Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model

From: Punit Agrawal <punit.agrawal@arm.com>
To: Viresh Kumar <viresh.kumar@linaro.org>
Cc: Dawei Chien <dawei.chien@mediatek.com>,
	"Rafael J. Wysocki" <rjw@rjwysocki.net>,
	Rob Herring <robh+dt@kernel.org>, Pawel Moll <pawel.moll@arm.com>,
	Mark Rutland <mark.rutland@arm.com>,
	Ian Campbell <ijc+devicetree@hellion.org.uk>,
	Kumar Gala <galak@codeaurora.org>,
	Matthias Brugger <matthias.bgg@gmail.com>,
	Daniel Kurtz <djkurtz@chromium.org>,
	Sascha Hauer <s.hauer@pengutronix.de>,
	Daniel Lezcano <daniel.lezcano@linaro.org>,
	devicetree@vger.kernel.org, linux-arm-kernel@lists.infradead.org,
	linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org,
	linux-mediatek@lists.infradead.org, srv_heupstream@mediatek.com,
	Sascha Hauer <kernel@pengutronix.de>
Subject: Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model
Date: Mon, 02 Nov 2015 15:53:33 +0000	[thread overview]
Message-ID: <9hh4mh4bdoi.fsf@e105922-lin.cambridge.arm.com> (raw)
In-Reply-To: <20151028154449.GH3716@ubuntu> (Viresh Kumar's message of "Wed, 28 Oct 2015 21:14:49 +0530")

Viresh Kumar <viresh.kumar@linaro.org> writes:

> On 22-10-15, 20:02, Dawei Chien wrote:
>> Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone.
>> The power allocator governor allocates power budget to control CPU temperature.
>> 
>> Power Allocator governor is able to keep SOC temperature within a
>> defined temperature range to avoid SOC overheat and keep it's
>> performance. mt8173-cpufreq.c need to register its' own power model
>> with power allocator thermal governor, so that power allocator
>> governor can allocates suitable power budget to control CPU
>> temperature.
>> 
>> PATCH1 is base on
>> https://patchwork.kernel.org/patch/7034601/
>> 
>> PATCH2 is base on Sascha's thermal driver V9
>> https://patchwork.kernel.org/patch/7249821/
>> https://patchwork.kernel.org/patch/7249861/
>> https://patchwork.kernel.org/patch/7249891/
>> 
>> Change since V1:
>> include mt8171.h and sort header file for mt8173.dtsi
>> 
>> Change since V2:
>> Move dynamic/static power model in device tree
>> 
>> Dawei.Chien (2):
>>   thermal: mediatek: Add cpu power cooling model.
>>   arm64: dts: mt8173: Add thermal zone node for mt8173.
>
> Sorry for being extremely late in reviewing this stuff. You are
> already on v3 and I haven't reviewed it once. Mostly due to bad timing
> of my holidays and other work pressure.
>
> Now, there are few things that I feel are not properly addressed here,
> and I may be wrong:
> - Where are the bindings for static-power-points and
>   dynamic-power-coefficient. Sorry I failed to see them in this or
>   other series you mentioned.

For dynamic power, I had posted some patches[0][1][2] introducing the
binding as well as updating cooling device registration via cpufreq
driver. Now that the SCPI hwmon driver is merged, I should re-send the
remaining patches.

[0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html
[1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html
[3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html

> - Even then, why should we be adding another table into DT for
>   voltage/power ? And not reuse and extend the opp-v2 stuff which is
>   already mainlined now.
> - There are few issues with the code as well, but I want to see where
>   the bindings should go first. And then only discuss the code
>   further.