* [RFC PATCH v1 0/3] Convert thermal bindings to yaml
@ 2020-02-24 7:25 Amit Kucheria
2020-02-24 7:25 ` [RFC PATCH v1 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors Amit Kucheria
` (2 more replies)
0 siblings, 3 replies; 11+ messages in thread
From: Amit Kucheria @ 2020-02-24 7:25 UTC (permalink / raw)
To: linux-kernel, linux-arm-msm, swboyd, mka, daniel.lezcano,
Amit Kucheria, Zhang Rui
Cc: devicetree, linux-pm
Hi all,
Here is a series splitting up the thermal bindings into 3 separate bindings
in YAML, one each of the sensor, cooling-device and the thermal zones.
Since I was learning about YAML parsers while creating these bindings,
there are bound to be some issues.
I have to add that the bindings as they exist today, don't really follow
the "describe the hardware" model of devicetree. e.g. the entire
thermal-zone binding is a software abstraction to tie arbitrary,
board-specific trip points to cooling strategies. This doesn't fit well
into the model where the same SoC in two different form-factor devices e.g.
mobile and laptop, will have fairly different thermal profiles and might
benefit from different trip points and mitigation heuristics. I've started
some experiments with moving the thermal zone data to a board-specific
platform data that is used to initialise a "thermal zone driver".
In any case, if we ever move down that path, it'll probably end up being v2
of the binding, so this series is still relevant.
Please help review.
Regards,
Amit
Amit Kucheria (3):
dt-bindings: thermal: Add yaml bindings for thermal sensors
dt-bindings: thermal: Add yaml bindings for thermal cooling-devices
dt-bindings: thermal: Add yaml bindings for thermal zones
.../thermal/thermal-cooling-devices.yaml | 114 +++++++
.../bindings/thermal/thermal-sensor.yaml | 70 ++++
.../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++
3 files changed, 486 insertions(+)
create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml
--
2.20.1
^ permalink raw reply [flat|nested] 11+ messages in thread* [RFC PATCH v1 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors 2020-02-24 7:25 [RFC PATCH v1 0/3] Convert thermal bindings to yaml Amit Kucheria @ 2020-02-24 7:25 ` Amit Kucheria 2020-02-24 18:39 ` Rob Herring 2020-02-24 7:25 ` [RFC PATCH v1 2/3] dt-bindings: thermal: Add yaml bindings for thermal cooling-devices Amit Kucheria 2020-02-24 7:25 ` [RFC PATCH v1 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones Amit Kucheria 2 siblings, 1 reply; 11+ messages in thread From: Amit Kucheria @ 2020-02-24 7:25 UTC (permalink / raw) To: linux-kernel, linux-arm-msm, swboyd, mka, daniel.lezcano, Amit Kucheria, Zhang Rui Cc: linux-pm, devicetree As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #thermal-sensor-cells is required in each device that acts as a thermal sensor. It is used to uniquely identify the instance of the thermal sensor inside the system. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> --- .../bindings/thermal/thermal-sensor.yaml | 70 +++++++++++++++++++ 1 file changed, 70 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml new file mode 100644 index 000000000000..ac32f54f2f98 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml @@ -0,0 +1,70 @@ +# SPDX-License-Identifier: (GPL-2.0 OR MIT) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal sensor binding + +maintainers: + - Amit Kucheria <amitk@kernel.org> + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of thermal zones required to take appropriate + action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or artively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-sensor. + + Thermal sensor devices provide temperature sensing capabilities on thermal + zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor + devices may control one or more internal sensors. + +properties: + "#thermal-sensor-cells": + description: + Used to uniquely identify a thermal sensor instance within an IC. Will be + 0 on sensor nodes with only a single sensor and at least 1 on nodes + containing several internal sensors. + enum: [0, 1] + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow"; + #thermal-sensor-cells = <1>; + }; + }; +... -- 2.20.1 ^ permalink raw reply related [flat|nested] 11+ messages in thread
* Re: [RFC PATCH v1 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors 2020-02-24 7:25 ` [RFC PATCH v1 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors Amit Kucheria @ 2020-02-24 18:39 ` Rob Herring 0 siblings, 0 replies; 11+ messages in thread From: Rob Herring @ 2020-02-24 18:39 UTC (permalink / raw) To: Amit Kucheria Cc: linux-kernel, linux-arm-msm, swboyd, mka, daniel.lezcano, Amit Kucheria, Zhang Rui, linux-pm, devicetree On Mon, 24 Feb 2020 12:55:35 +0530, Amit Kucheria wrote: > As part of moving the thermal bindings to YAML, split it up into 3 > bindings: thermal sensors, cooling devices and thermal zones. > > The property #thermal-sensor-cells is required in each device that acts > as a thermal sensor. It is used to uniquely identify the instance of the > thermal sensor inside the system. > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> > --- > .../bindings/thermal/thermal-sensor.yaml | 70 +++++++++++++++++++ > 1 file changed, 70 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml > My bot found errors running 'make dt_binding_check' on your patch: Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-sensor.example.dt.yaml: thermal-sensor@c263000: interrupt-names: ['uplow'] is too short /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-sensor.example.dt.yaml: thermal-sensor@c263000: interrupts: [[0, 506, 4]] is too short /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-sensor.example.dt.yaml: thermal-sensor@c265000: interrupt-names: ['uplow'] is too short /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-sensor.example.dt.yaml: thermal-sensor@c265000: interrupts: [[0, 507, 4]] is too short See https://patchwork.ozlabs.org/patch/1242845 Please check and re-submit. ^ permalink raw reply [flat|nested] 11+ messages in thread
* [RFC PATCH v1 2/3] dt-bindings: thermal: Add yaml bindings for thermal cooling-devices 2020-02-24 7:25 [RFC PATCH v1 0/3] Convert thermal bindings to yaml Amit Kucheria 2020-02-24 7:25 ` [RFC PATCH v1 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors Amit Kucheria @ 2020-02-24 7:25 ` Amit Kucheria 2020-02-24 7:25 ` [RFC PATCH v1 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones Amit Kucheria 2 siblings, 0 replies; 11+ messages in thread From: Amit Kucheria @ 2020-02-24 7:25 UTC (permalink / raw) To: linux-kernel, linux-arm-msm, swboyd, mka, daniel.lezcano, Amit Kucheria, Zhang Rui Cc: linux-pm, devicetree As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #cooling-cells is required in each device that acts as a cooling device - whether active or passive. So any device that can throttle its performance to passively reduce heat dissipation (e.g. cpus, gpus) and any device that can actively dissipate heat at different levels (e.g. fans) will contain this property. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> --- .../thermal/thermal-cooling-devices.yaml | 114 ++++++++++++++++++ 1 file changed, 114 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml new file mode 100644 index 000000000000..6aafca25af9b --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml @@ -0,0 +1,114 @@ +# SPDX-License-Identifier: (GPL-2.0 OR MIT) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal cooling device binding + +maintainers: + - Amit Kucheria <amitk@kernel.org> + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overload. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or artively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the cooling devices. + + There are essentially two ways to provide control on power dissipation: + - Passive cooling: by means of regulating device performance. A typical + passive cooling mechanism is a CPU that has dynamic voltage and frequency + scaling (DVFS), and uses lower frequencies as cooling states. + - Active cooling: by means of activating devices in order to remove the + dissipated heat, e.g. regulating fan speeds. + + Any cooling device has a range of cooling states (i.e. different levels of + heat dissipation). They also have a way to determine the state of cooling in + which the device is. For example, a fan's cooling states correspond to the + different fan speeds possible. Cooling states are referred to by single + unsigned integers, where larger numbers mean greater heat dissipation. The + precise set of cooling states associated with a device should be defined in + a particular device's binding. + +properties: + "#cooling-cells": + description: + Must be 2, in order to specify minimum and maximum cooling state used in + the cooling-maps reference. The first cell is the minimum cooling state + and the second cell is the maximum cooling state requested. + const: 2 + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/thermal/thermal.h> + + // Example 1: Cpufreq cooling device on CPU0 + cpus { + #address-cells = <2>; + #size-cells = <0>; + + CPU0: cpu@0 { + device_type = "cpu"; + compatible = "qcom,kryo385"; + reg = <0x0 0x0>; + enable-method = "psci"; + cpu-idle-states = <&LITTLE_CPU_SLEEP_0 + &LITTLE_CPU_SLEEP_1 + &CLUSTER_SLEEP_0>; + capacity-dmips-mhz = <607>; + dynamic-power-coefficient = <100>; + qcom,freq-domain = <&cpufreq_hw 0>; + #cooling-cells = <2>; + next-level-cache = <&L2_0>; + L2_0: l2-cache { + compatible = "cache"; + next-level-cache = <&L3_0>; + L3_0: l3-cache { + compatible = "cache"; + }; + }; + }; + + /* ... */ + + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + cooling-device = <&CPU0 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>; + }; + }; + }; + + /* ... */ + }; +... -- 2.20.1 ^ permalink raw reply related [flat|nested] 11+ messages in thread
* [RFC PATCH v1 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones 2020-02-24 7:25 [RFC PATCH v1 0/3] Convert thermal bindings to yaml Amit Kucheria 2020-02-24 7:25 ` [RFC PATCH v1 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors Amit Kucheria 2020-02-24 7:25 ` [RFC PATCH v1 2/3] dt-bindings: thermal: Add yaml bindings for thermal cooling-devices Amit Kucheria @ 2020-02-24 7:25 ` Amit Kucheria 2020-02-24 18:40 ` Rob Herring 2020-02-24 21:54 ` Rob Herring 2 siblings, 2 replies; 11+ messages in thread From: Amit Kucheria @ 2020-02-24 7:25 UTC (permalink / raw) To: linux-kernel, linux-arm-msm, swboyd, mka, daniel.lezcano, Amit Kucheria, Zhang Rui Cc: linux-pm, devicetree As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The thermal-zone binding is a software abstraction to capture the properties of each zone - how often they should be checked, the temperature thresholds (trips) at which mitigation actions need to be taken and the level of mitigation needed at those thresholds. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> --- .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ 1 file changed, 302 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml new file mode 100644 index 000000000000..bc1ce8e41324 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml @@ -0,0 +1,302 @@ +# SPDX-License-Identifier: (GPL-2.0 OR MIT) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml# +$schema: http://devicetree.org/meta-schemas/base.yaml# + +title: Thermal zone binding + +maintainers: + - Amit Kucheria <amitk@kernel.org> + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or artively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-zones. + + The polling-delay properties of a thermal-zone are bound to the maximum dT/dt + (temperature derivative over time) in two situations for a thermal zone: + 1. when passive cooling is activated (polling-delay-passive) + 2. when the zone just needs to be monitored (polling-delay) or when + active cooling is activated. + + The maximum dT/dt is highly bound to hardware power consumption and + dissipation capability. The delays should be chosen to account for said + max dT/dt, such that a device does not cross several trip boundaries + unexpectedly between polls. Choosing the right polling delays shall avoid + having the device in temperature ranges that may damage the silicon structures + and reduce silicon lifetime. + +properties: + thermal-zones: + type: object + description: + A /thermal-zones node is required in order to use the thermal framework to + manage input from the various thermal zones in the system in order to + mitigate thermal overload conditions. It does not represent a real device + in the system, but acts as a container to link thermal sensor devices, + platform-data regarding temperature thresholds and the mitigation actions + to take when the temperature crosses those thresholds. + + properties: + $nodename: + pattern: "^[a-zA-Z][a-zA-Z0-9,\\-]{1,12}-thermal$" + type: object + description: + Each thermal zone node contains information about how frequently it + must be checked, the sensor responsible for reporting temperature for + this zone, one sub-node containing the various trip points for this + zone and one sub-node containing all the zone cooling-maps. + + properties: + polling-delay: + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 0 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone. Setting this to 0 disables the polling + timers setup by the thermal framework and assumes that the thermal + sensors in this zone support interrupts. + + polling-delay-passive: + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 0 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone while doing passive cooling. Setting + this to 0 disables the polling timers setup by the thermal + framework and assumes that the thermal sensors in this zone + support interrupts. + + thermal-sensors: + $ref: /schemas/types.yaml#/definitions/phandle-array + description: + A list of thermal sensor phandles and sensor specifiers used to + monitor this thermal zone. + + trips: + type: object + description: + This node describes a set of points in the temperature domain at + which the thermal framework needs to takes action. The actions to + be taken are defined in another node called cooling-maps. + + patternProperties: + "^[a-zA-Z][a-zA-Z0-9,+\\._]{0,63}$": + type: object + + properties: + temperature: + $ref: /schemas/types.yaml#/definitions/int32 + description: + An integer expressing the trip temperature in millicelsius. + + hysteresis: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + An unsigned integer expressing the hysteresis delta with + respect to the trip temperature property above, also in + millicelsius. + + type: + oneOf: + - items: + - enum: + - active + - passive + - hot + - critical + description: | + There are four valid trip types, + - active - enable active cooling e.g. fans + - passive - enable passive cooling e.g. throttling cpu + - hot - send notification to driver if .notify + callback registered + - critical - send notification to driver if .notify + callback registered and trigger a shutdown + + required: + - temperature + - hysteresis + - type + + cooling-maps: + type: object + description: + This node describes the action to be taken when a thermal zone + crosses one of the temperature thresholds described in the trips + node. The action takes the form of a mapping relation between a + trip and the target cooling device state. + + patternProperties: + "^map[0-9][-a-zA-Z0-9]*$": + type: object + + properties: + trip: + $ref: /schemas/types.yaml#/definitions/phandle + description: + A phandle of a trip point node within this thermal zone. + + cooling-device: + $ref: /schemas/types.yaml#/definitions/phandle-array + description: + A list of cooling device phandles along with the minimum + and maximum cooling state specifiers for each cooling + device. Using the THERMAL_NO_LIMIT (-1UL) constant in the + cooling-device phandle limit specifier lets the framework + use the minimum and maximum cooling state for that cooling + device automatically. + + contribution: + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 0 + maximum: 100 + description: + The contribution of the cooling devices at the trip + temperature, both referenced in this map, to this thermal + zone as a percentage. + + required: + - trip + - cooling-device + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/thermal/thermal.h> + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow"; + #thermal-sensor-cells = <1>; + }; + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_alert1: trip-point1 { + temperature = <95000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_crit: cpu_crit { + temperature = <110000>; + hysteresis = <1000>; + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + cooling-device = <&CPU0 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU1 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU2 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU3 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>; + }; + + map1 { + trip = <&cpu0_alert1>; + cooling-device = <&CPU0 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU1 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU2 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU3 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>; + }; + }; + }; + + /* ... */ + + cluster0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 5>; + + trips { + cluster0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + cluster0_crit: cluster0_crit { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + /* ... */ + + gpu-thermal-top { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 11>; + + trips { + gpu1_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + }; + }; + }; +... -- 2.20.1 ^ permalink raw reply related [flat|nested] 11+ messages in thread
* Re: [RFC PATCH v1 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones 2020-02-24 7:25 ` [RFC PATCH v1 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones Amit Kucheria @ 2020-02-24 18:40 ` Rob Herring 2020-03-05 12:50 ` Amit Kucheria 2020-02-24 21:54 ` Rob Herring 1 sibling, 1 reply; 11+ messages in thread From: Rob Herring @ 2020-02-24 18:40 UTC (permalink / raw) To: Amit Kucheria Cc: linux-kernel, linux-arm-msm, swboyd, mka, daniel.lezcano, Amit Kucheria, Zhang Rui, linux-pm, devicetree On Mon, 24 Feb 2020 12:55:37 +0530, Amit Kucheria wrote: > As part of moving the thermal bindings to YAML, split it up into 3 > bindings: thermal sensors, cooling devices and thermal zones. > > The thermal-zone binding is a software abstraction to capture the > properties of each zone - how often they should be checked, the > temperature thresholds (trips) at which mitigation actions need to be > taken and the level of mitigation needed at those thresholds. > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> > --- > .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ > 1 file changed, 302 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml > My bot found errors running 'make dt_binding_check' on your patch: Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c263000: interrupt-names: ['uplow'] is too short /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c263000: interrupts: [[0, 506, 4]] is too short /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c265000: interrupt-names: ['uplow'] is too short /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c265000: interrupts: [[0, 507, 4]] is too short See https://patchwork.ozlabs.org/patch/1242847 Please check and re-submit. ^ permalink raw reply [flat|nested] 11+ messages in thread
* Re: [RFC PATCH v1 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones 2020-02-24 18:40 ` Rob Herring @ 2020-03-05 12:50 ` Amit Kucheria 2020-03-05 15:37 ` Rob Herring 0 siblings, 1 reply; 11+ messages in thread From: Amit Kucheria @ 2020-03-05 12:50 UTC (permalink / raw) To: Rob Herring Cc: LKML, linux-arm-msm, Stephen Boyd, Matthias Kaehlcke, Daniel Lezcano, Zhang Rui, Linux PM list, open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS On Tue, Feb 25, 2020 at 12:10 AM Rob Herring <robh@kernel.org> wrote: > > On Mon, 24 Feb 2020 12:55:37 +0530, Amit Kucheria wrote: > > As part of moving the thermal bindings to YAML, split it up into 3 > > bindings: thermal sensors, cooling devices and thermal zones. > > > > The thermal-zone binding is a software abstraction to capture the > > properties of each zone - how often they should be checked, the > > temperature thresholds (trips) at which mitigation actions need to be > > taken and the level of mitigation needed at those thresholds. > > > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> > > --- > > .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ > > 1 file changed, 302 insertions(+) > > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml > > > > My bot found errors running 'make dt_binding_check' on your patch: > > Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node This one isn't due to my patch, I believe. > /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c263000: interrupt-names: ['uplow'] is too short > /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c263000: interrupts: [[0, 506, 4]] is too short > /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c265000: interrupt-names: ['uplow'] is too short > /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c265000: interrupts: [[0, 507, 4]] is too short Fixed. Just for my information, did the check somehow figure out that this (incomplete) example needed the qcom-tsens.yaml binding (based on compatible string?) and then apply those rules to throw this error? Regards, Amit ^ permalink raw reply [flat|nested] 11+ messages in thread
* Re: [RFC PATCH v1 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones 2020-03-05 12:50 ` Amit Kucheria @ 2020-03-05 15:37 ` Rob Herring 2020-03-05 15:43 ` Amit Kucheria 0 siblings, 1 reply; 11+ messages in thread From: Rob Herring @ 2020-03-05 15:37 UTC (permalink / raw) To: Amit Kucheria Cc: LKML, linux-arm-msm, Stephen Boyd, Matthias Kaehlcke, Daniel Lezcano, Zhang Rui, Linux PM list, open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS On Thu, Mar 5, 2020 at 6:50 AM Amit Kucheria <amit.kucheria@linaro.org> wrote: > > On Tue, Feb 25, 2020 at 12:10 AM Rob Herring <robh@kernel.org> wrote: > > > > On Mon, 24 Feb 2020 12:55:37 +0530, Amit Kucheria wrote: > > > As part of moving the thermal bindings to YAML, split it up into 3 > > > bindings: thermal sensors, cooling devices and thermal zones. > > > > > > The thermal-zone binding is a software abstraction to capture the > > > properties of each zone - how often they should be checked, the > > > temperature thresholds (trips) at which mitigation actions need to be > > > taken and the level of mitigation needed at those thresholds. > > > > > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> > > > --- > > > .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ > > > 1 file changed, 302 insertions(+) > > > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml > > > > > > > My bot found errors running 'make dt_binding_check' on your patch: > > > > Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node > > This one isn't due to my patch, I believe. Right, that's the one known warning... > > /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c263000: interrupt-names: ['uplow'] is too short > > /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c263000: interrupts: [[0, 506, 4]] is too short > > /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c265000: interrupt-names: ['uplow'] is too short > > /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c265000: interrupts: [[0, 507, 4]] is too short > > Fixed. Just for my information, did the check somehow figure out that > this (incomplete) example needed the qcom-tsens.yaml binding (based on > compatible string?) and then apply those rules to throw this error? Yes. And setting DT_SCHEMA_FILES did change that to only check with the specified schema file. However, that's now changed in linux-next such that examples are always checked by all schemas and DT_SCHEMA_FILES just limits which bindings to build and check. Rob ^ permalink raw reply [flat|nested] 11+ messages in thread
* Re: [RFC PATCH v1 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones 2020-03-05 15:37 ` Rob Herring @ 2020-03-05 15:43 ` Amit Kucheria 0 siblings, 0 replies; 11+ messages in thread From: Amit Kucheria @ 2020-03-05 15:43 UTC (permalink / raw) To: Rob Herring Cc: LKML, linux-arm-msm, Stephen Boyd, Matthias Kaehlcke, Daniel Lezcano, Zhang Rui, Linux PM list, open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS On Thu, Mar 5, 2020 at 9:08 PM Rob Herring <robh@kernel.org> wrote: > > On Thu, Mar 5, 2020 at 6:50 AM Amit Kucheria <amit.kucheria@linaro.org> wrote: > > > > On Tue, Feb 25, 2020 at 12:10 AM Rob Herring <robh@kernel.org> wrote: > > > > > > On Mon, 24 Feb 2020 12:55:37 +0530, Amit Kucheria wrote: > > > > As part of moving the thermal bindings to YAML, split it up into 3 > > > > bindings: thermal sensors, cooling devices and thermal zones. > > > > > > > > The thermal-zone binding is a software abstraction to capture the > > > > properties of each zone - how often they should be checked, the > > > > temperature thresholds (trips) at which mitigation actions need to be > > > > taken and the level of mitigation needed at those thresholds. > > > > > > > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> > > > > --- > > > > .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ > > > > 1 file changed, 302 insertions(+) > > > > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml > > > > > > > > > > My bot found errors running 'make dt_binding_check' on your patch: > > > > > > Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node > > > > This one isn't due to my patch, I believe. > > Right, that's the one known warning... > > > > /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c263000: interrupt-names: ['uplow'] is too short > > > /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c263000: interrupts: [[0, 506, 4]] is too short > > > /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c265000: interrupt-names: ['uplow'] is too short > > > /builds/robherring/linux-dt-review/Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml: thermal-sensor@c265000: interrupts: [[0, 507, 4]] is too short > > > > Fixed. Just for my information, did the check somehow figure out that > > this (incomplete) example needed the qcom-tsens.yaml binding (based on > > compatible string?) and then apply those rules to throw this error? > > Yes. And setting DT_SCHEMA_FILES did change that to only check with > the specified schema file. However, that's now changed in linux-next > such that examples are always checked by all schemas and > DT_SCHEMA_FILES just limits which bindings to build and check. DT_SCHEMA_FILES doesn't seem to take wildcards. Individual yaml files worked fine. $ make -k -j`nproc` ARCH=arm64 CROSS_COMPILE="ccache aarch64-linux-gnu-" O=~/work/builds/build-aarch64/ dt_binding_check DT_SCHEMA_FILES=Documentation/devicetree/bindings/thermal/thermal*.yaml make[1]: Entering directory '/home/amit/work/builds/build-aarch64' make[2]: Circular Documentation/devicetree/bindings/processed-schema.yaml <- Documentation/devicetree/bindings/thermal/thermal-sensor.example.dt.yaml dependency dropped. make[2]: Circular Documentation/devicetree/bindings/thermal/thermal-zones.example.dt.yaml <- Documentation/devicetree/bindings/processed-schema.yaml dependency dropped. make[2]: Circular Documentation/devicetree/bindings/thermal/thermal-cooling-devices.example.dt.yaml <- Documentation/devicetree/bindings/processed-schema.yaml dependency dropped. SCHEMA Documentation/devicetree/bindings/processed-schema.yaml Traceback (most recent call last): File "/home/amit/.local/bin/dt-mk-schema", line 7, in <module> exec(compile(f.read(), __file__, 'exec')) File "/home/amit/work/sources/tools-dt-schema.git/tools/dt-mk-schema", line 32, in <module> schemas = dtschema.process_schemas(args.schemas, core_schema=(not args.useronly)) File "/home/amit/work/sources/tools-dt-schema.git/dtschema/lib.py", line 475, in process_schemas sch = process_schema(os.path.abspath(filename)) File "/home/amit/work/sources/tools-dt-schema.git/dtschema/lib.py", line 435, in process_schema DTValidator.check_schema(schema) File "/home/amit/work/sources/tools-dt-schema.git/dtschema/lib.py", line 582, in check_schema meta_schema = cls.resolver.resolve_from_url(schema['$schema']) TypeError: list indices must be integers or slices, not str make[2]: *** [/home/amit/work/sources/linux-amit.git/Documentation/devicetree/bindings/Makefile:34: Documentation/devicetree/bindings/processed-schema.yaml] Error 1 make[2]: Target '__build' not remade because of errors. make[1]: *** [/home/amit/work/sources/linux-amit.git/Makefile:1262: dt_binding_check] Error 2 make[1]: Leaving directory '/home/amit/work/builds/build-aarch64' make: *** [Makefile:179: sub-make] Error 2 make: Target 'dt_binding_check' not remade because of errors. ^ permalink raw reply [flat|nested] 11+ messages in thread
* Re: [RFC PATCH v1 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones 2020-02-24 7:25 ` [RFC PATCH v1 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones Amit Kucheria 2020-02-24 18:40 ` Rob Herring @ 2020-02-24 21:54 ` Rob Herring 2020-03-04 21:02 ` Amit Kucheria 1 sibling, 1 reply; 11+ messages in thread From: Rob Herring @ 2020-02-24 21:54 UTC (permalink / raw) To: Amit Kucheria Cc: linux-kernel, linux-arm-msm, Stephen Boyd, Matthias Kaehlcke, Daniel Lezcano, Amit Kucheria, Zhang Rui, open list:THERMAL, devicetree On Mon, Feb 24, 2020 at 1:26 AM Amit Kucheria <amit.kucheria@linaro.org> wrote: > > As part of moving the thermal bindings to YAML, split it up into 3 > bindings: thermal sensors, cooling devices and thermal zones. > > The thermal-zone binding is a software abstraction to capture the > properties of each zone - how often they should be checked, the > temperature thresholds (trips) at which mitigation actions need to be > taken and the level of mitigation needed at those thresholds. > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> > --- > .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ > 1 file changed, 302 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml > > diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml > new file mode 100644 > index 000000000000..bc1ce8e41324 > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml > @@ -0,0 +1,302 @@ > +# SPDX-License-Identifier: (GPL-2.0 OR MIT) Why MIT instead of BSD-2-Clause? And do you have rights to add that? Any text you copied over from the .txt file was only GPL2. Relicensing would be nice if you can get permission from the authors. > +# Copyright 2020 Linaro Ltd. > +%YAML 1.2 > +--- > +$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml# > +$schema: http://devicetree.org/meta-schemas/base.yaml# > + > +title: Thermal zone binding > + > +maintainers: > + - Amit Kucheria <amitk@kernel.org> > + > +description: | > + Thermal management is achieved in devicetree by describing the sensor hardware > + and the software abstraction of cooling devices and thermal zones required to > + take appropriate action to mitigate thermal overloads. > + > + The following node types are used to completely describe a thermal management > + system in devicetree: > + - thermal-sensor: device that measures temperature, has SoC-specific bindings > + - cooling-device: device used to dissipate heat either passively or artively typo > + - thermal-zones: a container of the following node types used to describe all > + thermal data for the platform > + > + This binding describes the thermal-zones. > + > + The polling-delay properties of a thermal-zone are bound to the maximum dT/dt > + (temperature derivative over time) in two situations for a thermal zone: > + 1. when passive cooling is activated (polling-delay-passive) > + 2. when the zone just needs to be monitored (polling-delay) or when > + active cooling is activated. > + > + The maximum dT/dt is highly bound to hardware power consumption and > + dissipation capability. The delays should be chosen to account for said > + max dT/dt, such that a device does not cross several trip boundaries > + unexpectedly between polls. Choosing the right polling delays shall avoid > + having the device in temperature ranges that may damage the silicon structures > + and reduce silicon lifetime. > + > +properties: > + thermal-zones: > + type: object > + description: > + A /thermal-zones node is required in order to use the thermal framework to > + manage input from the various thermal zones in the system in order to > + mitigate thermal overload conditions. It does not represent a real device > + in the system, but acts as a container to link thermal sensor devices, > + platform-data regarding temperature thresholds and the mitigation actions > + to take when the temperature crosses those thresholds. > + > + properties: > + $nodename: > + pattern: "^[a-zA-Z][a-zA-Z0-9,\\-]{1,12}-thermal$" > + type: object > + description: > + Each thermal zone node contains information about how frequently it > + must be checked, the sensor responsible for reporting temperature for > + this zone, one sub-node containing the various trip points for this > + zone and one sub-node containing all the zone cooling-maps. > + > + properties: > + polling-delay: > + $ref: /schemas/types.yaml#/definitions/uint32 > + minimum: 0 > + description: > + The maximum number of milliseconds to wait between polls when > + checking this thermal zone. Setting this to 0 disables the polling > + timers setup by the thermal framework and assumes that the thermal > + sensors in this zone support interrupts. > + > + polling-delay-passive: > + $ref: /schemas/types.yaml#/definitions/uint32 > + minimum: 0 > + description: > + The maximum number of milliseconds to wait between polls when > + checking this thermal zone while doing passive cooling. Setting > + this to 0 disables the polling timers setup by the thermal > + framework and assumes that the thermal sensors in this zone > + support interrupts. > + > + thermal-sensors: > + $ref: /schemas/types.yaml#/definitions/phandle-array > + description: > + A list of thermal sensor phandles and sensor specifiers used to > + monitor this thermal zone. > + > + trips: > + type: object > + description: > + This node describes a set of points in the temperature domain at > + which the thermal framework needs to takes action. The actions to > + be taken are defined in another node called cooling-maps. > + > + patternProperties: > + "^[a-zA-Z][a-zA-Z0-9,+\\._]{0,63}$": > + type: object > + > + properties: > + temperature: > + $ref: /schemas/types.yaml#/definitions/int32 > + description: > + An integer expressing the trip temperature in millicelsius. Wouldn't 200000 mC be a reasonable max? And -273000 mC min. > + > + hysteresis: > + $ref: /schemas/types.yaml#/definitions/uint32 > + description: > + An unsigned integer expressing the hysteresis delta with > + respect to the trip temperature property above, also in > + millicelsius. > + > + type: > + oneOf: > + - items: > + - enum: Drop oneOf and items. Just enum is enough. > + - active > + - passive > + - hot > + - critical > + description: | > + There are four valid trip types, > + - active - enable active cooling e.g. fans > + - passive - enable passive cooling e.g. throttling cpu > + - hot - send notification to driver if .notify > + callback registered > + - critical - send notification to driver if .notify > + callback registered and trigger a shutdown Perhaps make these comments on each enum entry. > + > + required: > + - temperature > + - hysteresis > + - type 'additionalProperties: false'? Or can the node have other properties? > + > + cooling-maps: > + type: object > + description: > + This node describes the action to be taken when a thermal zone > + crosses one of the temperature thresholds described in the trips > + node. The action takes the form of a mapping relation between a > + trip and the target cooling device state. > + > + patternProperties: > + "^map[0-9][-a-zA-Z0-9]*$": > + type: object > + > + properties: > + trip: > + $ref: /schemas/types.yaml#/definitions/phandle > + description: > + A phandle of a trip point node within this thermal zone. > + > + cooling-device: > + $ref: /schemas/types.yaml#/definitions/phandle-array > + description: > + A list of cooling device phandles along with the minimum > + and maximum cooling state specifiers for each cooling > + device. Using the THERMAL_NO_LIMIT (-1UL) constant in the > + cooling-device phandle limit specifier lets the framework > + use the minimum and maximum cooling state for that cooling > + device automatically. > + > + contribution: > + $ref: /schemas/types.yaml#/definitions/uint32 > + minimum: 0 > + maximum: 100 > + description: > + The contribution of the cooling devices at the trip > + temperature, both referenced in this map, to this thermal > + zone as a percentage. > + > + required: > + - trip > + - cooling-device 'additionalProperties: false'? > + > +examples: > + - | > + #include <dt-bindings/interrupt-controller/arm-gic.h> > + #include <dt-bindings/thermal/thermal.h> > + > + // Example 1: SDM845 TSENS > + soc: soc@0 { > + #address-cells = <2>; > + #size-cells = <2>; > + > + /* ... */ > + > + tsens0: thermal-sensor@c263000 { > + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; > + reg = <0 0x0c263000 0 0x1ff>, /* TM */ > + <0 0x0c222000 0 0x1ff>; /* SROT */ > + #qcom,sensors = <13>; > + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>; > + interrupt-names = "uplow"; > + #thermal-sensor-cells = <1>; > + }; > + > + tsens1: thermal-sensor@c265000 { > + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; > + reg = <0 0x0c265000 0 0x1ff>, /* TM */ > + <0 0x0c223000 0 0x1ff>; /* SROT */ > + #qcom,sensors = <8>; > + interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>; > + interrupt-names = "uplow"; > + #thermal-sensor-cells = <1>; > + }; > + }; > + > + /* ... */ > + > + thermal-zones { > + cpu0-thermal { > + polling-delay-passive = <250>; > + polling-delay = <1000>; > + > + thermal-sensors = <&tsens0 1>; > + > + trips { > + cpu0_alert0: trip-point0 { > + temperature = <90000>; > + hysteresis = <2000>; > + type = "passive"; > + }; > + > + cpu0_alert1: trip-point1 { > + temperature = <95000>; > + hysteresis = <2000>; > + type = "passive"; > + }; > + > + cpu0_crit: cpu_crit { > + temperature = <110000>; > + hysteresis = <1000>; > + type = "critical"; > + }; > + }; > + > + cooling-maps { > + map0 { > + trip = <&cpu0_alert0>; > + cooling-device = <&CPU0 THERMAL_NO_LIMIT > + THERMAL_NO_LIMIT>, > + <&CPU1 THERMAL_NO_LIMIT > + THERMAL_NO_LIMIT>, > + <&CPU2 THERMAL_NO_LIMIT > + THERMAL_NO_LIMIT>, > + <&CPU3 THERMAL_NO_LIMIT > + THERMAL_NO_LIMIT>; > + }; > + > + map1 { > + trip = <&cpu0_alert1>; > + cooling-device = <&CPU0 THERMAL_NO_LIMIT > + THERMAL_NO_LIMIT>, > + <&CPU1 THERMAL_NO_LIMIT > + THERMAL_NO_LIMIT>, > + <&CPU2 THERMAL_NO_LIMIT > + THERMAL_NO_LIMIT>, > + <&CPU3 THERMAL_NO_LIMIT > + THERMAL_NO_LIMIT>; > + }; > + }; > + }; > + > + /* ... */ > + > + cluster0-thermal { > + polling-delay-passive = <250>; > + polling-delay = <1000>; > + > + thermal-sensors = <&tsens0 5>; > + > + trips { > + cluster0_alert0: trip-point0 { > + temperature = <90000>; > + hysteresis = <2000>; > + type = "hot"; > + }; > + cluster0_crit: cluster0_crit { > + temperature = <110000>; > + hysteresis = <2000>; > + type = "critical"; > + }; > + }; > + }; > + > + /* ... */ > + > + gpu-thermal-top { > + polling-delay-passive = <250>; > + polling-delay = <1000>; > + > + thermal-sensors = <&tsens0 11>; > + > + trips { > + gpu1_alert0: trip-point0 { > + temperature = <90000>; > + hysteresis = <2000>; > + type = "hot"; > + }; > + }; > + }; > + }; > +... > -- > 2.20.1 > ^ permalink raw reply [flat|nested] 11+ messages in thread
* Re: [RFC PATCH v1 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones 2020-02-24 21:54 ` Rob Herring @ 2020-03-04 21:02 ` Amit Kucheria 0 siblings, 0 replies; 11+ messages in thread From: Amit Kucheria @ 2020-03-04 21:02 UTC (permalink / raw) To: Rob Herring Cc: linux-kernel, linux-arm-msm, Stephen Boyd, Matthias Kaehlcke, Daniel Lezcano, Zhang Rui, open list:THERMAL, open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS On Tue, Feb 25, 2020 at 3:24 AM Rob Herring <robh@kernel.org> wrote: > > On Mon, Feb 24, 2020 at 1:26 AM Amit Kucheria <amit.kucheria@linaro.org> wrote: > > > > As part of moving the thermal bindings to YAML, split it up into 3 > > bindings: thermal sensors, cooling devices and thermal zones. > > > > The thermal-zone binding is a software abstraction to capture the > > properties of each zone - how often they should be checked, the > > temperature thresholds (trips) at which mitigation actions need to be > > taken and the level of mitigation needed at those thresholds. > > > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> > > --- > > .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ > > 1 file changed, 302 insertions(+) > > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml > > > > diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml > > new file mode 100644 > > index 000000000000..bc1ce8e41324 > > --- /dev/null > > +++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml > > @@ -0,0 +1,302 @@ > > +# SPDX-License-Identifier: (GPL-2.0 OR MIT) > > Why MIT instead of BSD-2-Clause? And do you have rights to add that? > Any text you copied over from the .txt file was only GPL2. Relicensing > would be nice if you can get permission from the authors. Changed back to GPL2. I will send out a separate email to get permission for relicensing the bindings. > > +# Copyright 2020 Linaro Ltd. > > +%YAML 1.2 > > +--- > > +$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml# > > +$schema: http://devicetree.org/meta-schemas/base.yaml# > > + > > +title: Thermal zone binding > > + > > +maintainers: > > + - Amit Kucheria <amitk@kernel.org> > > + > > +description: | > > + Thermal management is achieved in devicetree by describing the sensor hardware > > + and the software abstraction of cooling devices and thermal zones required to > > + take appropriate action to mitigate thermal overloads. > > + > > + The following node types are used to completely describe a thermal management > > + system in devicetree: > > + - thermal-sensor: device that measures temperature, has SoC-specific bindings > > + - cooling-device: device used to dissipate heat either passively or artively > > typo Fixed. > > > + - thermal-zones: a container of the following node types used to describe all > > + thermal data for the platform > > + > > + This binding describes the thermal-zones. > > + > > + The polling-delay properties of a thermal-zone are bound to the maximum dT/dt > > + (temperature derivative over time) in two situations for a thermal zone: > > + 1. when passive cooling is activated (polling-delay-passive) > > + 2. when the zone just needs to be monitored (polling-delay) or when > > + active cooling is activated. > > + > > + The maximum dT/dt is highly bound to hardware power consumption and > > + dissipation capability. The delays should be chosen to account for said > > + max dT/dt, such that a device does not cross several trip boundaries > > + unexpectedly between polls. Choosing the right polling delays shall avoid > > + having the device in temperature ranges that may damage the silicon structures > > + and reduce silicon lifetime. > > + > > +properties: > > + thermal-zones: > > + type: object > > + description: > > + A /thermal-zones node is required in order to use the thermal framework to > > + manage input from the various thermal zones in the system in order to > > + mitigate thermal overload conditions. It does not represent a real device > > + in the system, but acts as a container to link thermal sensor devices, > > + platform-data regarding temperature thresholds and the mitigation actions > > + to take when the temperature crosses those thresholds. > > + > > + properties: > > + $nodename: > > + pattern: "^[a-zA-Z][a-zA-Z0-9,\\-]{1,12}-thermal$" > > + type: object > > + description: > > + Each thermal zone node contains information about how frequently it > > + must be checked, the sensor responsible for reporting temperature for > > + this zone, one sub-node containing the various trip points for this > > + zone and one sub-node containing all the zone cooling-maps. > > + > > + properties: > > + polling-delay: > > + $ref: /schemas/types.yaml#/definitions/uint32 > > + minimum: 0 > > + description: > > + The maximum number of milliseconds to wait between polls when > > + checking this thermal zone. Setting this to 0 disables the polling > > + timers setup by the thermal framework and assumes that the thermal > > + sensors in this zone support interrupts. > > + > > + polling-delay-passive: > > + $ref: /schemas/types.yaml#/definitions/uint32 > > + minimum: 0 > > + description: > > + The maximum number of milliseconds to wait between polls when > > + checking this thermal zone while doing passive cooling. Setting > > + this to 0 disables the polling timers setup by the thermal > > + framework and assumes that the thermal sensors in this zone > > + support interrupts. > > + > > + thermal-sensors: > > + $ref: /schemas/types.yaml#/definitions/phandle-array > > + description: > > + A list of thermal sensor phandles and sensor specifiers used to > > + monitor this thermal zone. > > + > > + trips: > > + type: object > > + description: > > + This node describes a set of points in the temperature domain at > > + which the thermal framework needs to takes action. The actions to > > + be taken are defined in another node called cooling-maps. > > + > > + patternProperties: > > + "^[a-zA-Z][a-zA-Z0-9,+\\._]{0,63}$": > > + type: object > > + > > + properties: > > + temperature: > > + $ref: /schemas/types.yaml#/definitions/int32 > > + description: > > + An integer expressing the trip temperature in millicelsius. > > Wouldn't 200000 mC be a reasonable max? And -273000 mC min. It would indeed. :-) > > + > > + hysteresis: > > + $ref: /schemas/types.yaml#/definitions/uint32 > > + description: > > + An unsigned integer expressing the hysteresis delta with > > + respect to the trip temperature property above, also in > > + millicelsius. > > + > > + type: > > + oneOf: > > + - items: > > + - enum: > > Drop oneOf and items. Just enum is enough. Fixed. > > > + - active > > + - passive > > + - hot > > + - critical > > + description: | > > + There are four valid trip types, > > + - active - enable active cooling e.g. fans > > + - passive - enable passive cooling e.g. throttling cpu > > + - hot - send notification to driver if .notify > > + callback registered > > + - critical - send notification to driver if .notify > > + callback registered and trigger a shutdown > > Perhaps make these comments on each enum entry. I've moved the one-line descriptions to comments before each enum entry. However, I ended up adding more detailed descriptions in the description sections because I felt these are not well-defined in documentation. Let me know what you think. > > + > > + required: > > + - temperature > > + - hysteresis > > + - type > > 'additionalProperties: false'? Or can the node have other properties? Added. > > + > > + cooling-maps: > > + type: object > > + description: > > + This node describes the action to be taken when a thermal zone > > + crosses one of the temperature thresholds described in the trips > > + node. The action takes the form of a mapping relation between a > > + trip and the target cooling device state. > > + > > + patternProperties: > > + "^map[0-9][-a-zA-Z0-9]*$": > > + type: object > > + > > + properties: > > + trip: > > + $ref: /schemas/types.yaml#/definitions/phandle > > + description: > > + A phandle of a trip point node within this thermal zone. > > + > > + cooling-device: > > + $ref: /schemas/types.yaml#/definitions/phandle-array > > + description: > > + A list of cooling device phandles along with the minimum > > + and maximum cooling state specifiers for each cooling > > + device. Using the THERMAL_NO_LIMIT (-1UL) constant in the > > + cooling-device phandle limit specifier lets the framework > > + use the minimum and maximum cooling state for that cooling > > + device automatically. > > + > > + contribution: > > + $ref: /schemas/types.yaml#/definitions/uint32 > > + minimum: 0 > > + maximum: 100 > > + description: > > + The contribution of the cooling devices at the trip > > + temperature, both referenced in this map, to this thermal > > + zone as a percentage. > > + > > + required: > > + - trip > > + - cooling-device > > 'additionalProperties: false'? Added Thanks for the review. > > > + > > +examples: > > + - | > > + #include <dt-bindings/interrupt-controller/arm-gic.h> > > + #include <dt-bindings/thermal/thermal.h> > > + > > + // Example 1: SDM845 TSENS > > + soc: soc@0 { > > + #address-cells = <2>; > > + #size-cells = <2>; > > + > > + /* ... */ > > + > > + tsens0: thermal-sensor@c263000 { > > + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; > > + reg = <0 0x0c263000 0 0x1ff>, /* TM */ > > + <0 0x0c222000 0 0x1ff>; /* SROT */ > > + #qcom,sensors = <13>; > > + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>; > > + interrupt-names = "uplow"; > > + #thermal-sensor-cells = <1>; > > + }; > > + > > + tsens1: thermal-sensor@c265000 { > > + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; > > + reg = <0 0x0c265000 0 0x1ff>, /* TM */ > > + <0 0x0c223000 0 0x1ff>; /* SROT */ > > + #qcom,sensors = <8>; > > + interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>; > > + interrupt-names = "uplow"; > > + #thermal-sensor-cells = <1>; > > + }; > > + }; > > + > > + /* ... */ > > + > > + thermal-zones { > > + cpu0-thermal { > > + polling-delay-passive = <250>; > > + polling-delay = <1000>; > > + > > + thermal-sensors = <&tsens0 1>; > > + > > + trips { > > + cpu0_alert0: trip-point0 { > > + temperature = <90000>; > > + hysteresis = <2000>; > > + type = "passive"; > > + }; > > + > > + cpu0_alert1: trip-point1 { > > + temperature = <95000>; > > + hysteresis = <2000>; > > + type = "passive"; > > + }; > > + > > + cpu0_crit: cpu_crit { > > + temperature = <110000>; > > + hysteresis = <1000>; > > + type = "critical"; > > + }; > > + }; > > + > > + cooling-maps { > > + map0 { > > + trip = <&cpu0_alert0>; > > + cooling-device = <&CPU0 THERMAL_NO_LIMIT > > + THERMAL_NO_LIMIT>, > > + <&CPU1 THERMAL_NO_LIMIT > > + THERMAL_NO_LIMIT>, > > + <&CPU2 THERMAL_NO_LIMIT > > + THERMAL_NO_LIMIT>, > > + <&CPU3 THERMAL_NO_LIMIT > > + THERMAL_NO_LIMIT>; > > + }; > > + > > + map1 { > > + trip = <&cpu0_alert1>; > > + cooling-device = <&CPU0 THERMAL_NO_LIMIT > > + THERMAL_NO_LIMIT>, > > + <&CPU1 THERMAL_NO_LIMIT > > + THERMAL_NO_LIMIT>, > > + <&CPU2 THERMAL_NO_LIMIT > > + THERMAL_NO_LIMIT>, > > + <&CPU3 THERMAL_NO_LIMIT > > + THERMAL_NO_LIMIT>; > > + }; > > + }; > > + }; > > + > > + /* ... */ > > + > > + cluster0-thermal { > > + polling-delay-passive = <250>; > > + polling-delay = <1000>; > > + > > + thermal-sensors = <&tsens0 5>; > > + > > + trips { > > + cluster0_alert0: trip-point0 { > > + temperature = <90000>; > > + hysteresis = <2000>; > > + type = "hot"; > > + }; > > + cluster0_crit: cluster0_crit { > > + temperature = <110000>; > > + hysteresis = <2000>; > > + type = "critical"; > > + }; > > + }; > > + }; > > + > > + /* ... */ > > + > > + gpu-thermal-top { > > + polling-delay-passive = <250>; > > + polling-delay = <1000>; > > + > > + thermal-sensors = <&tsens0 11>; > > + > > + trips { > > + gpu1_alert0: trip-point0 { > > + temperature = <90000>; > > + hysteresis = <2000>; > > + type = "hot"; > > + }; > > + }; > > + }; > > + }; > > +... > > -- > > 2.20.1 > > ^ permalink raw reply [flat|nested] 11+ messages in thread
end of thread, other threads:[~2020-03-05 15:43 UTC | newest] Thread overview: 11+ messages (download: mbox.gz / follow: Atom feed) -- links below jump to the message on this page -- 2020-02-24 7:25 [RFC PATCH v1 0/3] Convert thermal bindings to yaml Amit Kucheria 2020-02-24 7:25 ` [RFC PATCH v1 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors Amit Kucheria 2020-02-24 18:39 ` Rob Herring 2020-02-24 7:25 ` [RFC PATCH v1 2/3] dt-bindings: thermal: Add yaml bindings for thermal cooling-devices Amit Kucheria 2020-02-24 7:25 ` [RFC PATCH v1 3/3] dt-bindings: thermal: Add yaml bindings for thermal zones Amit Kucheria 2020-02-24 18:40 ` Rob Herring 2020-03-05 12:50 ` Amit Kucheria 2020-03-05 15:37 ` Rob Herring 2020-03-05 15:43 ` Amit Kucheria 2020-02-24 21:54 ` Rob Herring 2020-03-04 21:02 ` Amit Kucheria
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