Re: [linux-sunxi] Re: [PATCH v3 21/30] iio: adc: sun4i-gpadc-iio: add support for H3 thermal sensor

[Icenowy Zheng <icenowy@aosc.io>]

=E4=BA=8E 2018=E5=B9=B49=E6=9C=883=E6=97=A5 GMT+08:00 =E4=B8=8B=E5=8D=886:=
20:22, Maxime Ripard <maxime=2Eripard@bootlin=2Ecom> =E5=86=99=E5=88=B0:
>On Fri, Aug 31, 2018 at 05:51:41PM +0800, Icenowy Zheng wrote:
>> Personally I suggest to leave out all SID or calibration related
>> patches here=2E
>>=20
>> Currently we seems to be wrongly converting SID to big endian,
>however,
>> the orgnization of the THS calibration data on H6 shows that it's
>> surely little endian:
>>=20
>> It consists a temperature value in 1/10 celsuis as unit, and some
>> thermal register readout values, which are the values read out at the
>> given temperature, and every value here (the temperature and the
>> readout) are all half word length=2E
>>=20
>> Let the temperature value be AABB, the two readout values be XXYY and
>> ZZWW, the oragnization is:
>> BB AA YY XX WW ZZ ** ** =2E
>>=20
>> When converting the SID to big endian, it becomes:
>> XX YY AA BB ** ** ZZ WW ,
>> which is non-sense, and not able to do sub-word cell addressing=2E
>>=20
>> Maxime, should I drop the LE2BE conversion in SID driver? (I doubt
>> whether it will break compatibility=2E)
>
>This is exposed to the userspace, so no=2E

Please note the LE2BE totally breaks the SID addressing=2E

Without it dropped all cells must be referenced with
4 byte word as unit, and half word addressing of
SID is thus not possible=2E The driver will also need then to split
the half words if needed=2E

I think this is kind of hardware misbehavior, and not a simple
UAPI change, so the UAPI stability shouldn't affect this change=2E

>
>Maxime
>>=20