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From: Len Brown <lenb@kernel.org>
To: x86@kernel.org
Cc: linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
	Len Brown <len.brown@intel.com>,
	linux-pm@vger.kernel.org
Subject: [PATCH 07/19] powercap/intel_rapl: Support multi-die/package
Date: Mon, 13 May 2019 13:58:51 -0400	[thread overview]
Message-ID: <9fcb4719aeb7efccf3bc75ed8dd559e46121649f.1557769318.git.len.brown@intel.com> (raw)
In-Reply-To: <7b23d2d26d717b8e14ba137c94b70943f1ae4b5c.1557769318.git.len.brown@intel.com>

From: Zhang Rui <rui.zhang@intel.com>

RAPL "package" domains are actually implemented in hardware per-die.
Thus, the new multi-die/package systems have mulitple domains
within each physical package.

Update the intel_rapl driver to be "die aware" -- exporting multiple
domains within a single package, when present.
No change on single die/package systems.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Cc: linux-pm@vger.kernel.org
---
 drivers/powercap/intel_rapl.c | 4 ++--
 1 file changed, 2 insertions(+), 2 deletions(-)

diff --git a/drivers/powercap/intel_rapl.c b/drivers/powercap/intel_rapl.c
index 3c3c0c23180b..9202dbcef96d 100644
--- a/drivers/powercap/intel_rapl.c
+++ b/drivers/powercap/intel_rapl.c
@@ -266,7 +266,7 @@ static struct rapl_domain *platform_rapl_domain; /* Platform (PSys) domain */
 /* caller to ensure CPU hotplug lock is held */
 static struct rapl_package *rapl_find_package_domain(int cpu)
 {
-	int id = topology_physical_package_id(cpu);
+	int id = topology_logical_die_id(cpu);
 	struct rapl_package *rp;
 
 	list_for_each_entry(rp, &rapl_packages, plist) {
@@ -1459,7 +1459,7 @@ static void rapl_remove_package(struct rapl_package *rp)
 /* called from CPU hotplug notifier, hotplug lock held */
 static struct rapl_package *rapl_add_package(int cpu)
 {
-	int id = topology_physical_package_id(cpu);
+	int id = topology_logical_die_id(cpu);
 	struct rapl_package *rp;
 	int ret;
 
-- 
2.18.0-rc0


  parent reply	other threads:[~2019-05-13 17:59 UTC|newest]

Thread overview: 42+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2019-05-13 17:58 [PATCH 0/19] v6 multi-die/package topology support Len Brown
2019-05-13 17:58 ` [PATCH 01/19] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-05-13 17:58   ` [PATCH 02/19] x86 topology: Create topology_max_die_per_package() Len Brown
2019-05-23  9:23     ` [tip:x86/topology] x86/topology: " tip-bot for Len Brown
2019-05-13 17:58   ` [PATCH 03/19] cpu topology: Export die_id Len Brown
2019-05-23  9:24     ` [tip:x86/topology] cpu/topology: " tip-bot for Len Brown
2019-05-13 17:58   ` [PATCH 04/19] x86 topology: Define topology_die_id() Len Brown
2019-05-23  9:24     ` [tip:x86/topology] x86/topology: " tip-bot for Len Brown
2019-05-13 17:58   ` [PATCH 05/19] x86 topology: Define topology_logical_die_id() Len Brown
2019-05-23  9:25     ` [tip:x86/topology] x86/topology: " tip-bot for Len Brown
2019-05-13 17:58   ` [PATCH 06/19] powercap/intel_rapl: Simplify rapl_find_package() Len Brown
2019-05-23  9:26     ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58   ` Len Brown [this message]
2019-05-23  9:26     ` [tip:x86/topology] powercap/intel_rapl: Support multi-die/package tip-bot for Zhang Rui
2019-05-13 17:58   ` [PATCH 08/19] thermal/x86_pkg_temp_thermal: " Len Brown
2019-05-23  9:27     ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58   ` [PATCH 09/19] powercap/intel_rapl: Update RAPL domain name and debug messages Len Brown
2019-05-23  9:28     ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58   ` [PATCH 10/19] hwmon/coretemp: Support multi-die/package Len Brown
2019-05-23  9:29     ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58   ` [PATCH 11/19] topology: Create package_cpus sysfs attribute Len Brown
2019-05-23  9:29     ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:58   ` [PATCH 12/19] topology: Create core_cpus and die_cpus sysfs attributes Len Brown
2019-05-23  9:30     ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:58   ` [PATCH 13/19] perf/x86/intel/uncore: Support multi-die/package Len Brown
2019-05-23  9:31     ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:58   ` [PATCH 14/19] perf/x86/intel/rapl: " Len Brown
2019-05-23  9:31     ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:58   ` [PATCH 15/19] perf/x86/intel/cstate: " Len Brown
2019-05-23  9:32     ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:59   ` [PATCH 16/19] thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages Len Brown
2019-05-23  9:33     ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:59   ` [PATCH 17/19] hwmon/coretemp: " Len Brown
2019-05-23  9:34     ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:59   ` [PATCH 18/19] perf/x86/intel/uncore: Cosmetic renames in response to multi-die/pkg support Len Brown
2019-05-23  9:34     ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:59   ` [PATCH 19/19] perf/x86/intel/rapl: Cosmetic rename internal variables " Len Brown
2019-05-23  9:35     ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-23  9:22   ` [tip:x86/topology] x86/topology: Add CPUID.1F multi-die/package support tip-bot for Len Brown
2019-05-15  8:55 ` [PATCH 0/19] v6 multi-die/package topology support Peter Zijlstra
2019-05-15 16:38   ` Ingo Molnar
2019-05-22 20:44 ` Ingo Molnar

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