[PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

[PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

[Daniel Lezcano]

Currently the common thermal zones definitions for the rk3399 assumes
multiple thermal zones are supported by the governors. This is not the
case and each thermal zone has its own governor instance acting
individually without collaboration with other governors.

As the cooling device for the CPU and the GPU thermal zones is the
same, each governors take different decisions for the same cooling
device leading to conflicting instructions and an erratic behavior.

As the cooling-maps is about to become an optional property, let's
remove the cpu cooling device map from the GPU thermal zone.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
---
 arch/arm64/boot/dts/rockchip/rk3399.dtsi | 9 ---------
 1 file changed, 9 deletions(-)

diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
index 196ac9b78076..e1357e0f60f7 100644
--- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
+++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
@@ -821,15 +821,6 @@
 					type = "critical";
 				};
 			};
-
-			cooling-maps {
-				map0 {
-					trip = <&gpu_alert0>;
-					cooling-device =
-						<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
-						<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
-				};
-			};
 		};
 	};
 
-- 
2.17.1

[PATCH 2/2] arm64: dts: rockchip: Define values for the IPA governor for rock960

[Daniel Lezcano]

Currently the default thermal values for the rk3399-rock960 board is
inherited from the generic definition in rk3399.dtsi.

In order to ensure the rock960 has more room for througput before
being capped by the thermal framework and is correctly supported by
the IPA governor, let's define the power values and the right trip
points for better performances:

 - sustainable power is tested to be 1550mW

 - increase the first mitigation point to 75°C in order to get better
   performances

 - the first trip point is 65°C in order to let the IPA to collect
   enough data for the PID regulation when it reaches 75°C

 - restrict the cooling device to the big CPUs as the little CPUs
   contribution to the heating effect can be considered negligible

The intelligent power allocator PID coefficient to be set in sysfs
are:

    k_d: 0
    k_po: 79
    k_i: 10
    k_pu: 50

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
---
 .../boot/dts/rockchip/rk3399-rock960.dts      | 39 +++++++++++++++++++
 1 file changed, 39 insertions(+)

diff --git a/arch/arm64/boot/dts/rockchip/rk3399-rock960.dts b/arch/arm64/boot/dts/rockchip/rk3399-rock960.dts
index 12285c51cceb..701d5b5fad46 100644
--- a/arch/arm64/boot/dts/rockchip/rk3399-rock960.dts
+++ b/arch/arm64/boot/dts/rockchip/rk3399-rock960.dts
@@ -114,6 +114,45 @@
 	};
 };
 
+&thermal_zones {
+	cpu_thermal: cpu {
+		polling-delay-passive = <100>;
+		polling-delay = <1000>;
+		thermal-sensors = <&tsadc 0>;
+		sustainable-power = <1550>;
+
+		trips {
+			cpu_alert0: cpu_alert0 {
+				    temperature = <65000>;
+				    hysteresis = <2000>;
+				    type = "passive";
+			};
+
+			cpu_alert1: cpu_alert1 {
+				    temperature = <75000>;
+				    hysteresis = <2000>;
+				    type = "passive";
+			};
+
+			cpu_crit: cpu_crit {
+				  temperature = <95000>;
+				  hysteresis = <2000>;
+				  type = "critical";
+			};
+		};
+
+		cooling-maps {
+			     map0 {
+
+			     trip = <&cpu_alert1>;
+			     cooling-device =
+					<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+					<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+			};
+		};
+	};
+};
+
 &usbdrd_dwc3_0 {
 	dr_mode = "otg";
 };
-- 
2.17.1

Re: [PATCH 2/2] arm64: dts: rockchip: Define values for the IPA governor for rock960

[Linus Walleij]

On Tue, Jun 4, 2019 at 6:58 PM Daniel Lezcano <daniel.lezcano@linaro.org> wrote:

> The intelligent power allocator PID coefficient to be set in sysfs
> are:
>
>     k_d: 0
>     k_po: 79
>     k_i: 10
>     k_pu: 50

With all the other interesting parametrization in the device tree
I kind of wonder why the PID regulator constants defaults are
not set up from device tree?

Any specific reason?

To me it seems like the kind of stuff userpace will invariably just
get wrong or forget about (somebody just runs a different
distribution without the extra magic to set sysfs right) unless
we supply good defaults.

Yours,
Linus Walleij

Re: [PATCH 2/2] arm64: dts: rockchip: Define values for the IPA governor for rock960

[Daniel Lezcano]

On 08/06/2019 00:18, Linus Walleij wrote:
> On Tue, Jun 4, 2019 at 6:58 PM Daniel Lezcano <daniel.lezcano@linaro.org> wrote:
> 
>> The intelligent power allocator PID coefficient to be set in sysfs
>> are:
>>
>>     k_d: 0
>>     k_po: 79
>>     k_i: 10
>>     k_pu: 50
> 
> With all the other interesting parametrization in the device tree
> I kind of wonder why the PID regulator constants defaults are
> not set up from device tree?
> 
> Any specific reason?

None I'm aware of. I guess these constants are considered as tweak
values and not hardware related.

> To me it seems like the kind of stuff userpace will invariably just
> get wrong or forget about (somebody just runs a different
> distribution without the extra magic to set sysfs right) unless
> we supply good defaults.

I agree.

-- 
 <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog


_______________________________________________
Linux-rockchip mailing list
Linux-rockchip@lists.infradead.org
http://lists.infradead.org/mailman/listinfo/linux-rockchip

Re: [PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

[Daniel Lezcano]

Hi all,

is there any comment on these two patches?


On 04/06/2019 18:57, Daniel Lezcano wrote:
> Currently the common thermal zones definitions for the rk3399 assumes
> multiple thermal zones are supported by the governors. This is not the
> case and each thermal zone has its own governor instance acting
> individually without collaboration with other governors.
> 
> As the cooling device for the CPU and the GPU thermal zones is the
> same, each governors take different decisions for the same cooling
> device leading to conflicting instructions and an erratic behavior.
> 
> As the cooling-maps is about to become an optional property, let's
> remove the cpu cooling device map from the GPU thermal zone.
> 
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
> ---
>  arch/arm64/boot/dts/rockchip/rk3399.dtsi | 9 ---------
>  1 file changed, 9 deletions(-)
> 
> diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> index 196ac9b78076..e1357e0f60f7 100644
> --- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> +++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> @@ -821,15 +821,6 @@
>  					type = "critical";
>  				};
>  			};
> -
> -			cooling-maps {
> -				map0 {
> -					trip = <&gpu_alert0>;
> -					cooling-device =
> -						<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> -						<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> -				};
> -			};
>  		};
>  	};
>  
> 


-- 
 <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog

Re: [PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

[Heiko Stuebner]

Hi Daniel,

Am Dienstag, 4. Juni 2019, 18:57:57 CEST schrieb Daniel Lezcano:
> Currently the common thermal zones definitions for the rk3399 assumes
> multiple thermal zones are supported by the governors. This is not the
> case and each thermal zone has its own governor instance acting
> individually without collaboration with other governors.
> 
> As the cooling device for the CPU and the GPU thermal zones is the
> same, each governors take different decisions for the same cooling
> device leading to conflicting instructions and an erratic behavior.
> 
> As the cooling-maps is about to become an optional property, let's
> remove the cpu cooling device map from the GPU thermal zone.
> 
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
> ---
>  arch/arm64/boot/dts/rockchip/rk3399.dtsi | 9 ---------
>  1 file changed, 9 deletions(-)
> 
> diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> index 196ac9b78076..e1357e0f60f7 100644
> --- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> +++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> @@ -821,15 +821,6 @@
>  					type = "critical";
>  				};
>  			};
> -
> -			cooling-maps {
> -				map0 {
> -					trip = <&gpu_alert0>;
> -					cooling-device =
> -						<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> -						<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> -				};
> -			};
>  		};
>  	};

my knowledge of the thermal framework is not that big, but what about the
rk3399-devices which further detail the cooling-maps like rk3399-gru-kevin
and the rk3399-nanopc-t4 with its fan-handling in the cooling-maps?


Heiko

Re: [PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

[Robin Murphy]

On 14/06/2019 10:35, Heiko Stuebner wrote:
> Hi Daniel,
> 
> Am Dienstag, 4. Juni 2019, 18:57:57 CEST schrieb Daniel Lezcano:
>> Currently the common thermal zones definitions for the rk3399 assumes
>> multiple thermal zones are supported by the governors. This is not the
>> case and each thermal zone has its own governor instance acting
>> individually without collaboration with other governors.
>>
>> As the cooling device for the CPU and the GPU thermal zones is the
>> same, each governors take different decisions for the same cooling
>> device leading to conflicting instructions and an erratic behavior.
>>
>> As the cooling-maps is about to become an optional property, let's
>> remove the cpu cooling device map from the GPU thermal zone.
>>
>> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
>> ---
>>   arch/arm64/boot/dts/rockchip/rk3399.dtsi | 9 ---------
>>   1 file changed, 9 deletions(-)
>>
>> diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>> index 196ac9b78076..e1357e0f60f7 100644
>> --- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>> +++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>> @@ -821,15 +821,6 @@
>>   					type = "critical";
>>   				};
>>   			};
>> -
>> -			cooling-maps {
>> -				map0 {
>> -					trip = <&gpu_alert0>;
>> -					cooling-device =
>> -						<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
>> -						<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
>> -				};
>> -			};
>>   		};
>>   	};
> 
> my knowledge of the thermal framework is not that big, but what about the
> rk3399-devices which further detail the cooling-maps like rk3399-gru-kevin
> and the rk3399-nanopc-t4 with its fan-handling in the cooling-maps?

FWIW, my knowledge of thermal is probably even less :)

For NanoPC-T4 I think I more or less just took Odroid-XU3/4 as the best 
pwm-fan example and adapted that into the existing RK3399 zones in the 
manner which seemed most logical to my interpretation - if what was 
there wasn't right to begin with, then I may well have done that wrong too.

Robin.

Re: [PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

[Daniel Lezcano]

On 14/06/2019 11:35, Heiko Stuebner wrote:
> Hi Daniel,
> 
> Am Dienstag, 4. Juni 2019, 18:57:57 CEST schrieb Daniel Lezcano:
>> Currently the common thermal zones definitions for the rk3399 assumes
>> multiple thermal zones are supported by the governors. This is not the
>> case and each thermal zone has its own governor instance acting
>> individually without collaboration with other governors.
>>
>> As the cooling device for the CPU and the GPU thermal zones is the
>> same, each governors take different decisions for the same cooling
>> device leading to conflicting instructions and an erratic behavior.
>>
>> As the cooling-maps is about to become an optional property, let's
>> remove the cpu cooling device map from the GPU thermal zone.
>>
>> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
>> ---
>>  arch/arm64/boot/dts/rockchip/rk3399.dtsi | 9 ---------
>>  1 file changed, 9 deletions(-)
>>
>> diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>> index 196ac9b78076..e1357e0f60f7 100644
>> --- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>> +++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>> @@ -821,15 +821,6 @@
>>  					type = "critical";
>>  				};
>>  			};
>> -
>> -			cooling-maps {
>> -				map0 {
>> -					trip = <&gpu_alert0>;
>> -					cooling-device =
>> -						<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
>> -						<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
>> -				};
>> -			};
>>  		};
>>  	};
> 
> my knowledge of the thermal framework is not that big, but what about the
> rk3399-devices which further detail the cooling-maps like rk3399-gru-kevin
> and the rk3399-nanopc-t4 with its fan-handling in the cooling-maps?

The rk3399-gru-kevin is correct.

The rk3399-nanopc-t4 is not correct because the cpu and the gpu are
sharing the same cooling device (the fan). There are different
configurations:

1. The cpu cooling device for the CPU and the fan for the GPU

2. Different trip points on the CPU thermal zone, eg. one to for the CPU
cooling device and another one for the fan.

There are some variant for the above. If this board is not on battery,
you may want to give priority to the throughput, so activate the fan
first and then cool down the CPU. Or if you are on battery, you may want
to invert the trip points.

In any case, it is not possible to share the same cooling device for
different thermal zones.


-- 
 <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog

Re: [PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

[Robin Murphy]

On 14/06/2019 14:03, Daniel Lezcano wrote:
> On 14/06/2019 11:35, Heiko Stuebner wrote:
>> Hi Daniel,
>>
>> Am Dienstag, 4. Juni 2019, 18:57:57 CEST schrieb Daniel Lezcano:
>>> Currently the common thermal zones definitions for the rk3399 assumes
>>> multiple thermal zones are supported by the governors. This is not the
>>> case and each thermal zone has its own governor instance acting
>>> individually without collaboration with other governors.
>>>
>>> As the cooling device for the CPU and the GPU thermal zones is the
>>> same, each governors take different decisions for the same cooling
>>> device leading to conflicting instructions and an erratic behavior.
>>>
>>> As the cooling-maps is about to become an optional property, let's
>>> remove the cpu cooling device map from the GPU thermal zone.
>>>
>>> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
>>> ---
>>>   arch/arm64/boot/dts/rockchip/rk3399.dtsi | 9 ---------
>>>   1 file changed, 9 deletions(-)
>>>
>>> diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>>> index 196ac9b78076..e1357e0f60f7 100644
>>> --- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>>> +++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>>> @@ -821,15 +821,6 @@
>>>   					type = "critical";
>>>   				};
>>>   			};
>>> -
>>> -			cooling-maps {
>>> -				map0 {
>>> -					trip = <&gpu_alert0>;
>>> -					cooling-device =
>>> -						<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
>>> -						<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
>>> -				};
>>> -			};
>>>   		};
>>>   	};
>>
>> my knowledge of the thermal framework is not that big, but what about the
>> rk3399-devices which further detail the cooling-maps like rk3399-gru-kevin
>> and the rk3399-nanopc-t4 with its fan-handling in the cooling-maps?
> 
> The rk3399-gru-kevin is correct.
> 
> The rk3399-nanopc-t4 is not correct because the cpu and the gpu are
> sharing the same cooling device (the fan). There are different
> configurations:
> 
> 1. The cpu cooling device for the CPU and the fan for the GPU
> 
> 2. Different trip points on the CPU thermal zone, eg. one to for the CPU
> cooling device and another one for the fan.
> 
> There are some variant for the above. If this board is not on battery,
> you may want to give priority to the throughput, so activate the fan
> first and then cool down the CPU. Or if you are on battery, you may want
> to invert the trip points.
> 
> In any case, it is not possible to share the same cooling device for
> different thermal zones.

OK, thanks for the clarification. I'll get my board set up again to 
figure out the best fix for rk3399-nanopc-t4 (FWIW most users are 
probably just using passive cooling or a plain DC fan anyway). You might 
want to raise this issue with the maintainers of 
arch/arm/boot/dts/exynos5422-odroidxu3-common.dtsi, since the 
everything-shared-by-everything approach in there was what I used as a 
reference.

Robin.

Re: [PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

[Daniel Lezcano]

On 14/06/2019 16:02, Robin Murphy wrote:
> On 14/06/2019 14:03, Daniel Lezcano wrote:
>> On 14/06/2019 11:35, Heiko Stuebner wrote:
>>> Hi Daniel,
>>>
>>> Am Dienstag, 4. Juni 2019, 18:57:57 CEST schrieb Daniel Lezcano:
>>>> Currently the common thermal zones definitions for the rk3399 assumes
>>>> multiple thermal zones are supported by the governors. This is not the
>>>> case and each thermal zone has its own governor instance acting
>>>> individually without collaboration with other governors.
>>>>
>>>> As the cooling device for the CPU and the GPU thermal zones is the
>>>> same, each governors take different decisions for the same cooling
>>>> device leading to conflicting instructions and an erratic behavior.
>>>>
>>>> As the cooling-maps is about to become an optional property, let's
>>>> remove the cpu cooling device map from the GPU thermal zone.
>>>>
>>>> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
>>>> ---
>>>>   arch/arm64/boot/dts/rockchip/rk3399.dtsi | 9 ---------
>>>>   1 file changed, 9 deletions(-)
>>>>
>>>> diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>>>> b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>>>> index 196ac9b78076..e1357e0f60f7 100644
>>>> --- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>>>> +++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>>>> @@ -821,15 +821,6 @@
>>>>                       type = "critical";
>>>>                   };
>>>>               };
>>>> -
>>>> -            cooling-maps {
>>>> -                map0 {
>>>> -                    trip = <&gpu_alert0>;
>>>> -                    cooling-device =
>>>> -                        <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
>>>> -                        <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
>>>> -                };
>>>> -            };
>>>>           };
>>>>       };
>>>
>>> my knowledge of the thermal framework is not that big, but what about
>>> the
>>> rk3399-devices which further detail the cooling-maps like
>>> rk3399-gru-kevin
>>> and the rk3399-nanopc-t4 with its fan-handling in the cooling-maps?
>>
>> The rk3399-gru-kevin is correct.
>>
>> The rk3399-nanopc-t4 is not correct because the cpu and the gpu are
>> sharing the same cooling device (the fan). There are different
>> configurations:
>>
>> 1. The cpu cooling device for the CPU and the fan for the GPU
>>
>> 2. Different trip points on the CPU thermal zone, eg. one to for the CPU
>> cooling device and another one for the fan.
>>
>> There are some variant for the above. If this board is not on battery,
>> you may want to give priority to the throughput, so activate the fan
>> first and then cool down the CPU. Or if you are on battery, you may want
>> to invert the trip points.
>>
>> In any case, it is not possible to share the same cooling device for
>> different thermal zones.
> 
> OK, thanks for the clarification. I'll get my board set up again to
> figure out the best fix for rk3399-nanopc-t4 (FWIW most users are
> probably just using passive cooling or a plain DC fan anyway). You might
> want to raise this issue with the maintainers of
> arch/arm/boot/dts/exynos5422-odroidxu3-common.dtsi, since the
> everything-shared-by-everything approach in there was what I used as a
> reference.

Cc'ed: Kukjin Kim and Krzysztof Kozlowski

Easy :)


-- 
 <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog


_______________________________________________
linux-arm-kernel mailing list
linux-arm-kernel@lists.infradead.org
http://lists.infradead.org/mailman/listinfo/linux-arm-kernel

Re: [PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

[Krzysztof Kozlowski]

On Fri, Jun 14, 2019 at 04:30:13PM +0200, Daniel Lezcano wrote:
> On 14/06/2019 16:02, Robin Murphy wrote:
> > On 14/06/2019 14:03, Daniel Lezcano wrote:
> >> On 14/06/2019 11:35, Heiko Stuebner wrote:
> >>> Hi Daniel,
> >>>
> >>> Am Dienstag, 4. Juni 2019, 18:57:57 CEST schrieb Daniel Lezcano:
> >>>> Currently the common thermal zones definitions for the rk3399 assumes
> >>>> multiple thermal zones are supported by the governors. This is not the
> >>>> case and each thermal zone has its own governor instance acting
> >>>> individually without collaboration with other governors.
> >>>>
> >>>> As the cooling device for the CPU and the GPU thermal zones is the
> >>>> same, each governors take different decisions for the same cooling
> >>>> device leading to conflicting instructions and an erratic behavior.
> >>>>
> >>>> As the cooling-maps is about to become an optional property, let's
> >>>> remove the cpu cooling device map from the GPU thermal zone.
> >>>>
> >>>> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
> >>>> ---
> >>>>   arch/arm64/boot/dts/rockchip/rk3399.dtsi | 9 ---------
> >>>>   1 file changed, 9 deletions(-)
> >>>>
> >>>> diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> >>>> b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> >>>> index 196ac9b78076..e1357e0f60f7 100644
> >>>> --- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> >>>> +++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> >>>> @@ -821,15 +821,6 @@
> >>>>                       type = "critical";
> >>>>                   };
> >>>>               };
> >>>> -
> >>>> -            cooling-maps {
> >>>> -                map0 {
> >>>> -                    trip = <&gpu_alert0>;
> >>>> -                    cooling-device =
> >>>> -                        <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> >>>> -                        <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> >>>> -                };
> >>>> -            };
> >>>>           };
> >>>>       };
> >>>
> >>> my knowledge of the thermal framework is not that big, but what about
> >>> the
> >>> rk3399-devices which further detail the cooling-maps like
> >>> rk3399-gru-kevin
> >>> and the rk3399-nanopc-t4 with its fan-handling in the cooling-maps?
> >>
> >> The rk3399-gru-kevin is correct.
> >>
> >> The rk3399-nanopc-t4 is not correct because the cpu and the gpu are
> >> sharing the same cooling device (the fan). There are different
> >> configurations:
> >>
> >> 1. The cpu cooling device for the CPU and the fan for the GPU
> >>
> >> 2. Different trip points on the CPU thermal zone, eg. one to for the CPU
> >> cooling device and another one for the fan.
> >>
> >> There are some variant for the above. If this board is not on battery,
> >> you may want to give priority to the throughput, so activate the fan
> >> first and then cool down the CPU. Or if you are on battery, you may want
> >> to invert the trip points.
> >>
> >> In any case, it is not possible to share the same cooling device for
> >> different thermal zones.
> > 
> > OK, thanks for the clarification. I'll get my board set up again to
> > figure out the best fix for rk3399-nanopc-t4 (FWIW most users are
> > probably just using passive cooling or a plain DC fan anyway). You might
> > want to raise this issue with the maintainers of
> > arch/arm/boot/dts/exynos5422-odroidxu3-common.dtsi, since the
> > everything-shared-by-everything approach in there was what I used as a
> > reference.
> 
> Cc'ed: Kukjin Kim and Krzysztof Kozlowski
> 
> Easy :)
>

Assuming that all trip-points are the same between thermal zones, I
understand that solution could be to have one thermal zone with thermal
multiple sensors (some time ago bindings did not support it) and all
cooling devices? Then only one governor would be assigned?

Best regards,
Krzysztof

Re: [PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

[Daniel Lezcano]

On 16/06/2019 11:31, Krzysztof Kozlowski wrote:
> On Fri, Jun 14, 2019 at 04:30:13PM +0200, Daniel Lezcano wrote:
>> On 14/06/2019 16:02, Robin Murphy wrote:
>>> On 14/06/2019 14:03, Daniel Lezcano wrote:
>>>> On 14/06/2019 11:35, Heiko Stuebner wrote:
>>>>> Hi Daniel,
>>>>>
>>>>> Am Dienstag, 4. Juni 2019, 18:57:57 CEST schrieb Daniel Lezcano:
>>>>>> Currently the common thermal zones definitions for the rk3399 assumes
>>>>>> multiple thermal zones are supported by the governors. This is not the
>>>>>> case and each thermal zone has its own governor instance acting
>>>>>> individually without collaboration with other governors.
>>>>>>
>>>>>> As the cooling device for the CPU and the GPU thermal zones is the
>>>>>> same, each governors take different decisions for the same cooling
>>>>>> device leading to conflicting instructions and an erratic behavior.
>>>>>>
>>>>>> As the cooling-maps is about to become an optional property, let's
>>>>>> remove the cpu cooling device map from the GPU thermal zone.
>>>>>>
>>>>>> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
>>>>>> ---
>>>>>>   arch/arm64/boot/dts/rockchip/rk3399.dtsi | 9 ---------
>>>>>>   1 file changed, 9 deletions(-)
>>>>>>
>>>>>> diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>>>>>> b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>>>>>> index 196ac9b78076..e1357e0f60f7 100644
>>>>>> --- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>>>>>> +++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>>>>>> @@ -821,15 +821,6 @@
>>>>>>                       type = "critical";
>>>>>>                   };
>>>>>>               };
>>>>>> -
>>>>>> -            cooling-maps {
>>>>>> -                map0 {
>>>>>> -                    trip = <&gpu_alert0>;
>>>>>> -                    cooling-device =
>>>>>> -                        <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
>>>>>> -                        <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
>>>>>> -                };
>>>>>> -            };
>>>>>>           };
>>>>>>       };
>>>>>
>>>>> my knowledge of the thermal framework is not that big, but what about
>>>>> the
>>>>> rk3399-devices which further detail the cooling-maps like
>>>>> rk3399-gru-kevin
>>>>> and the rk3399-nanopc-t4 with its fan-handling in the cooling-maps?
>>>>
>>>> The rk3399-gru-kevin is correct.
>>>>
>>>> The rk3399-nanopc-t4 is not correct because the cpu and the gpu are
>>>> sharing the same cooling device (the fan). There are different
>>>> configurations:
>>>>
>>>> 1. The cpu cooling device for the CPU and the fan for the GPU
>>>>
>>>> 2. Different trip points on the CPU thermal zone, eg. one to for the CPU
>>>> cooling device and another one for the fan.
>>>>
>>>> There are some variant for the above. If this board is not on battery,
>>>> you may want to give priority to the throughput, so activate the fan
>>>> first and then cool down the CPU. Or if you are on battery, you may want
>>>> to invert the trip points.
>>>>
>>>> In any case, it is not possible to share the same cooling device for
>>>> different thermal zones.
>>>
>>> OK, thanks for the clarification. I'll get my board set up again to
>>> figure out the best fix for rk3399-nanopc-t4 (FWIW most users are
>>> probably just using passive cooling or a plain DC fan anyway). You might
>>> want to raise this issue with the maintainers of
>>> arch/arm/boot/dts/exynos5422-odroidxu3-common.dtsi, since the
>>> everything-shared-by-everything approach in there was what I used as a
>>> reference.
>>
>> Cc'ed: Kukjin Kim and Krzysztof Kozlowski
>>
>> Easy :)
>>
> 
> Assuming that all trip-points are the same between thermal zones, I
> understand that solution could be to have one thermal zone with thermal
> multiple sensors (some time ago bindings did not support it) and all
> cooling devices? Then only one governor would be assigned?

The multiple sensors, multiple thermal zones and governors dealing with
different group of them is not implemented [yet]. Basically, you can
consider there is a 1:1 relationship between each of them.

 one thermal zone = one sensor = one cooling device

Given the configuration and the hardware, it would make sense to create
one thermal zone per cluster.

There is one clock line per cluster. It is possible to create two CPU
cooling devices, one for each cluster.

IMO, the fan definition is correct except it should be assigned to one
thermal zone only.

One configuration could be:

thermal-zones {
	little-thermal-zone: little-thermal-zone {
		thermal-sensors = <&tmu_cpu0 0>;
                polling-delay-passive = <250>;
                polling-delay = <0>;

		trips {
			ltz_alert0: ltz-alert-0 {
				temperature = <50000>;
				hysteresis = <5000>;
                        	type = "active";
			};

			ltz_alert1: cpu-alert-1 {
				temperature = <60000>;
				hysteresis = <5000>;
				type = "active";
			};

			ltz_alert2: ltz-alert-2 {
				temperature = <70000>;
				hysteresis = <5000>;
				type = "active";
			};

			ltz_alert3: ltz-alert-3 {
				temperature = <75000>;
				hysteresis = <10000>;
				type = "passive";
			};

			ltz_crit0: ltz-crit-0 {
				temperature = <120000>;
				hysteresis = <0>;
				type = "critical";
			};
		};

		cooling-maps {
			map0 {
				trip = <&ltz_alert0>;
				cooling-device = <&fan0 0 1>;
			};

			map1 {
				trip = <&ltz_alert1>;
				cooling-device = <&fan0 1 2>;
			};

			map2 {
				trip = <&ltz_alert2>;
				cooling-device = <&fan0 2 3>;
			};

			map3 {
				trip = <&ltz_alert3>;
				cooling-device = <&cpu0
						THERMAL_NO_LIMIT
						THERMAL_NO_LIMIT>,

						 <&cpu1
						THERMAL_NO_LIMIT
						THERMAL_NO_LIMIT>,

						 <&cpu2
						THERMAL_NO_LIMIT
						THERMAL_NO_LIMIT>,

						 <&cpu3
						THERMAL_NO_LIMIT
						THERMAL_NO_LIMIT>,
			};
		};
	};

	big-thermal-zone: big-thermal-zone {

		/* The same as little, except the sensor and the cpu
		  cooling &cpu4, &cpu5, &cpu6, &cpu7 */

	};
};


That said, the idle injection cooling device is for the moment being
developed and that would be a good opportunity to test a real per cpu
cooling device as the exynos5422 has a per core sensor.


-- 
 <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog

Re: [PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

[Daniel Lezcano]

Gentle ping ...


On 04/06/2019 18:57, Daniel Lezcano wrote:
> Currently the common thermal zones definitions for the rk3399 assumes
> multiple thermal zones are supported by the governors. This is not the
> case and each thermal zone has its own governor instance acting
> individually without collaboration with other governors.
> 
> As the cooling device for the CPU and the GPU thermal zones is the
> same, each governors take different decisions for the same cooling
> device leading to conflicting instructions and an erratic behavior.
> 
> As the cooling-maps is about to become an optional property, let's
> remove the cpu cooling device map from the GPU thermal zone.
> 
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
> ---
>  arch/arm64/boot/dts/rockchip/rk3399.dtsi | 9 ---------
>  1 file changed, 9 deletions(-)
> 
> diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> index 196ac9b78076..e1357e0f60f7 100644
> --- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> +++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> @@ -821,15 +821,6 @@
>  					type = "critical";
>  				};
>  			};
> -
> -			cooling-maps {
> -				map0 {
> -					trip = <&gpu_alert0>;
> -					cooling-device =
> -						<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> -						<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> -				};
> -			};
>  		};
>  	};
>  
> 


-- 
 <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog

Re: [PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

[Heiko Stuebner]

Am Dienstag, 4. Juni 2019, 18:57:57 CEST schrieb Daniel Lezcano:
> Currently the common thermal zones definitions for the rk3399 assumes
> multiple thermal zones are supported by the governors. This is not the
> case and each thermal zone has its own governor instance acting
> individually without collaboration with other governors.
> 
> As the cooling device for the CPU and the GPU thermal zones is the
> same, each governors take different decisions for the same cooling
> device leading to conflicting instructions and an erratic behavior.
> 
> As the cooling-maps is about to become an optional property, let's
> remove the cpu cooling device map from the GPU thermal zone.
> 
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

applied both patches for 5.3

Thanks
Heiko