From: Len Brown <lenb@kernel.org>
To: x86@kernel.org
Cc: linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
Len Brown <len.brown@intel.com>
Subject: [PATCH 10/11] thermal/x86_pkg_temp_thermal: Support multi-die/package
Date: Mon, 18 Feb 2019 22:40:12 -0500 [thread overview]
Message-ID: <1e81b76b84c572a7bfe9468d33c6fdcfbf7cf513.1550545163.git.len.brown@intel.com> (raw)
In-Reply-To: <635b2bf8b1151a191cd9299276b75791a818c0c2.1550545163.git.len.brown@intel.com>
From: Zhang Rui <rui.zhang@intel.com>
On the new dual-die/package systems, the package temperature MSR becomes
die-scope. Thus instead of one thermal zone device per physical package,
now there should be one thermal_zone for each die on these systems.
This patch introduces x86_pkg_temp_thermal support for new
dual-die/package systems.
On the hardwares that do not have multi-die, topology_die_id() equals
topology_physical_package_id(), thus there is no functional change.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
---
drivers/thermal/intel/x86_pkg_temp_thermal.c | 9 +++++----
1 file changed, 5 insertions(+), 4 deletions(-)
diff --git a/drivers/thermal/intel/x86_pkg_temp_thermal.c b/drivers/thermal/intel/x86_pkg_temp_thermal.c
index 1ef937d799e4..a2eb9136105e 100644
--- a/drivers/thermal/intel/x86_pkg_temp_thermal.c
+++ b/drivers/thermal/intel/x86_pkg_temp_thermal.c
@@ -122,7 +122,7 @@ static int pkg_temp_debugfs_init(void)
*/
static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
{
- int pkgid = topology_logical_package_id(cpu);
+ int pkgid = topology_unique_die_id(cpu);
if (pkgid >= 0 && pkgid < max_packages)
return packages[pkgid];
@@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)
static int pkg_temp_thermal_device_add(unsigned int cpu)
{
- int pkgid = topology_logical_package_id(cpu);
+ int pkgid = topology_unique_die_id(cpu);
u32 tj_max, eax, ebx, ecx, edx;
struct pkg_device *pkgdev;
int thres_count, err;
@@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
* worker will see the package anymore.
*/
if (lastcpu) {
- packages[topology_logical_package_id(cpu)] = NULL;
+ packages[topology_unique_die_id(cpu)] = NULL;
/* After this point nothing touches the MSR anymore. */
wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
@@ -511,11 +511,12 @@ MODULE_DEVICE_TABLE(x86cpu, pkg_temp_thermal_ids);
static int __init pkg_temp_thermal_init(void)
{
int ret;
+ struct cpuinfo_x86 *c = &cpu_data(0);
if (!x86_match_cpu(pkg_temp_thermal_ids))
return -ENODEV;
- max_packages = topology_max_packages();
+ max_packages = topology_max_packages() * c->x86_max_dies;
packages = kcalloc(max_packages, sizeof(struct pkg_device *),
GFP_KERNEL);
if (!packages)
--
2.18.0-rc0
next prev parent reply other threads:[~2019-02-19 3:40 UTC|newest]
Thread overview: 40+ messages / expand[flat|nested] mbox.gz Atom feed top
2019-02-19 3:40 [PATCH 0/11] multi-die/package support Len Brown
2019-02-19 3:40 ` [PATCH 01/11] x86 topology: fix doc typo Len Brown
2019-02-19 3:40 ` [PATCH 02/11] topolgy: simplify cputopology.txt formatting and wording Len Brown
[not found] ` <9108bd98-e9f4-fee3-80c7-72d540c48291@infradead.org>
2019-02-19 20:33 ` [linux-drivers-review] " Brown, Len
2019-02-19 3:40 ` [PATCH 03/11] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-02-19 16:49 ` Liang, Kan
2019-02-19 19:27 ` Brown, Len
2019-02-20 2:59 ` Like Xu
2019-02-20 6:10 ` Len Brown
2019-02-20 10:55 ` Peter Zijlstra
2019-02-20 15:08 ` Len Brown
2019-02-26 13:54 ` Peter Zijlstra
2019-02-28 15:59 ` Len Brown
2019-02-28 17:56 ` Peter Zijlstra
2019-02-24 10:04 ` Brice Goglin
2019-02-25 5:31 ` Like Xu
2019-02-25 8:08 ` Brown, Len
2019-02-19 3:40 ` [PATCH 04/11] cpu topology: export die_id Len Brown
2019-02-19 3:40 ` [PATCH 05/11] x86 topology: export die_siblings Len Brown
2019-02-19 16:56 ` Liang, Kan
2019-02-19 18:43 ` Brown, Len
2019-02-19 19:33 ` Liang, Kan
2019-02-20 10:58 ` Peter Zijlstra
2019-02-20 21:52 ` Brice Goglin
2019-02-21 7:41 ` Len Brown
2019-02-21 8:38 ` Brice Goglin
2019-02-19 3:40 ` [PATCH 06/11] x86 topology: define topology_unique_die_id() Len Brown
2019-02-19 3:40 ` [PATCH 07/11] powercap/intel_rapl: simplify rapl_find_package() Len Brown
2019-02-19 9:11 ` Rafael J. Wysocki
2019-02-19 3:40 ` [PATCH 08/11] powercap/intel_rapl: Support multi-die/package Len Brown
2019-02-19 9:10 ` Rafael J. Wysocki
2019-02-20 11:02 ` Peter Zijlstra
2019-02-21 5:44 ` Len Brown
2019-02-26 4:41 ` Len Brown
2019-02-26 6:55 ` Zhang Rui
2019-02-19 3:40 ` [PATCH 09/11] powercap/intel_rapl: update rapl domain name and debug messages Len Brown
2019-02-19 9:10 ` Rafael J. Wysocki
2019-02-19 3:40 ` Len Brown [this message]
2019-02-19 3:40 ` [PATCH 11/11] hwmon/coretemp: Support multi-die/package Len Brown
2019-02-19 16:46 ` Guenter Roeck
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