap.h>
+#include <linux/slab.h>
+#include <linux/thermal.h>
+#include <linux/types.h>
+
+#include "thermal_core.h"
+
+#define TEMP0_LAG			(0x0)
+#define TEMP0_TH			(0x4)
+#define TEMP0_RST_TH			(0x8)
+#define TEMP0_CFG			(0xC)
+#define TEMP0_EN			(0x10)
+#define TEMP0_INT_EN			(0x14)
+#define TEMP0_INT_CLR			(0x18)
+#define TEMP0_RST_MSK			(0x1C)
+#define TEMP0_RAW_INT			(0x20)
+#define TEMP0_MSK_INT			(0x24)
+#define TEMP0_VALUE			(0x28)
+
+#define HISI_TEMP_BASE			(-60)
+#define HISI_TEMP_RESET		(100000)
+#define HISI_TEMP_PASSIVE		(85000)
+
+#define HISI_MAX_SENSORS		4
+
+struct hisi_thermal_sensor {
+	struct hisi_thermal_data *thermal;
+	struct thermal_zone_device *tzd;
+	const struct thermal_trip *trip;
+
+	uint32_t id;
+	uint32_t thres_temp, reset_temp;
+};
+
+struct hisi_thermal_data {
+	struct mutex thermal_lock;
+	struct platform_device *pdev;
+	struct clk *clk;
+
+	int irq, irq_bind_sensor;
+	bool irq_enabled;
+
+	unsigned int sensors_num;
+	long sensor_temp[HISI_MAX_SENSORS];
+	struct hisi_thermal_sensor sensors[HISI_MAX_SENSORS];
+
+	void __iomem *regs;
+};
+
+/* in millicelsius */
+static inline int _step_to_temp(int step)
+{
+	/*
+	 * Every step equals (1 * 200) / 255 celsius, and finally
+	 * need convert to millicelsius.
+	 */
+	return (HISI_TEMP_BASE + (step * 200 / 255)) * 1000;
+}
+
+static inline int _temp_to_step(int temp)
+{
+	return ((temp / 1000 - HISI_TEMP_BASE) * 255 / 200);
+}
+
+static long hisi_thermal_get_sensor_temp(struct hisi_thermal_data *data,
+					 struct hisi_thermal_sensor *sensor)
+{
+	int val;
+
+	mutex_lock(&data->thermal_lock);
+
+	/* disable interrupt */
+	writel(0x0, data->regs + TEMP0_INT_EN);
+	writel(0x1, data->regs + TEMP0_INT_CLR);
+
+	/* disable module firstly */
+	writel(0x0, data->regs + TEMP0_EN);
+
+	/* select sensor id */
+	writel((sensor->id << 12), data->regs + TEMP0_CFG);
+
+	/* enable module */
+	writel(0x1, data->regs + TEMP0_EN);
+
+	msleep(5);
+
+	val = readl(data->regs + TEMP0_VALUE);
+	val = _step_to_temp(val);
+
+	/* adjust for negative value */
+	val = (val < 0) ? 0 : val;
+
+	mutex_unlock(&data->thermal_lock);
+
+	return val;
+}
+
+static void hisi_thermal_bind_irq(struct hisi_thermal_data *data)
+{
+	struct hisi_thermal_sensor *sensor;
+
+	sensor = &data->sensors[data->irq_bind_sensor];
+
+	mutex_lock(&data->thermal_lock);
+
+	/* setting the hdak time */
+	writel(0x0, data->regs + TEMP0_CFG);
+
+	/* disable module firstly */
+	writel(0x0, data->regs + TEMP0_RST_MSK);
+	writel(0x0, data->regs + TEMP0_EN);
+
+	/* select sensor id */
+	writel((sensor->id << 12), data->regs + TEMP0_CFG);
+
+	/* enable for interrupt */
+	writel(_temp_to_step(sensor->thres_temp)
+			| 0x0FFFFFF00, data->regs + TEMP0_TH);
+
+	writel(_temp_to_step(HISI_TEMP_RESET), data->regs + TEMP0_RST_TH);
+
+	/* enable module */
+	writel(0x1, data->regs + TEMP0_RST_MSK);
+	writel(0x1, data->regs + TEMP0_EN);
+
+	writel(0x0, data->regs + TEMP0_INT_CLR);
+	writel(0x1, data->regs + TEMP0_INT_EN);
+	msleep(5);
+
+	mutex_unlock(&data->thermal_lock);
+
+}
+
+static void hisi_thermal_enable_sensor(struct hisi_thermal_data *data)
+{
+	hisi_thermal_bind_irq(data);
+}
+
+static void hisi_thermal_disable_sensor(struct hisi_thermal_data *data)
+{
+
+	mutex_lock(&data->thermal_lock);
+
+	/* disable sensor module */
+	writel(0x0, data->regs + TEMP0_INT_EN);
+	writel(0x0, data->regs + TEMP0_RST_MSK);
+	writel(0x0, data->regs + TEMP0_EN);
+
+	mutex_unlock(&data->thermal_lock);
+
+}
+
+static int hisi_thermal_get_temp(void *_sensor, long *temp)
+{
+	struct hisi_thermal_sensor *sensor = _sensor;
+	struct hisi_thermal_data *data = sensor->thermal;
+
+	int sensor_id = 0, i;
+	long max_temp = 0;
+
+	*temp = hisi_thermal_get_sensor_temp(data, sensor);
+
+	data->sensor_temp[sensor->id] = *temp;
+
+	for (i = 0; i < HISI_MAX_SENSORS; i++) {
+		if (data->sensor_temp[i] >= max_temp) {
+			max_temp = data->sensor_temp[i];
+			sensor_id = i;
+		}
+	}
+
+	data->irq_bind_sensor = sensor_id;
+
+	dev_dbg(&data->pdev->dev, "id=%d, irq=%d, temp=%ld, thres=%d\n",
+		sensor->id, data->irq_enabled, *temp, sensor->thres_temp);
+	/*
+	 * Bind irq to sensor for two cases:
+	 *   Reenable alarm IRQ if temperature below threshold;
+	 *   if irq has been enabled, always set it;
+	 */
+	if (!data->irq_enabled && max_temp < sensor->thres_temp) {
+		data->irq_enabled = true;
+		hisi_thermal_bind_irq(data);
+		enable_irq(data->irq);
+	} else if (data->irq_enabled)
+		hisi_thermal_bind_irq(data);
+
+	return 0;
+}
+
+static struct thermal_zone_of_device_ops hisi_of_thermal_ops = {
+	.get_temp = hisi_thermal_get_temp,
+};
+
+static irqreturn_t hisi_thermal_alarm_irq(int irq, void *dev)
+{
+	struct hisi_thermal_data *data = dev;
+
+	disable_irq_nosync(irq);
+	data->irq_enabled = false;
+
+	return IRQ_WAKE_THREAD;
+}
+
+static irqreturn_t hisi_thermal_alarm_irq_thread(int irq, void *dev)
+{
+	struct hisi_thermal_data *data = dev;
+	struct hisi_thermal_sensor *sensor;
+	int i;
+
+	sensor = &data->sensors[data->irq_bind_sensor];
+
+	dev_crit(&data->pdev->dev, "THERMAL ALARM: T > %d\n",
+		 sensor->thres_temp / 1000);
+
+	for (i = 0; i < data->sensors_num; i++)
+		thermal_zone_device_update(data->sensors[i].tzd);
+
+	return IRQ_HANDLED;
+}
+
+static int hisi_thermal_init_sensor(struct platform_device *pdev,
+					struct device_node *np,
+					struct hisi_thermal_data *data,
+					int index)
+{
+	struct hisi_thermal_sensor *sensor;
+	int ret, i;
+
+	sensor = &data->sensors[index];
+
+	ret = of_property_read_u32(np, "hisilicon,tsensor-id",
+					&sensor->id);
+	if (ret) {
+		dev_err(&pdev->dev, "failed to get id %d: %d\n", index, ret);
+		return ret;
+	}
+
+	sensor->thermal = data;
+	sensor->tzd = thermal_zone_of_sensor_register(&pdev->dev, sensor->id,
+				sensor, &hisi_of_thermal_ops);
+	if (IS_ERR(sensor->tzd)) {
+		ret = PTR_ERR(sensor->tzd);
+		dev_err(&pdev->dev, "failed to register sensor id %d: %d\n",
+			sensor->id, ret);
+		return ret;
+	}
+
+	sensor->trip = of_thermal_get_trip_points(sensor->tzd);
+
+	for (i = 0; i < of_thermal_get_ntrips(sensor->tzd); i++) {
+		if (sensor->trip[i].type == THERMAL_TRIP_PASSIVE) {
+			sensor->thres_temp = sensor->trip[i].temperature;
+			break;
+		}
+	}
+
+	return 0;
+}
+
+static int hisi_thermal_get_sensor_data(struct platform_device *pdev)
+{
+	struct hisi_thermal_data *data = platform_get_drvdata(pdev);
+	struct device_node *np = pdev->dev.of_node;
+	struct device_node *child_np;
+	int ret, i, index;
+
+	/* sensor initialization */
+	index = 0;
+	for_each_child_of_node(np, child_np) {
+
+		if (index >= HISI_MAX_SENSORS) {
+			dev_err(&pdev->dev, "unsupported sensor number\n");
+			ret = -EINVAL;
+			goto err_init_sensors;
+		}
+
+		ret = hisi_thermal_init_sensor(pdev, child_np, data, index);
+		if (ret)
+			goto err_init_sensors;
+
+		index++;
+	}
+
+	data->sensors_num = index;
+	return 0;
+
+err_init_sensors:
+	for (i = 0; i < index; i++)
+		thermal_zone_of_sensor_unregister(&pdev->dev,
+				data->sensors[i].tzd);
+	return ret;
+}
+
+static const struct of_device_id of_hisi_thermal_match[] = {
+	{ .compatible = "hisilicon,tsensor" },
+	{ /* end */ }
+};
+MODULE_DEVICE_TABLE(of, of_hisi_thermal_match);
+
+static void hisi_thermal_toggle_sensor(struct hisi_thermal_sensor *sensor,
+				       bool on)
+{
+	struct thermal_zone_device *tzd = sensor->tzd;
+
+	tzd->ops->set_mode(tzd,
+		on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
+}
+
+static int hisi_thermal_probe(struct platform_device *pdev)
+{
+	struct hisi_thermal_data *data;
+	struct resource *res;
+	int i;
+	int ret;
+
+	data = devm_kzalloc(&pdev->dev, sizeof(*data), GFP_KERNEL);
+	if (!data)
+		return -ENOMEM;
+
+	mutex_init(&data->thermal_lock);
+	data->pdev = pdev;
+
+	res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
+	data->regs = devm_ioremap_resource(&pdev->dev, res);
+	if (IS_ERR(data->regs)) {
+		dev_err(&pdev->dev, "failed to get io address\n");
+		return PTR_ERR(data->regs);
+	}
+
+	data->irq = platform_get_irq(pdev, 0);
+	if (data->irq < 0)
+		return data->irq;
+
+	ret = devm_request_threaded_irq(&pdev->dev, data->irq,
+			hisi_thermal_alarm_irq, hisi_thermal_alarm_irq_thread,
+			0, "hisi_thermal", data);
+	if (ret < 0) {
+		dev_err(&pdev->dev, "failed to request alarm irq: %d\n", ret);
+		return ret;
+	}
+
+	platform_set_drvdata(pdev, data);
+
+	data->clk = devm_clk_get(&pdev->dev, "thermal_clk");
+	if (IS_ERR(data->clk)) {
+		ret = PTR_ERR(data->clk);
+		if (ret != -EPROBE_DEFER)
+			dev_err(&pdev->dev,
+				"failed to get thermal clk: %d\n", ret);
+		return ret;
+	}
+
+	/* enable clock for thermal */
+	ret = clk_prepare_enable(data->clk);
+	if (ret) {
+		dev_err(&pdev->dev, "failed to enable thermal clk: %d\n", ret);
+		return ret;
+	}
+
+	ret = hisi_thermal_get_sensor_data(pdev);
+	if (ret) {
+		dev_err(&pdev->dev, "failed to get sensor data\n");
+		goto err_get_sensor_data;
+		return ret;
+	}
+
+	hisi_thermal_enable_sensor(data);
+	data->irq_enabled = true;
+
+	for (i = 0; i < data->sensors_num; i++)
+		hisi_thermal_toggle_sensor(&data->sensors[i], true);
+
+	return 0;
+
+err_get_sensor_data:
+	clk_disable_unprepare(data->clk);
+	return ret;
+}
+
+static int hisi_thermal_remove(struct platform_device *pdev)
+{
+	struct hisi_thermal_data *data = platform_get_drvdata(pdev);
+	int i;
+
+	for (i = 0; i < data->sensors_num; i++) {
+		struct hisi_thermal_sensor *sensor = &data->sensors[i];
+
+		hisi_thermal_toggle_sensor(sensor, false);
+		thermal_zone_of_sensor_unregister(&pdev->dev, sensor->tzd);
+	}
+
+	hisi_thermal_disable_sensor(data);
+	clk_disable_unprepare(data->clk);
+	return 0;
+}
+
+#ifdef CONFIG_PM_SLEEP
+static int hisi_thermal_suspend(struct device *dev)
+{
+	struct hisi_thermal_data *data = dev_get_drvdata(dev);
+
+	hisi_thermal_disable_sensor(data);
+	data->irq_enabled = false;
+
+	clk_disable_unprepare(data->clk);
+
+	return 0;
+}
+
+static int hisi_thermal_resume(struct device *dev)
+{
+	struct hisi_thermal_data *data = dev_get_drvdata(dev);
+
+	clk_prepare_enable(data->clk);
+
+	data->irq_enabled = true;
+	hisi_thermal_enable_sensor(data);
+
+	return 0;
+}
+#endif
+
+static SIMPLE_DEV_PM_OPS(hisi_thermal_pm_ops,
+			 hisi_thermal_suspend, hisi_thermal_resume);
+
+static struct platform_driver hisi_thermal_driver = {
+	.driver = {
+		.name	= "hisi_thermal",
+		.owner  = THIS_MODULE,
+		.pm	= &hisi_thermal_pm_ops,
+		.of_match_table = of_hisi_thermal_match,
+	},
+	.probe		= hisi_thermal_probe,
+	.remove		= hisi_thermal_remove,
+};
+
+module_platform_driver(hisi_thermal_driver);
+
+MODULE_AUTHOR("Xinwei Kong <kong.kongxinwei@hisilicon.com>");
+MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>");
+MODULE_DESCRIPTION("Hisilicon thermal driver");
+MODULE_LICENSE("GPL v2");
-- 
1.9.1

[PATCH v2 2/2] thermal: hisilicon: add new hisilicon thermal sensor driver

[Xinwei Kong]

From: kongxinwei <kong.kongxinwei@hisilicon.com>

This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
---
 drivers/thermal/Kconfig        |   8 +
 drivers/thermal/Makefile       |   1 +
 drivers/thermal/hisi_thermal.c | 475 +++++++++++++++++++++++++++++++++++++++++
 3 files changed, 484 insertions(+)
 create mode 100644 drivers/thermal/hisi_thermal.c

diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index af40db0..81aee01 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -136,6 +136,14 @@ config THERMAL_EMULATION
 	  because userland can easily disable the thermal policy by simply
 	  flooding this sysfs node with low temperature values.
 
+config HISI_THERMAL
+	tristate "Hisilicon thermal driver"
+	depends on ARCH_HISI && CPU_THERMAL && OF
+	help
+	  Enable this to plug hisilicon's thermal sensor driver into the Linux
+	  thermal framework. cpufreq is used as the cooling device to throttle
+	  CPUs when the passive trip is crossed.
+
 config IMX_THERMAL
 	tristate "Temperature sensor driver for Freescale i.MX SoCs"
 	depends on CPU_THERMAL
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index fa0dc48..08ae7ac 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -39,3 +39,4 @@ obj-$(CONFIG_TI_SOC_THERMAL)	+= ti-soc-thermal/
 obj-$(CONFIG_INT340X_THERMAL)  += int340x_thermal/
 obj-$(CONFIG_ST_THERMAL)	+= st/
 obj-$(CONFIG_TEGRA_SOCTHERM)	+= tegra_soctherm.o
+obj-$(CONFIG_HISI_THERMAL)     += hisi_thermal.o
diff --git a/drivers/thermal/hisi_thermal.c b/drivers/thermal/hisi_thermal.c
new file mode 100644
index 0000000..c03d5c3
--- /dev/null
+++ b/drivers/thermal/hisi_thermal.c
@@ -0,0 +1,475 @@
+/*
+ * Hisilicon thermal sensor driver
+ *
+ * Copyright (c) 2014-2015 Hisilicon Limited.
+ * Copyright (c) 2014-2015 Linaro Limited.
+ *
+ * Xinwei Kong <kong.kongxinwei@hisilicon.com>
+ * Leo Yan <leo.yan@linaro.org>
+ *
+ * This program is free software; you can redistribute it and/or modify
+ * it under the terms of the GNU General Public License version 2 as
+ * published by the Free Software Foundation.
+ *
+ * This program is distributed "as is" WITHOUT ANY WARRANTY of any
+ * kind, whether express or implied; without even the implied warranty
+ * of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
+ * GNU General Public License for more details.
+ */
+
+#include <linux/cpu_cooling.h>
+#include <linux/cpufreq.h>
+#include <linux/delay.h>
+#include <linux/device.h>
+#include <linux/init.h>
+#include <linux/interrupt.h>
+#include <linux/io.h>
+#include <linux/kernel.h>
+#include <linux/mfd/syscon.h>
+#include <linux/module.h>
+#include <linux/of.h>
+#include <linux/of_device.h>
+#include <linux/platform_device.h>
+#include <linux/regmap.h>
+#include <linux/slab.h>
+#include <linux/thermal.h>
+#include <linux/types.h>
+
+#include "thermal_core.h"
+
+#define TEMP0_LAG			(0x0)
+#define TEMP0_TH			(0x4)
+#define TEMP0_RST_TH			(0x8)
+#define TEMP0_CFG			(0xC)
+#define TEMP0_EN			(0x10)
+#define TEMP0_INT_EN			(0x14)
+#define TEMP0_INT_CLR			(0x18)
+#define TEMP0_RST_MSK			(0x1C)
+#define TEMP0_RAW_INT			(0x20)
+#define TEMP0_MSK_INT			(0x24)
+#define TEMP0_VALUE			(0x28)
+
+#define HISI_TEMP_BASE			(-60)
+#define HISI_TEMP_RESET		(100000)
+#define HISI_TEMP_PASSIVE		(85000)
+
+#define HISI_MAX_SENSORS		4
+
+struct hisi_thermal_sensor {
+	struct hisi_thermal_data *thermal;
+	struct thermal_zone_device *tzd;
+	const struct thermal_trip *trip;
+
+	uint32_t id;
+	uint32_t thres_temp, reset_temp;
+};
+
+struct hisi_thermal_data {
+	struct mutex thermal_lock;
+	struct platform_device *pdev;
+	struct clk *clk;
+
+	int irq, irq_bind_sensor;
+	bool irq_enabled;
+
+	unsigned int sensors_num;
+	long sensor_temp[HISI_MAX_SENSORS];
+	struct hisi_thermal_sensor sensors[HISI_MAX_SENSORS];
+
+	void __iomem *regs;
+};
+
+/* in millicelsius */
+static inline int _step_to_temp(int step)
+{
+	/*
+	 * Every step equals (1 * 200) / 255 celsius, and finally
+	 * need convert to millicelsius.
+	 */
+	return (HISI_TEMP_BASE + (step * 200 / 255)) * 1000;
+}
+
+static inline int _temp_to_step(int temp)
+{
+	return ((temp / 1000 - HISI_TEMP_BASE) * 255 / 200);
+}
+
+static long hisi_thermal_get_sensor_temp(struct hisi_thermal_data *data,
+					 struct hisi_thermal_sensor *sensor)
+{
+	int val;
+
+	mutex_lock(&data->thermal_lock);
+
+	/* disable interrupt */
+	writel(0x0, data->regs + TEMP0_INT_EN);
+	writel(0x1, data->regs + TEMP0_INT_CLR);
+
+	/* disable module firstly */
+	writel(0x0, data->regs + TEMP0_EN);
+
+	/* select sensor id */
+	writel((sensor->id << 12), data->regs + TEMP0_CFG);
+
+	/* enable module */
+	writel(0x1, data->regs + TEMP0_EN);
+
+	msleep(5);
+
+	val = readl(data->regs + TEMP0_VALUE);
+	val = _step_to_temp(val);
+
+	/* adjust for negative value */
+	val = (val < 0) ? 0 : val;
+
+	mutex_unlock(&data->thermal_lock);
+
+	return val;
+}
+
+static void hisi_thermal_bind_irq(struct hisi_thermal_data *data)
+{
+	struct hisi_thermal_sensor *sensor;
+
+	sensor = &data->sensors[data->irq_bind_sensor];
+
+	mutex_lock(&data->thermal_lock);
+
+	/* setting the hdak time */
+	writel(0x0, data->regs + TEMP0_CFG);
+
+	/* disable module firstly */
+	writel(0x0, data->regs + TEMP0_RST_MSK);
+	writel(0x0, data->regs + TEMP0_EN);
+
+	/* select sensor id */
+	writel((sensor->id << 12), data->regs + TEMP0_CFG);
+
+	/* enable for interrupt */
+	writel(_temp_to_step(sensor->thres_temp)
+			| 0x0FFFFFF00, data->regs + TEMP0_TH);
+
+	writel(_temp_to_step(HISI_TEMP_RESET), data->regs + TEMP0_RST_TH);
+
+	/* enable module */
+	writel(0x1, data->regs + TEMP0_RST_MSK);
+	writel(0x1, data->regs + TEMP0_EN);
+
+	writel(0x0, data->regs + TEMP0_INT_CLR);
+	writel(0x1, data->regs + TEMP0_INT_EN);
+	msleep(5);
+
+	mutex_unlock(&data->thermal_lock);
+
+}
+
+static void hisi_thermal_enable_sensor(struct hisi_thermal_data *data)
+{
+	hisi_thermal_bind_irq(data);
+}
+
+static void hisi_thermal_disable_sensor(struct hisi_thermal_data *data)
+{
+
+	mutex_lock(&data->thermal_lock);
+
+	/* disable sensor module */
+	writel(0x0, data->regs + TEMP0_INT_EN);
+	writel(0x0, data->regs + TEMP0_RST_MSK);
+	writel(0x0, data->regs + TEMP0_EN);
+
+	mutex_unlock(&data->thermal_lock);
+
+}
+
+static int hisi_thermal_get_temp(void *_sensor, long *temp)
+{
+	struct hisi_thermal_sensor *sensor = _sensor;
+	struct hisi_thermal_data *data = sensor->thermal;
+
+	int sensor_id = 0, i;
+	long max_temp = 0;
+
+	*temp = hisi_thermal_get_sensor_temp(data, sensor);
+
+	data->sensor_temp[sensor->id] = *temp;
+
+	for (i = 0; i < HISI_MAX_SENSORS; i++) {
+		if (data->sensor_temp[i] >= max_temp) {
+			max_temp = data->sensor_temp[i];
+			sensor_id = i;
+		}
+	}
+
+	data->irq_bind_sensor = sensor_id;
+
+	dev_dbg(&data->pdev->dev, "id=%d, irq=%d, temp=%ld, thres=%d\n",
+		sensor->id, data->irq_enabled, *temp, sensor->thres_temp);
+	/*
+	 * Bind irq to sensor for two cases:
+	 *   Reenable alarm IRQ if temperature below threshold;
+	 *   if irq has been enabled, always set it;
+	 */
+	if (!data->irq_enabled && max_temp < sensor->thres_temp) {
+		data->irq_enabled = true;
+		hisi_thermal_bind_irq(data);
+		enable_irq(data->irq);
+	} else if (data->irq_enabled)
+		hisi_thermal_bind_irq(data);
+
+	return 0;
+}
+
+static struct thermal_zone_of_device_ops hisi_of_thermal_ops = {
+	.get_temp = hisi_thermal_get_temp,
+};
+
+static irqreturn_t hisi_thermal_alarm_irq(int irq, void *dev)
+{
+	struct hisi_thermal_data *data = dev;
+
+	disable_irq_nosync(irq);
+	data->irq_enabled = false;
+
+	return IRQ_WAKE_THREAD;
+}
+
+static irqreturn_t hisi_thermal_alarm_irq_thread(int irq, void *dev)
+{
+	struct hisi_thermal_data *data = dev;
+	struct hisi_thermal_sensor *sensor;
+	int i;
+
+	sensor = &data->sensors[data->irq_bind_sensor];
+
+	dev_crit(&data->pdev->dev, "THERMAL ALARM: T > %d\n",
+		 sensor->thres_temp / 1000);
+
+	for (i = 0; i < data->sensors_num; i++)
+		thermal_zone_device_update(data->sensors[i].tzd);
+
+	return IRQ_HANDLED;
+}
+
+static int hisi_thermal_init_sensor(struct platform_device *pdev,
+					struct device_node *np,
+					struct hisi_thermal_data *data,
+					int index)
+{
+	struct hisi_thermal_sensor *sensor;
+	int ret, i;
+
+	sensor = &data->sensors[index];
+
+	ret = of_property_read_u32(np, "hisilicon,tsensor-id",
+					&sensor->id);
+	if (ret) {
+		dev_err(&pdev->dev, "failed to get id %d: %d\n", index, ret);
+		return ret;
+	}
+
+	sensor->thermal = data;
+	sensor->tzd = thermal_zone_of_sensor_register(&pdev->dev, sensor->id,
+				sensor, &hisi_of_thermal_ops);
+	if (IS_ERR(sensor->tzd)) {
+		ret = PTR_ERR(sensor->tzd);
+		dev_err(&pdev->dev, "failed to register sensor id %d: %d\n",
+			sensor->id, ret);
+		return ret;
+	}
+
+	sensor->trip = of_thermal_get_trip_points(sensor->tzd);
+
+	for (i = 0; i < of_thermal_get_ntrips(sensor->tzd); i++) {
+		if (sensor->trip[i].type == THERMAL_TRIP_PASSIVE) {
+			sensor->thres_temp = sensor->trip[i].temperature;
+			break;
+		}
+	}
+
+	return 0;
+}
+
+static int hisi_thermal_get_sensor_data(struct platform_device *pdev)
+{
+	struct hisi_thermal_data *data = platform_get_drvdata(pdev);
+	struct device_node *np = pdev->dev.of_node;
+	struct device_node *child_np;
+	int ret, i, index;
+
+	/* sensor initialization */
+	index = 0;
+	for_each_child_of_node(np, child_np) {
+
+		if (index >= HISI_MAX_SENSORS) {
+			dev_err(&pdev->dev, "unsupported sensor number\n");
+			ret = -EINVAL;
+			goto err_init_sensors;
+		}
+
+		ret = hisi_thermal_init_sensor(pdev, child_np, data, index);
+		if (ret)
+			goto err_init_sensors;
+
+		index++;
+	}
+
+	data->sensors_num = index;
+	return 0;
+
+err_init_sensors:
+	for (i = 0; i < index; i++)
+		thermal_zone_of_sensor_unregister(&pdev->dev,
+				data->sensors[i].tzd);
+	return ret;
+}
+
+static const struct of_device_id of_hisi_thermal_match[] = {
+	{ .compatible = "hisilicon,tsensor" },
+	{ /* end */ }
+};
+MODULE_DEVICE_TABLE(of, of_hisi_thermal_match);
+
+static void hisi_thermal_toggle_sensor(struct hisi_thermal_sensor *sensor,
+				       bool on)
+{
+	struct thermal_zone_device *tzd = sensor->tzd;
+
+	tzd->ops->set_mode(tzd,
+		on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
+}
+
+static int hisi_thermal_probe(struct platform_device *pdev)
+{
+	struct hisi_thermal_data *data;
+	struct resource *res;
+	int i;
+	int ret;
+
+	data = devm_kzalloc(&pdev->dev, sizeof(*data), GFP_KERNEL);
+	if (!data)
+		return -ENOMEM;
+
+	mutex_init(&data->thermal_lock);
+	data->pdev = pdev;
+
+	res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
+	data->regs = devm_ioremap_resource(&pdev->dev, res);
+	if (IS_ERR(data->regs)) {
+		dev_err(&pdev->dev, "failed to get io address\n");
+		return PTR_ERR(data->regs);
+	}
+
+	data->irq = platform_get_irq(pdev, 0);
+	if (data->irq < 0)
+		return data->irq;
+
+	ret = devm_request_threaded_irq(&pdev->dev, data->irq,
+			hisi_thermal_alarm_irq, hisi_thermal_alarm_irq_thread,
+			0, "hisi_thermal", data);
+	if (ret < 0) {
+		dev_err(&pdev->dev, "failed to request alarm irq: %d\n", ret);
+		return ret;
+	}
+
+	platform_set_drvdata(pdev, data);
+
+	data->clk = devm_clk_get(&pdev->dev, "thermal_clk");
+	if (IS_ERR(data->clk)) {
+		ret = PTR_ERR(data->clk);
+		if (ret != -EPROBE_DEFER)
+			dev_err(&pdev->dev,
+				"failed to get thermal clk: %d\n", ret);
+		return ret;
+	}
+
+	/* enable clock for thermal */
+	ret = clk_prepare_enable(data->clk);
+	if (ret) {
+		dev_err(&pdev->dev, "failed to enable thermal clk: %d\n", ret);
+		return ret;
+	}
+
+	ret = hisi_thermal_get_sensor_data(pdev);
+	if (ret) {
+		dev_err(&pdev->dev, "failed to get sensor data\n");
+		goto err_get_sensor_data;
+		return ret;
+	}
+
+	hisi_thermal_enable_sensor(data);
+	data->irq_enabled = true;
+
+	for (i = 0; i < data->sensors_num; i++)
+		hisi_thermal_toggle_sensor(&data->sensors[i], true);
+
+	return 0;
+
+err_get_sensor_data:
+	clk_disable_unprepare(data->clk);
+	return ret;
+}
+
+static int hisi_thermal_remove(struct platform_device *pdev)
+{
+	struct hisi_thermal_data *data = platform_get_drvdata(pdev);
+	int i;
+
+	for (i = 0; i < data->sensors_num; i++) {
+		struct hisi_thermal_sensor *sensor = &data->sensors[i];
+
+		hisi_thermal_toggle_sensor(sensor, false);
+		thermal_zone_of_sensor_unregister(&pdev->dev, sensor->tzd);
+	}
+
+	hisi_thermal_disable_sensor(data);
+	clk_disable_unprepare(data->clk);
+	return 0;
+}
+
+#ifdef CONFIG_PM_SLEEP
+static int hisi_thermal_suspend(struct device *dev)
+{
+	struct hisi_thermal_data *data = dev_get_drvdata(dev);
+
+	hisi_thermal_disable_sensor(data);
+	data->irq_enabled = false;
+
+	clk_disable_unprepare(data->clk);
+
+	return 0;
+}
+
+static int hisi_thermal_resume(struct device *dev)
+{
+	struct hisi_thermal_data *data = dev_get_drvdata(dev);
+
+	clk_prepare_enable(data->clk);
+
+	data->irq_enabled = true;
+	hisi_thermal_enable_sensor(data);
+
+	return 0;
+}
+#endif
+
+static SIMPLE_DEV_PM_OPS(hisi_thermal_pm_ops,
+			 hisi_thermal_suspend, hisi_thermal_resume);
+
+static struct platform_driver hisi_thermal_driver = {
+	.driver = {
+		.name	= "hisi_thermal",
+		.owner  = THIS_MODULE,
+		.pm	= &hisi_thermal_pm_ops,
+		.of_match_table = of_hisi_thermal_match,
+	},
+	.probe		= hisi_thermal_probe,
+	.remove		= hisi_thermal_remove,
+};
+
+module_platform_driver(hisi_thermal_driver);
+
+MODULE_AUTHOR("Xinwei Kong <kong.kongxinwei@hisilicon.com>");
+MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>");
+MODULE_DESCRIPTION("Hisilicon thermal driver");
+MODULE_LICENSE("GPL v2");
-- 
1.9.1