From: tip-bot for Zhang Rui <tipbot@zytor.com>
To: linux-tip-commits@vger.kernel.org
Cc: len.brown@intel.com, linux-kernel@vger.kernel.org, hpa@zytor.com,
mingo@kernel.org, tglx@linutronix.de, rui.zhang@intel.com,
peterz@infradead.org
Subject: [tip:x86/topology] thermal/x86_pkg_temp_thermal: Support multi-die/package
Date: Thu, 23 May 2019 02:27:38 -0700 [thread overview]
Message-ID: <tip-724adec33c2491f26f739f285ddca25fca226e48@git.kernel.org> (raw)
In-Reply-To: <281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com>
Commit-ID: 724adec33c2491f26f739f285ddca25fca226e48
Gitweb: https://git.kernel.org/tip/724adec33c2491f26f739f285ddca25fca226e48
Author: Zhang Rui <rui.zhang@intel.com>
AuthorDate: Mon, 13 May 2019 13:58:52 -0400
Committer: Thomas Gleixner <tglx@linutronix.de>
CommitDate: Thu, 23 May 2019 10:08:33 +0200
thermal/x86_pkg_temp_thermal: Support multi-die/package
Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.
Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com
---
drivers/thermal/intel/x86_pkg_temp_thermal.c | 8 ++++----
1 file changed, 4 insertions(+), 4 deletions(-)
diff --git a/drivers/thermal/intel/x86_pkg_temp_thermal.c b/drivers/thermal/intel/x86_pkg_temp_thermal.c
index 1ef937d799e4..405b3858900a 100644
--- a/drivers/thermal/intel/x86_pkg_temp_thermal.c
+++ b/drivers/thermal/intel/x86_pkg_temp_thermal.c
@@ -122,7 +122,7 @@ err_out:
*/
static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
{
- int pkgid = topology_logical_package_id(cpu);
+ int pkgid = topology_logical_die_id(cpu);
if (pkgid >= 0 && pkgid < max_packages)
return packages[pkgid];
@@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)
static int pkg_temp_thermal_device_add(unsigned int cpu)
{
- int pkgid = topology_logical_package_id(cpu);
+ int pkgid = topology_logical_die_id(cpu);
u32 tj_max, eax, ebx, ecx, edx;
struct pkg_device *pkgdev;
int thres_count, err;
@@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
* worker will see the package anymore.
*/
if (lastcpu) {
- packages[topology_logical_package_id(cpu)] = NULL;
+ packages[topology_logical_die_id(cpu)] = NULL;
/* After this point nothing touches the MSR anymore. */
wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
@@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void)
if (!x86_match_cpu(pkg_temp_thermal_ids))
return -ENODEV;
- max_packages = topology_max_packages();
+ max_packages = topology_max_packages() * topology_max_die_per_package();
packages = kcalloc(max_packages, sizeof(struct pkg_device *),
GFP_KERNEL);
if (!packages)
next prev parent reply other threads:[~2019-05-23 9:27 UTC|newest]
Thread overview: 42+ messages / expand[flat|nested] mbox.gz Atom feed top
2019-05-13 17:58 [PATCH 0/19] v6 multi-die/package topology support Len Brown
2019-05-13 17:58 ` [PATCH 01/19] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-05-13 17:58 ` [PATCH 02/19] x86 topology: Create topology_max_die_per_package() Len Brown
2019-05-23 9:23 ` [tip:x86/topology] x86/topology: " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 03/19] cpu topology: Export die_id Len Brown
2019-05-23 9:24 ` [tip:x86/topology] cpu/topology: " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 04/19] x86 topology: Define topology_die_id() Len Brown
2019-05-23 9:24 ` [tip:x86/topology] x86/topology: " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 05/19] x86 topology: Define topology_logical_die_id() Len Brown
2019-05-23 9:25 ` [tip:x86/topology] x86/topology: " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 06/19] powercap/intel_rapl: Simplify rapl_find_package() Len Brown
2019-05-23 9:26 ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 07/19] powercap/intel_rapl: Support multi-die/package Len Brown
2019-05-23 9:26 ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 08/19] thermal/x86_pkg_temp_thermal: " Len Brown
2019-05-23 9:27 ` tip-bot for Zhang Rui [this message]
2019-05-13 17:58 ` [PATCH 09/19] powercap/intel_rapl: Update RAPL domain name and debug messages Len Brown
2019-05-23 9:28 ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 10/19] hwmon/coretemp: Support multi-die/package Len Brown
2019-05-23 9:29 ` [tip:x86/topology] " tip-bot for Zhang Rui
2019-05-13 17:58 ` [PATCH 11/19] topology: Create package_cpus sysfs attribute Len Brown
2019-05-23 9:29 ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 12/19] topology: Create core_cpus and die_cpus sysfs attributes Len Brown
2019-05-23 9:30 ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:58 ` [PATCH 13/19] perf/x86/intel/uncore: Support multi-die/package Len Brown
2019-05-23 9:31 ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:58 ` [PATCH 14/19] perf/x86/intel/rapl: " Len Brown
2019-05-23 9:31 ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:58 ` [PATCH 15/19] perf/x86/intel/cstate: " Len Brown
2019-05-23 9:32 ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:59 ` [PATCH 16/19] thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages Len Brown
2019-05-23 9:33 ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:59 ` [PATCH 17/19] hwmon/coretemp: " Len Brown
2019-05-23 9:34 ` [tip:x86/topology] " tip-bot for Len Brown
2019-05-13 17:59 ` [PATCH 18/19] perf/x86/intel/uncore: Cosmetic renames in response to multi-die/pkg support Len Brown
2019-05-23 9:34 ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-13 17:59 ` [PATCH 19/19] perf/x86/intel/rapl: Cosmetic rename internal variables " Len Brown
2019-05-23 9:35 ` [tip:x86/topology] " tip-bot for Kan Liang
2019-05-23 9:22 ` [tip:x86/topology] x86/topology: Add CPUID.1F multi-die/package support tip-bot for Len Brown
2019-05-15 8:55 ` [PATCH 0/19] v6 multi-die/package topology support Peter Zijlstra
2019-05-15 16:38 ` Ingo Molnar
2019-05-22 20:44 ` Ingo Molnar
Reply instructions:
You may reply publicly to this message via plain-text email
using any one of the following methods:
* Save the following mbox file, import it into your mail client,
and reply-to-all from there: mbox
Avoid top-posting and favor interleaved quoting:
https://en.wikipedia.org/wiki/Posting_style#Interleaved_style
* Reply using the --to, --cc, and --in-reply-to
switches of git-send-email(1):
git send-email \
--in-reply-to=tip-724adec33c2491f26f739f285ddca25fca226e48@git.kernel.org \
--to=tipbot@zytor.com \
--cc=hpa@zytor.com \
--cc=len.brown@intel.com \
--cc=linux-kernel@vger.kernel.org \
--cc=linux-tip-commits@vger.kernel.org \
--cc=mingo@kernel.org \
--cc=peterz@infradead.org \
--cc=rui.zhang@intel.com \
--cc=tglx@linutronix.de \
/path/to/YOUR_REPLY
https://kernel.org/pub/software/scm/git/docs/git-send-email.html
* If your mail client supports setting the In-Reply-To header
via mailto: links, try the mailto: link
Be sure your reply has a Subject: header at the top and a blank line
before the message body.
This is an external index of several public inboxes,
see mirroring instructions on how to clone and mirror
all data and code used by this external index.