From: Len Brown <lenb@kernel.org>
To: Like Xu <like.xu@linux.intel.com>
Cc: X86 ML <x86@kernel.org>,
linux-kernel@vger.kernel.org, Len Brown <len.brown@intel.com>,
linux-doc@vger.kernel.org
Subject: Re: [PATCH 03/11] x86 topology: Add CPUID.1F multi-die/package support
Date: Wed, 20 Feb 2019 01:10:04 -0500 [thread overview]
Message-ID: <CAJvTdKm+vGmWn=U+MLW1TzxnpAFxAiJRimO=HMArNp3FX1HXYA@mail.gmail.com> (raw)
In-Reply-To: <4b9c3b83-5e45-068f-57fc-5a0e626ff0f3@linux.intel.com>
On Tue, Feb 19, 2019 at 9:59 PM Like Xu <like.xu@linux.intel.com> wrote:
> > -/* leaf 0xb sub-leaf types */
> > +/* extended topology sub-leaf types */
> > #define INVALID_TYPE 0
> > #define SMT_TYPE 1
> > #define CORE_TYPE 2
> > +#define DIE_TYPE 5
>
> This patch set is going to export die topology via sysfs
> while the extended topology sub-leaf type could be one of followings:
> SMT/Core/Module/Tile/Die according to CPUID.1F from SDM.
>
> Why not choose to export module/tile topology as well?
Excellent question. (and thank you for reading the SDM:-)
While it is true that there are shipping products with
software-visible CPU modules and tiles,
they shipped before this mechanism was available. As a result, there
are currently zero
products that use this mechanism to enumerate modules and tiles. If
future products
have software-visible modules and tiles, and they choose to use this mechanism,
we can add support for them. But I do not advocate adding code to the kernel
"just in case".
In contrast, the need to support multi-die/package products as soon as
possible is quite clear.
thanks,
Len Brown, Intel Open Source Technology Center
next prev parent reply other threads:[~2019-02-20 6:10 UTC|newest]
Thread overview: 40+ messages / expand[flat|nested] mbox.gz Atom feed top
2019-02-19 3:40 [PATCH 0/11] multi-die/package support Len Brown
2019-02-19 3:40 ` [PATCH 01/11] x86 topology: fix doc typo Len Brown
2019-02-19 3:40 ` [PATCH 02/11] topolgy: simplify cputopology.txt formatting and wording Len Brown
[not found] ` <9108bd98-e9f4-fee3-80c7-72d540c48291@infradead.org>
2019-02-19 20:33 ` [linux-drivers-review] " Brown, Len
2019-02-19 3:40 ` [PATCH 03/11] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-02-19 16:49 ` Liang, Kan
2019-02-19 19:27 ` Brown, Len
2019-02-20 2:59 ` Like Xu
2019-02-20 6:10 ` Len Brown [this message]
2019-02-20 10:55 ` Peter Zijlstra
2019-02-20 15:08 ` Len Brown
2019-02-26 13:54 ` Peter Zijlstra
2019-02-28 15:59 ` Len Brown
2019-02-28 17:56 ` Peter Zijlstra
2019-02-24 10:04 ` Brice Goglin
2019-02-25 5:31 ` Like Xu
2019-02-25 8:08 ` Brown, Len
2019-02-19 3:40 ` [PATCH 04/11] cpu topology: export die_id Len Brown
2019-02-19 3:40 ` [PATCH 05/11] x86 topology: export die_siblings Len Brown
2019-02-19 16:56 ` Liang, Kan
2019-02-19 18:43 ` Brown, Len
2019-02-19 19:33 ` Liang, Kan
2019-02-20 10:58 ` Peter Zijlstra
2019-02-20 21:52 ` Brice Goglin
2019-02-21 7:41 ` Len Brown
2019-02-21 8:38 ` Brice Goglin
2019-02-19 3:40 ` [PATCH 06/11] x86 topology: define topology_unique_die_id() Len Brown
2019-02-19 3:40 ` [PATCH 07/11] powercap/intel_rapl: simplify rapl_find_package() Len Brown
2019-02-19 9:11 ` Rafael J. Wysocki
2019-02-19 3:40 ` [PATCH 08/11] powercap/intel_rapl: Support multi-die/package Len Brown
2019-02-19 9:10 ` Rafael J. Wysocki
2019-02-20 11:02 ` Peter Zijlstra
2019-02-21 5:44 ` Len Brown
2019-02-26 4:41 ` Len Brown
2019-02-26 6:55 ` Zhang Rui
2019-02-19 3:40 ` [PATCH 09/11] powercap/intel_rapl: update rapl domain name and debug messages Len Brown
2019-02-19 9:10 ` Rafael J. Wysocki
2019-02-19 3:40 ` [PATCH 10/11] thermal/x86_pkg_temp_thermal: Support multi-die/package Len Brown
2019-02-19 3:40 ` [PATCH 11/11] hwmon/coretemp: " Len Brown
2019-02-19 16:46 ` Guenter Roeck
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